A mechanism is presented to explain the formation of transcrystalline cleavage cracks during the etching of brittle annealed chromium. The mechanism proposed is the formation of a face‐centered‐cubic chromium hydride on the surface which, due to its larger volume, initiates cracks in the brittle material beneath. These cracks may then propagate by a stress corrosion mechanism. Room temperature ductile material appears to be capable of taking up this volume expansion without cracks being initiated. X‐ray data confirm the existence of the face‐centered‐cubic hydride.