Chip Material Research Articles

Effects of die top system and trenches on large thin die mechanical robustness

Abstract Power MOSFET dies in the automotive industry are becoming larger (> 5 x 5 mm) and thinner (< 50 µm) to meet high-performance and lifetime requirements. Ensuring the mechanical robustness of these large ultrathin chips is crucial for reliable electronic devices and high-throughput packaging processes. The high aspect ratio and advanced chip designs incorporating trench technology present significant challenges in semiconductor assembly, packaging, and testing. This paper introduces an experimental front-end strategy aimed at strengthening the front side of large ultrathin dies using various die-top systems. Industry-equivalent 50 µm thick dummy power MOSFET dies were fabricated to evaluate the efficacy of different chip designs and materials, such as polyimide, in mitigating fracture risks. Fabrication-induced stresses and warpage in the device layers were measured using a thin-film stress measurement tool. Additionally, the frontside strength of the ultrathin dies was assessed using the three-point bending method, with the resulting data analyzed via two-parameter Weibull distribution plots. Results demonstrated that the deposition of 5 µm polyimide (PI) on the nitride die topside significantly increased die strength from 339 MPa to 760 MPa, with 5 µm PI proving more effective for die strengthening than 10 µm. The interaction between the metal-trench layer and the die was found to be critical to the robustness of ultrathin dies, influenced by the pattern and layout of the trenches. Die-top metallization designs, such as meandering patterns, showed promising improvements in die strength compared to standard designs. A proposed chip layout aims to maximize polyimide coverage for clip-bonded products on the die topside, leveraging its strengthening effect. The study also demonstrated that dummy reference chips can facilitate rapid and straightforward evaluation of extensive design experiments to identify robust chip designs.

Analysis of Machining a Sinter-Hardened Powder Metallurgy Steel: Significance of Localized Densification of Uncut Chip Material during Chip Formation

Analysis of Machining a Sinter-Hardened Powder Metallurgy Steel: Significance of Localized Densification of Uncut Chip Material during Chip Formation

Effect of Etching Methods on Dielectric Losses in Transmons

Superconducting qubits are considered as a promising platform for implementing a fault tolerant quantum computing. However, surface defects of superconductors and the substrate leading to qubit state decoherence and fluctuations in qubit parameters constitute a significant problem. The amount and type of defects depend both on the chip materials and fabrication procedure. In this work, transmons produced by two different methods of aluminum etching: wet etching in a solution of weak acids and dry etching using a chlorine-based plasma are experimentally studied. The relaxation and coherence times for dry-etched qubits are more than twice as long as those for wet-etched ones. Additionally, the analysis of time fluctuations of qubit frequencies and relaxation times, which is an effective method to identify the dominant dielectric loss mechanisms, i-ndicates a significantly lower impact of two-level systems in the dry-etched qubits compared to the wet-etched ones.

Experimental Investigation and Numerical Analysis Regarding the Influence of Cutting Parameters on the Asphalt Milling Process.

Abrasion wear is a significant concern for cutting tools, particularly when milling asphalt concrete due to the presence of hard mineral aggregate particles. The pressure exerted on the cutting tool by the chipped material and the resulting cutting forces directly influence tool wear. To estimate the cutting forces in asphalt milling, the authors propose using either laboratory experiments or cost-effective Discrete Element Method (DEM) modeling-by simulating the real conditions-as direct measurement under real conditions is challenging. This article presents results from an original experimental program aimed at determining the cutting forces during asphalt pavement milling. A specialized stand equipped with a moving plate and recording devices was designed to vary milling depth, rotational speed, and advance speed. The experimental results for horizontal force values were compared with numerical results from DEM modeling. It was found that both increasing the milling depth and the advance speed lead to higher cutting forces. Generally, DEM modeling trends align with experimental results, although DEM values are generally higher. The statistical analysis allowed identification of the milling depth as the most significant parameter influencing cutting force and the optimal combination of milling parameters to achieve minimum horizontal force acting on cutting tooth, namely, 15 mm milling depth and 190 mm/min advanced speed.

