Coherence Scanning Interferometry Research Articles

Coherence scanning interferometry: measurement and correction of three-dimensional transfer and point-spread characteristics

When applied to the measurement of smooth surfaces, coherence scanning interferometry can be described by a three-dimensional linear filtering operation that is characterized either by the point-spread function in the space domain or equivalently by the transfer function (TF) in the spatial frequency domain. For an ideal, aberration-free instrument, these characteristics are defined uniquely by the numerical aperture of the objective lens and the bandwidth of the illumination source. In practice, however, physical imperfections such as those in lens aberrations, reference focus, and source alignment mean that the instrument performance is not ideal. Currently, these imperfections often go unnoticed as the instrument performance is typically only verified using rectilinear artifacts such as step heights and lateral grids. If an object of varying slope is measured, however, significant errors are often observed as the surface gradient increases. In this paper, a new method of calibration and adjustment using a silica micro-sphere as a calibration artifact is introduced. The silica microsphere was used to compute the point-spread and TF characteristics of the instrument, and the effect of these characteristics on instrument performance is discussed. Finally, a straightforward method to correct for phase and amplitude imperfections in the TF is described using a modified inverse filter.

Sub-sampling low coherence scanning interferometry and its application: refractive index measurements of a silicon wafer

In this investigation, refractive indices of a silicon (Si) wafer were measured by low-coherence scanning interferometry adopting the sub-sampling technique to reduce measurement time. Based on Fourier domain analysis method, the sub-sampled correlogram was analyzed and the refractive indices were calculated by the simple refractive index model and curve fitting of the phase extracted from the sub-sampled correlogram. In the experiment to verify the proposed technique, near-infrared light emitted by a super-luminescent diode with 1050nm center wavelength was used as an optical source because it is partially transparent to an undoped Si wafer. As the result of measuring an undoped double-side polished Si wafer, group and phase refractive indices were successfully obtained with the sub-sampled correlogram, and the deviations from the reference value were within 0.001.

Low cost wafer metrology using a NIR low coherence interferometry

In this investigation, a low cost Si wafer metrology system based on low coherence interferometry using NIR light is proposed and verified. The whole system consists of two low coherence interferometric principles: low coherence scanning interferometry (LCSI) for measuring surface profiles and spectrally-resolved interferometry (SRI) to obtain the nominal optical thickness of the double-sided polished Si wafer. The combination of two techniques can reduce the measurement time and give adequate dimensional information of the Si wafer. The wavelength of the optical source is around 1 μm, for which transmission is non-zero for undoped silicon and can be also detected by a typical CCD camera. Because of the typical CCD camera, the whole system can be constructed inexpensively.

Coherence scanning interferometry: linear theory of surface measurement

The characterization of imaging methods as three-dimensional (3D) linear filtering operations provides a useful way to compare the 3D performance of optical surface topography measuring instruments, such as coherence scanning interferometry, confocal and structured light microscopy. In this way, the imaging system is defined in terms of the point spread function in the space domain or equivalently by the transfer function in the spatial frequency domain. The derivation of these characteristics usually involves making the Born approximation, which is strictly only applicable to weakly scattering objects; however, for the case of surface scattering, the system is linear if multiple scattering is assumed to be negligible and the Kirchhoff approximation is assumed. A difference between the filter characteristics derived in each case is found. However this paper discusses these differences and explains the equivalence of the two approaches when applied to a weakly scattering object.

Surface topographic characterization for polyamide composite injection molds made of aluminum and copper alloys

In order to ensure flexibility and rapid new product development, the mold industry made use of soft materials for cavity inserts in injection molds. However, materials of this kind are prone to wear. This article analyzes the topographic characterization of the surface and wear processes in injection molds cavities. Two materials have been used to produce the cavities: aluminum alloy EN AW‐6082 T4 and copper alloy Cu Zn39 Pb3. The surface topography was measured with the use of optical interferometry profiling technology; roughness and surface parameters were determined according to ISO 4287, ISO 25178, and EUR 15178N. In order to complete this research, an experimental part with different thicknesses and shapes was designed, and cavity inserts of aluminum and copper were made. Polyamide PA6, with 30% fiberglass reinforcement, was employed in the experimental procedure. Measurements of cavity mold surfaces were performed after 9,200 cycles on each mold and at different locations on the mold. The surface measurement was made with a white light vertical scanning interferometry, also known as coherence scanning interferometry (ISO DIS 25178‐604). The results are analyzed and differences between the two types of cavity inserts materials are discussed.

Correction for lateral distortion in coherence scanning interferometry

For a complete calibration of optical surface topography measuring instruments, which encompass their ability to measure slope and curvature, a determination of their optical transfer function is required. Errors induced by non-linearity of the scales of the instrument can affect their shift invariant properties, which in turn affect their transfer function. The non-linearity can be caused by distortion produced by the quality of the optical setup. A method to develop a correction model that combines a simple model of optical distortion with error separation techniques is discussed. Experimental tests of the method are presented and measurement uncertainties are investigated.

Angle-resolved three-dimensional analysis of surface films by coherence scanning interferometry

The Fourier components of interference signals generated by scanning a high-numerical-aperture objective orthogonal to an object surface correspond to different angles of incidence on the surface. The phase and amplitude of these Fourier components relate to the structure of the object, including in particular the 3D topography and thickness profiles of thin-film layers.

Fast Coherence Scanning Interferometry for Measuring Smooth, Rough and Spherical Surfaces

Abstract Coherence scanning interferometry is a useful instrument for measuring the geometry of a wide range of surfaces with high resolution. By introducing two objectives with a high numerical aperture in both arms of a Michelson interferometer it is possible to investigate spherical and aspherical surfaces. In addition to classical interferometry, the method can be applied to smooth, rough or separated surfaces.