DOI: 10.1002/admi.201400135 conventional oven for a period of 0 to 24 h, prior to delamination. The measured adhesion energy, G c (J m − 2 ), is shown as a function of annealing time in Figure 2 a. For any particular annealing temperature, the adhesion energy increased with annealing time. For example at 130 °C, G c increased from 1.3/ for no annealing to 2.76 J m – 2 and 2.81 J m – 2 for 30 min and 24 h annealing, respectively. The largest increase in G c generally happened within the fi rst 2 h of annealing. Conversely, at a constant annealing time, the G c increased with annealing temperature. The impact of such an adhesion increase has large implications on the reliability of these inverted OPV devices. After delamination, every adhesion specimen is split into two fractured halves: one includes the Ag electrode, referred to as the “Ag side” and the other includes the ZnO, referred to as the “ZnO side”, as shown on Figure 1 . Note that it does not refer to the interface between P3HT:PCBM and the ZnO layer or the interface between PEDOT:PSS and the Ag electrode. In order to understand the interfacial reinforcement mechanism responsible for the increase in G c , these delaminated surfaces were characterized using NEXAFS, UV-VIS absorption and X-ray photo spectroscopy (XPS). NEXAFS in Total Electron Yield (TEY) mode was used to quantify the surface composition at the top few nanometers of the delaminated surfaces (see experimental details). The carbon K-edge NEXAFS TEY spectra from pristine P3HT, PCBM and PEDOT:PSS are shown in Figure 3 a. The NEXAFS intensity is dominated by resonances arising from transitions from the 1s core level to unfi lled molecular orbitals of π* and σ* character, which are specifi c to the bonding within different functional groups. [ 11 ] We observed the characteristic π* and σ* resonances for the pure compounds consist with previous literature. [ 12 ]
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