Folsom obsidian conveyance at the Great Divide Paleoindian sites, Wyoming

We present a study of obsidian artifacts found in Folsom contexts from the Great Divide Paleoindian sites (Great Divide Basin, Wyoming) to evaluate Paleoindian mobility patterns in the central and southern Rocky Mountains. Obsidian sourcing using pXRF demonstrates conveyance from Obsidian Cliff (400 km), Teton Pass (300 km), and the Green River/Engineer Quarry source. Other chipped stone raw materials from Folsom localities derive from sources in the upper Green River Basin, thus partially establishing a Folsom mobility pattern between the Yellowstone Plateau, upper Green River Basin, and Great Divide Basin of Wyoming. This study supports the notion that Paleoindians regularly transported lithic raw materials great distances even in relatively raw material rich regions like the interior of the Rocky Mountains and is further evidence for a sparsely documented Younger Dryas-aged use of the Yellowstone Plateau.

Stek Pucuk Kentang (Solanum tuberosum L.) Kultivar IPB CP1 Dapat Menghasilkan Umbi G0 di Dalam Rumah Kaca dan Rumah Kasa di Dataran Menengah

IPB CP1 potato is a raw material for potato chips. The advantage of IPB CP1 potatoes is their high yield. Challenges in potato production are limited areas with optimal altitude and condition as well as low quality and quantity of seeds. Utilizing a mid-altitude area for potato cultivation is one of the solutions to increase potato seed production. This study aimed to compare the growth and production of IPB CP1 G0 seed tuber in a greenhouse and screenhouse in mid-altitude with different numbers of shoot cuttings per polybag. This research was conducted with two factors. The first factor is the use of growth plant houses, i.e. greenhouse and screenhouse. The second factor is the number of shoot cuttings per polybag, i.e. 2 and 3 shoot cuttings per polybag. Growth parameters observed included plant height, number of nodes and leaves, and fresh and dry weight of shoots. The production parameters observed included the number as well as fresh and dry weight of tubers. The growth and production of IPB CP1 potatoes grown in the greenhouse were better than those grown in the screenhouse. The number of cuttings per polybag did not affect the growth and production of IPB CP1 potato.

Grinding performance investigation of multidirectional CF/PEEK composites—A comparative with unidirectional CF/PEEK

AbstractTo distinguish the grinding performance of the multidirectional (MD) and unidirectional (UD) carbon fiber‐reinforced thermoplastic (CFRTP) composites, MD and UD carbon fiber‐reinforced poly‐etherether‐ketone (CF/PEEK) composites were employed in this study. Different ply stacking sequences and process parameters were set for grinding experiments. Subsequently, the surface morphologies and roughness were observed and measured. Experimental results indicated that the variations of grinding forces with grinding parameters of MD‐CF/PEEK and UD‐CF/PEEK were consistent. However, the heat transfer mechanism and the effects of grinding parameters on the maximum grinding temperatures were different between the two composites. The grinding forces and temperatures of MD‐CF/PEEK were slightly lower than UD‐CF/PEEK, and MD‐CF/PEEK reached better surface quality under the same parameters, indicating that the grinding performance of MD‐CF/PEEK was not the simple superposition of UD‐CF/PEEK. In addition, the chip formation and material removal mechanism of CF/PEEK were investigated. The grinding performance of MD‐CF/PEEK was primarily dependent on the θ elements of laminate while the grinding performance of UD‐CF/PEEK was closely related to the fiber orientation angles during grinding. This study established a more in‐depth understanding into the grinding performance of MD‐CF/PEEK and provided technical guidance for high‐quality grinding of CFRTP.Highlights The grinding performance of the multidirectional (MD) and unidirectional (UD) carbon fiber‐reinforced poly‐etherether‐ketone (CF/PEEK) is compared. The grinding forces and temperatures of MD‐CF/PEEK are slightly lower than that of UD‐CF/PEEK, and the MD‐CF/PEEK reach a better surface quality under the same grinding parameters. The grinding performance of MD‐CF/PEEK is primarily dependent on the θ elements of laminate, and the change of layering order is not a critical factor. The grinding performance of UD‐CF/PEEK is closely related to the fiber orientation angles during the grinding process. The surface quality of MD‐CFRTP can be effectively improved by reducing the grinding depth and feed speed, and increasing the grinding wheel speed.

