A new copper(I) coordination polymer, [Cu((3,4-MeO-ba)2bn)I]n (1), using a bridging Schiff base ligand, N,N′-bis(3,4-dimethoxybenzylidene)butane-1,4-diamine, (3,4-MeO-ba)2bn, containing a flexible spacer (=N–CH2–CH2–CH2–CH2–N=) has been synthesized and characterized by elemental analyses (CHN) and FTIR spectroscopy, thermal analysis and powder X-ray structure analysis. In 1, Cu(I) ions are bridged by Schiff base ligands and iodine atoms forming 1D-chain. The thermal stability of 1 was studied by thermal gravimetric and differential thermal analyses. 1 is used to prepare CuO nanoparticles via solid state thermal decomposition in air and nanoparticles thus formed are characterized by scanning electron microscopy, transmission electron microscopy and powder X-ray diffraction techniques.