Mg-Cu bimetallic materials have been widely studied because of their low density, good electrical conductivity, and excellent hydrogen storage properties. However, the interface bonding strength of Mg/Cu is low. In this study, we examined the effect of hot-dip tin coating (HDTC) with copper (Cu) on the interfacial metallurgical bonds between AZ91D Magnesium (Mg) alloy and Cu composite casting. A transition layer composed of Mg2Cu and MgCu2 intermetallic compounds (IMCs) formed at the interface of the AZ91D/HDTC-Cu composite casting. However, the transition layer was about 1 μm at the AZ91D/Cu interface, mainly comprising Mg(Al, Cu)2 IMC. Both the AZ91D/Cu and AZ91D/HDTC-Cu interfaces exhibited many labyrinthine Mg(Al, Cu)2 IMCs and layer-like Mg2(Al, Cu) IMCs. Moreover, the interfacial shear strength of the AZ91D/Cu was changed from 12.6 MPa to 52.4 MPa due to the solid solution of Sn atom and the precipitation of Mg2Sn IMC at the interface after HDTC treatment. Meanwhile, the shear fracture surfaces are characterized by brittle fractures.
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