Ni-clad substrates for HTS coated conductors have been developed to enhance their mechanical strength and to reduce their magnetization. The Ni-clad substrate has a sandwich structure, which comprises two pure Ni layers at the top and bottom sides and a Ni–Mo alloy layer at the center.The textured Ni-clad substrate shows a 0.2% proof stress of 1.1GPa, which is 25 times higher than that of the textured pure Ni substrate. The saturated magnetization is about half that of pure Ni substrate, which reduces the magnetic loss of the substrate remarkably. In order to evaluate bi-axially textured growth of the buffer layers on the substrate, a CeO2 buffer layer was deposited by electron-beam evaporation. The X-ray diffraction and pole figure analysis of the CeO2 buffer layer indicate that the buffer layer has the {200}〈220〉 cube orientation.A 40m-long Ni-clad substrate has been successfully fabricated to demonstrate the mass-productivity. The 40m-substrate exhibits that the orientation is a good alignment and the quality is homogeneous over the full length.The Ni-clad substrate is expected to be one of the useful substrates for HTS coated conductors.
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