Supply Chain Priority Strategy and Added Value of Jackfruit in Tambang Sub-District, Kampar District, Riau Province

This research aimed to a) identify the flow of the jackfruit supply chain; b) obtain the added value of the jackfruit chips agroindustry; c) analyze the level of efficiency of the jackfruit chips agroindustry; d) formulate strategies and determine strategic priorities for increasing the supply chain and added value of jackfruit. The methods used in this research are both qualitative and quantitative. The research stage starts by analyzing the jackfruit supply chain using a framework of the food supply chain network (FSCN), calculating the added value of chips in the jackfruit chips agroindustry using the Hayami method and analyzing the level of efficiency of the jackfruit chips agroindustry. The researchers then formulate a strategy using SWOT and select priority strategies using the method of analytical hierarchy process (AHP). The research results showed that the supply chain structure consists of two structures, namely structure 1 (supplier-jackfruit chips agroindustry-consumer) and structure 2 (supplier-jackfruit chips agroindustry-retail-consumer). The flow of goods occurs from suppliers to consumers, the flow of money from consumers to suppliers, and the flow of information from suppliers to consumers and vice versa. The calculation of added value obtained from micro, small, and medium enterprises (SMEs) in Sinar Hidayah was IDR 8,198.71/kg, Usaha Baru Ibu was IDR 13,960.58/kg, and Restu was IDR 4,718.75/kg. The R/C ratio in SME Sinar Hidayah is 1.72, Usaha Baru Ibu is 2.42, and Restu is 1.26. Based on the results of the strategy formulation, the priority strategy was obtained, namely expanding the raw material and marketing network for jackfruit chips with a weight of 0.331, and the selected criteria was logistics with a weight of 0.322.

In-situ test of full field deformation and chip formation mechanism during machining of Ti2AlNb intermetallic with digital image correlation method

Ti2AlNb intermetallic, as a relatively new high temperature-resistant structural material, belongs to typical difficult-to-machine material due to its excellent mechanical properties. This paper aims to investigate the dynamic deformation behavior in chip shear deformation zone and associated chip formation mechanism during the machining of Ti2AlNb intermetallic. A specialized cutting platform combined with a high speed imaging system is developed to realize in-situ detection of full field deformation and corresponding signal processing during the machining process. The high speed imaging system can capture in-situ material deformation images with a frequency of 100 kHz during cutting process while the digital image correlation method is adopted to characterize chip dynamic deformation signals quantitatively. A series of orthogonal cutting experiments for Ti2AlNb is conducted at different cutting depths and cutting speeds, based on which the influences of cutting parameters on chip morphologies and material removal process are studied. The distribution of material flowing velocity, as well as the strain rate fields within shear deformation zone in chip removal process of Ti2AlNb are analyzed. Finally, the formation mechanism of periodic built-up edge formed in the cutting speed range of 60–120 m·min−1 is elucidated.

Interface thermal conductance and phonon thermal transport characteristics of diamond/carbon nanotube interface

<sec>Diamond, an ultra-wide band gap semiconductor material, is an ideal material for high-power, high-frequency, high-temperature, and low-power loss electronic devices. However, high-frequency and high-power working environment leads to ultra-high local hot spots. Thermal interface material (TIM) is urgently needed to improve interface heat dissipation. Carbon nanotube (CNT), a brand-new generation of TIM, has ultra-high thermal conductivity (6000 W/(m·K)) and is expected to solve the heat dissipation problem of diamond semiconductor.</sec><sec>Based on this, we first propose to combine diamond and CNT to improve the performance and stability of semiconductor device, reduce packaging size, and achieve miniaturized design of devices. Here we use reverse non-equilibrium molecular dynamics (RNEMD) method to study the thermal transport characteristics and interface thermal conductance (ITC) at the diamond/CNT interface. The results reveal that increasing CNT layers enhances the overall vibration density of states (VDOS) of CNT and shifts the peak value towards the low frequency band, which is more conducive to interface heat transfer. Alternatively, the enhancement of the phonon overlap energy strengthens the coupling vibration of phonon and thus improving the efficiency of the interfacial heat transfer. Moreover, in a certain range, the increase of system temperature and CNT length-to-diameter ratio can raise the cutoff frequency of the VDOS of diamond and CNT near the interface and the peak value of the low frequency band. This further improves the coupling vibration of phonon on both sides. Finally, by orthogonal test simulation, the optimal value of ITC is determined to be 2.65 GW/(m<sup>2</sup>·K) when the temperature, chirality, layers and length are 900 K, (6, 6), 6 layers and 5 nm respectively. This result greatly exceeds the current ITC of general semiconductors/metal. Compared with general composite materials, diamond/CNT composite material has great potential to enhance heat dissipation. Furthermore, according to P-value test, the number of layers has an extremely significant influence on interfacial thermal transport, while the influence of length, temperature and diameter decrease in turn.</sec><sec>This work provides insights into optimizing heat transport at diamond/carbon nanotube interface and will be beneficial for device thermal management and chip material design.</sec>

