The electrochemical corrosion behaviour of Pb-free Sn–8.5 Zn– X Ag–0.1 Al–0.5 Ga solder in 3.5% NaCl solution was investigated by using potentiodynamic polarization methods, scanning electron microscopy (SEM), energy-dispersive X-ray spectroscopy (EDX) and X-ray photoelectron spectroscopy (XPS) analysis. The results obtained from polarization studies showed that an increase in the Ag content from 0.1 to 1.5 wt% decreased the corrosion current density ( I corr) and shifted the corrosion potential ( E corr) towards more noble values. These changes were also reflected in the linear polarization resistance (LPR), corrosion rate, anodic Tafel slope ( b A) and the cathodic Tafel slope ( b c) values, respectively. Passivation behaviour was noted in the Sn–Zn– X Ag–Al–Ga solders with Ag content > 0.1 wt%. The oxides and hydroxides of zinc were responsible for the formation of passive film. Presence of Ag atoms in the oxide layer also improved the passivation behaviour of solders to a certain extent. X-ray photoelectron spectroscopy revealed that two different oxygen species were formed on the surface films, one was assigned to OH − in Zn(OH) 2 and the other to O 2 − in ZnO. XPS depth profile results revealed that the two species had different depth distribution in the films. SEM and EDX analyses confirmed SnCl 2 as the major corrosion product formed after the electrochemical experiments.