ABSTRACTElectron backscatter diffraction (EBSD) and X-ray diffraction line profile analysis (XLPA) methods are suitable to determine dislocation densities within crystalline structures. A software was developed to obtain dislocation density from misorientations measured between the adjacent points by EBSD. However, this EBSD-based method can estimate only the density of geometrically necessary dislocations (GND), while XLPA method can give the total dislocation (TD) density. In this paper, GND densities are determined and compared them to the TD densities in as-received and severe plastic deformed copper samples. Based on these results, estimations are tested to provide reliable GND densities and to appreciate the applicability of this calculation method. Furthermore, correlations are found between TD densities and yield strengths estimated by hardness tests.