Difficulties in Semiconductor Materials Analysis and Research in China

The semiconductor industry is an important support for the rapid development of the modern electronic information society, so it is important to address the depth and breadth of semiconductor research. This paper classifies and analyzes semiconductors at the chemical level, emphasizes the difficulties faced by the Chinese semiconductor market, and analyzes the semiconductor market, core tools, basic units, software design, and raw materials. Finally compared to the U.S. semiconductor market and technology, for China's status quo from the chip design and material selection point of view puts forward specific aspects can be improved, can be from zinc oxide, new silicon compounds, gallium compounds, and superlattices and one-dimensional microstructures of these four kinds of materials to make specific improvements. It is conducive to mastering the characteristics of market and industry transformation and laying a solid foundation for the development of electronic science and technology, which will help China to gain an advantageous position in the international scientific and technological competition.

The Utilization of Pangas Catfish Fish Skin (Pangasius pangasius) in Making Skin Chips

Catfish is a popular freshwater fish and is in great demand as a consumption fish because catfish meat has a delicious taste and is quite high in calories and protein. Catfish skin as a by-product of fillet production can be used as raw material for processing chips. This research aims to determine the effect of soaking ingredients on the physical and chemical characteristics of catfish skin chips. This research was carried out by making catfish skin chips through the process of first washing, first soaking with soaking materials, second washing, second soaking in spices, drying, cutting, frying, and packed. The treatment in this research is the soaking material (in the first soaking) used. There were 4 treatments with different soaking ingredients, including: P0 (control), P1 (lime), P2 (acetic acid/vinegar), and P3 (palm vinegar). After the skin chips with the 4 treatments have been produced, quality testing is carried out on the product. Tests were carried out on yield, consumer acceptability through hedonic testing, physical characteristics of skin chips through analysis of crispness, efflorescence and oil absorption, chemical characteristics through proximate analysis, and microbial contamination through ALT analysis. Treatment P1 is known to have the highest yield, crispness, oil absorption capacity, and efflorescence ability among other treatments. Next, the products tested for chemical content are selected based on the treatment that obtains the highest level of consumer acceptance. Based on hedonic testing, it is known that P1 is the treatment most sought after by consumers. From the results of the chemical analysis that has been carried out, the ash content and protein content of fish skin chips in P1 is higher than P0, but has a lower water content than P0. The Total Plate Number (ALT) value for each catfish skin chips parameter exceeds the standard limit of SNI 7388:2009, namely 5x105 CFU/g.

Enhancement of hydrogen production via optimizing micro-structures of electrolyzer on a microfluidic platform

Electrochemical water splitting plays a vital role for production of hydrogen (H2). Enhancing the rate of hydrogen separation from the electrode is crucial for improving the performance of water electrolyzers. The water electrolyzers often encounter issues such as air bubble adhesion to the electrode plate, leading to increased electrical resistance, reduced current density, and thus lower hydrogen generation rates. In addition, the compact configuration of electrolyzer and non-transparent electrode plates make it impracticable to observe and analyze the gas-liquid two-phase flow between the anode and cathode plates. Hence, a methodology is in high demand to experimentally investigate the two-phase flow within the electrolyzer, which could be further used to guide the design and optimization of the electrolyzer. In this work, we propose to utilize a microfluidic system as a phantom of electrolyzer. The transparent material of the microfluidic chip allows optical inspection and measurement of the two-phase flow. Specifically, we propose to optimize the two-phase flow by manipulating the micro-structure of the flow, which has been theoretically and experimentally demonstrated to effectively remove the gas bubbles attached to the wall and consequently enhance the hydrogen production rate. The dimensions of the proposed micro-structures can be potentially extended and applied to industrial electrolyzers according to the principle of similarity.

