Platinum (Pt) is widely used as insoluble and catalytic electrodes for electrolysis, automotive catalytic converters, and fuel cells. We have been investigating hydrogen incorporation in electrodeposited metal films and its influence on crystal structure of metals (1-3). It was reported that large amount of hydrogen (content in atomic ratio: x = H/Pt = 0.1) is incorporated in the Pt films electrodeposited from a solution including dinitrosulfatoplatinate(II) (H2Pt(NO2)2SO4, DNS) as a metal source. In this study, an electrochemical quartz crystal microbalance (EQCM) method (4) is used to examine influence of hydrogen adsorption on the electrodeposition and hydrogen incorporation into deposited films of Pt from a chloro complex solution. The current-potential and mass increase (Pt deposition rate)-potential curves in 0.024 mol dm-3 K2PtCl4solution adjusted at pH of 0.8 with HCl were measured using an EQCM system (Hokuto Denko, HQ-101D and HZ-5000). A quartz electrode coated with Au, an Ag/AgCl electrode, and a Pt wire were used as the working, reference, and counter electrodes, respectively. The hydrogen content of samples was measured by thermal desorption spectroscopy (TDS). Figure 1 shows the current density and mass increase rate versus electrode potential curves for the chloro complex solution. In the first forward potential sweep toward negative potentials of Fig. 1(a), the cathode current and deposition rate of Pt started increasing at +0.3 V vs. Ag/AgCl. Peaks for cathode current and deposition rate appeared at -0.19 V. The current efficiency was 74% at this peak. Then, as the potential was swept to lower potentials, the deposition rate and current efficiency decreased. This decrease in the current efficiency of Pt deposition is caused by hydrogen adsorption. In the return potential sweep (Fig.1 (b)), the cathode current and Pt deposition steeply increased by hydrogen desorption from the Pt surface, and the current efficiency was 113% at the potential of -0.25 V. The hydrogen content of Pt-electrodeposited Au foil (Pt: 1 μm and Au: 20 μm in thickness) increased as the deposition potential of Pt decreased from 0 to -0.3 V, and was much lower than that deposited from the DNS solution. Acknowledgements The present work was partly supported by JSPS KAKENHI (26289276). References N. Fukumuro, M. Yokota, S. Yae, H. Matsuda, Y. Fukai, J. Alloys Compd., 580, S55 (2013). N. Fukumuro, S. Kojima, M. Fujino, Y. Mizuta, T. Maruo, S. Yae, Y. Fukai, J. Alloys Compd., 645, S404 (2015). N. Hisanaga, N. Fukumuro, S. Yae, H. Matsuda, ECS Trans., 50, 77 (2013). T. Hagihara, K. Yaori, K. Iwakura, N, Fukumuro, S. Yae, Electrochim. Acta, 176, 65 (2015). Figure 1