Effect of glycerin as a plasticizer on flexural strength in the fabrication of gypsum-based chip

Background: Ceramic-based drug delivery systems has received significant attention in both medical and material domains. This study used gypsum as a base material for drug delivery chips, which has the potential to replace existing materials such as collagen and gelatin. The choice of gypsum as a material was based on a unique combination of osteoconductive, bioresorbable, and biodegradable characteristics. Methods: In this study, glycerin was added to distilled water at different concentrations (5%, 10%, 15%, 20%, and 25%) to increase the flexibility of gypsum. Calcium Sulfate Hemihydrate powder was then combined with a mixed solution of water and glycerin and stirred. The mixture was then placed in an acrylic mold measuring 25 x 3 x 1.5 mm and allowed to dry for 24 hours at room temperature. After that, the specimen was analyzed to determine flexural strength using the Universal Testing Machine with a three-point bending method at a crosshead speed of 0.5 mm/min. Results: Statistical analysis revealed that the inclusion of glycerin led to an increase in the percentage of strain. However, it has been observed that the mechanical strength of gypsum chips shows a proportional decrease with increasing glycerin concentration. Conclusions: It can be concluded that the addition of glycerin into the gypsum chip can increase the elasticity of the chip even though the flexural strength is reduced.

Applications of Polymethylhydrosiloxane (PMHS) in Organic Synthesis- Covering up to March 2022

Abstract: Based on the type of metal or non-metal catalyst used, the authors of this paper have clearly highlighted the different applications of air-stable, commercially viable, and environmentally friendly polymethylhydrosiloxane (PMHS) in organic synthesis or other allied reactions. The importance of PMHS was emphasised for the particular organic transformation's success. In addition to its wellknown use as a reducing agent, it has also been demonstrated in a variety of other applications, including ring cleavage, the cotton industry, functional material for microfluidic chips, and the dehydroaromatization of bio-oils. The article tries to compile the most noteworthy cases of highly successful PMHS catalysis over the past two decades or so.

Laser induced fluorescence technology for early detection of diabetes via optical fiber microfluidic sensor

This research explores the use of direct write laser technology to reduce manufacturing costs and time by using Polymethyl methacrylate (PMMA) sheet. The process has a maximum channel width of 208 µm for zigzag channels and 205.66 µm for straight channels, limiting droplet miniaturization. Microfluidics technology offers potential for creating graphene, glucose, and rhodamine B biosensor devices for various applications. Combining these materials offers benefits like miniaturization, reduced response time and chemical consumption, and improved device reproducibility and sensitivity. The study also highlights advancements in chip materials, device assembly, and material preparation for graphene-based microfluidic sensors. The findings show that optical fiber microfluidic biosensor devices have higher spectral resolution than traditional fluorescence spectrometers, enabling precise identification of mixture components and fluorescence enhancement analyses.

Stearic Acid as an Atomic Layer Deposition Inhibitor: Spectroscopic Insights from AFM-IR.

Modern-day chip manufacturing requires precision in placing chip materials on complex and patterned structures. Area-selective atomic layer deposition (AS-ALD) is a self-aligned manufacturing technique with high precision and control, which offers cost effectiveness compared to the traditional patterning techniques. Self-assembled monolayers (SAMs) have been explored as an avenue for realizing AS-ALD, wherein surface-active sites are modified in a specific pattern via SAMs that are inert to metal deposition, enabling ALD nucleation on the substrate selectively. However, key limitations have limited the potential of AS-ALD as a patterning method. The choice of molecules for ALD blocking SAMs is sparse; furthermore, deficiency in the proper understanding of the SAM chemistry and its changes upon metal layer deposition further adds to the challenges. In this work, we have addressed the above challenges by using nanoscale infrared spectroscopy to investigate the potential of stearic acid (SA) as an ALD inhibiting SAM. We show that SA monolayers on Co and Cu substrates can inhibit ZnO ALD growth on par with other commonly used SAMs, which demonstrates its viability towards AS-ALD. We complement these measurements with AFM-IR, which is a surface-sensitive spatially resolved technique, to obtain spectral insights into the ALD-treated SAMs. The significant insight obtained from AFM-IR is that SA SAMs do not desorb or degrade with ALD, but rather undergo a change in substrate coordination modes, which can affect ALD growth on substrates.

Low Temperature Wafer Bonding of Silicon Carbide/Aluminum Nitride

Because of the wide energy gap material properties and high compatibility with existing silicon material processing, silicon carbide (SiC) has become the preferred material for power management chips that have been used in electric vehicles. On the other hand, aluminum nitride (AlN) material has become the first choice for carrying wafers due to its high strain-resistant mechanical properties, strong dielectric coefficient, excellent thermal conductivity, and high etching resistance. In this study, the surface chemistry of silicon carbide was changed into an AlN-based material to perform wafer bonding processing to develop low-temperature bonding technology for silicon carbide/aluminum nitride materials. We found through experiments that it is quite difficult for a SiC wafer to bond with an AlN wafer even if the surfaces ofthe SiC wafer and the AlN wafer are subjected to conventional surface activation treatment using oxygen plasma or argon plasma. The possible reason is that although the surface of the SiC wafer is bombarded by oxygen or argon plasmas to generate some dangling bonds, the chemical properties of Si-C and Al-N, such as electronegativity, make it difficult to generate chemical bonds between the matching surfaces of SiC/AlN. Through a material modification technology, a high-temperature sputtering method is used to make highly active AlN clusters sputtered from the target directly bond with SiC and finally form a thin AlN layer that strongly adheres to the surface of the SiC wafer. And then through the bonding of AlN/AlN homogeneous materials, although the surface roughness measurement (RMS) cannot satisfy the condition of being less than 5 angstroms for wafer bonding, the goal of low-temperature bonding can be achieved by capillary bonding. Therefore, the SiC surface is changed into an AlN-based thin layer by high-temperature sputtering, which can further chemically bond with the AlN wafer surface by capillary bonding to achieve the low-temperature bonding of SiC/AlN, as shown in Figure 1.Reference1. Shao-Ming Nien, Jian-Long Ruan, Yang-Kuao Kuo, and Benjamin Tien-Hsi Lee, Low-temperature rough-surface wafer bonding with aluminum nitride ceramics implemented by capillary and oxidation actions, Ceramics International, Volume 48, Issue 6, 2022 Figure 1

Manipulating non-collinear antiferromagnetic order and thermal expansion behaviors in triangular lattice Mn3Ag1−xSn(Ge)xN

Magnetic materials with non-collinear spin orderings provide an outstanding platform to probe spintronic phenomena owing to their strong spin-orbit coupling (SOC) and unique Berry phase. It is thus important to obtain a non-collinear antiferromagnetic (AFM) phase at room temperature (RT). Significantly, the discovery of novel materials with nearly zero thermal expansion (ZTE) property near RT is required and pursued for avoiding thermal stress and fracture in spintronic devices. Herein, the doping of Sn (Ge) at the Ag site in the triangular lattice Mn3Ag1−xSn(Ge)xN compounds increases effectively the Néel point and makes the interesting non-collinear Γ5g AFM phase exist above RT. The magnetic phase diagrams with Γ5g phase up to 498 K were built by the combined analysis of neutron powder diffraction (NPD), magnetic measurements, electronic transport, and differential scanning calorimetry (DSC). The thermal expansion behaviors of Mn3Ag1−xSn(Ge)xN were modulated, and the nearly ZTE above RT was achieved in Mn3Ag0.5Ge0.5N within Γ5g AFM ordering. Our findings offer an effective way to tailor the non-collinear AFM ordering and correlated thermal expansion behavior for potential use in the emerging field of thermal stress-free magnetic chip materials.

Enhancing Value and Efficiency in Calamansi and Banana Processing: A Study on Waste Utilization and Chopping Machine Development

Mindoro Island is renowned as the “Calamansi King” and “Banana King” in the Philippines. However, the traditional manual slicing method employed during the processing of these commodities proves to be time-consuming, laborious, and taxing on the wrists and arms of workers. Thus, the study aimed to develop a specialized chopping machine for efficiently processing Calamansi peel and rag, as well as banana pulp for making banana chips. The experiment utilized Banana pulp, Calamansi peel, and rags as test materials, subjecting them to different speeds (573, 1146, and 1720rpm) using a completely randomized design (CRD). The results demonstrated that the highest shredding input capacity of 105.54 kg/hr was achieved at a shaft speed of 1720rpm, boasting an impressive 94.55% chopping efficiency. However, the machine faced inefficiencies due to the amount of crushed chip materials and had an energy demand of 0.372 kW-hr/kg. The chipped product exhibited a vertical orientation with a 1mm thickness. Cost analysis revealed that the machine needed to process a total of 16,832.67 kg of bananas at a custom rate of Php2/kg to break even. Remarkably, the machine could generate an additional income of Php260,154.86/yr for processors, with a 0.4-year payback period and a 209.78% rate of return, making it a highly cost-efficient device. By introducing this innovative chopping machine, Mindoro Island’s processing of its flagship commodities can be significantly improved, reducing manual labor, enhancing efficiency, and offering greater economic benefits to the processors..