Capacitance-voltage Measurements Research Articles

Reduction of interface defects in gate-recessed GaN HEMTs by neutral beam etching

This study investigates and compares the impact of different etching techniques on the fabrication of GaN high electron mobility transistors (HEMTs) between the inductively coupled plasma reactive ion etching (ICP-RIE) and the neutral beam etching (NBE) for the gate recess. By conducting direct current analysis, it was found that devices manufactured using the NBE exhibited superior electrical performance as compared with those produced using the ICP-RIE. These enhanced electrical characteristics include a transconductance of up to 100.4 mS/mm, a threshold voltage (Vth) of −2.3 V, an on/off current ratio of 1.1 × 109, a subthreshold swing (S.S.) of 99.63 mV/dec, and a remarkably low gate leakage current. Additionally, we noted varying degrees of hysteresis in the I–V characteristics were related to process disparities possibly leading to interface defects. Multi-frequency capacitance-voltage (C–V) measurements were used to identify the interface defects at the oxide/AlGaN interface of the gate. The results revealed that devices fabricated using the NBE exhibited a lower interface defect density as compared with those fabricated using the ICP-RIE, thereby elucidating the reduced hysteresis observed in the I–V characteristics. These findings indicated the significant advantages of the NBE process in the fabrication of GaN HEMTs.

Microstructure Evolution and Electrical Behaviors for High-Performance Cu2O/Zr-Doped β-Ga2O3 Heterojunction Diodes.

Beta-gallium oxide (β-Ga2O3) is emerging as a promising ultrawide band gap (UWBG) semiconductor, which is vital for high-power, high-frequency electronics and deep-UV optoelectronics. It is especially significant for flexible wearable electronics, enabling the fabrication of high-performance Ga2O3-based devices at low temperatures. However, the limited crystallinity and pronounced structural defects arising from the low-temperature deposition of Ga2O3 films significantly restrict the heterojunction interface quality and the relevant electrical performance of Ga2O3-based devices. In this work, cuprous oxide (Cu2O)/Zr-doped β-Ga2O3 heterojunction diodes are fabricated by magnetron sputtering without intentional substrate heating, followed by an investigation into their microstructure and electrical behaviors. Zr doping can markedly enhance the Ga2O3 crystallinity at low substrate temperatures, transforming the amorphous structure of pristine Ga2O3 films into the crystallized β phase. Moreover, crystalline β-Ga2O3 facilitates the epitaxial growth of the Cu2O phase, suppressing the formation of detrimental secondary phase CuO at the heterojunction interface. Benefiting from the high-quality heterojunction interface, the Cu2O/Zr-doped β-Ga2O3 heterojunction diode exhibits a near-ideal electrical behavior with a low ideality factor of 1.6. The consistent electrical parameters extracted from current-voltage (J-V) and capacitance-voltage (C-V) measurements also confirm the high quality of β-Ga2O3. This work highlights the potential for the low-temperature production of high-quality β-Ga2O3-based heterojunction devices through Zr doping.

Synthesis of low-k SiONC thin films by plasma-assisted molecular layer deposition with tetraisocyanatesilane and phloroglucinol.

Low-k SiONC thin films with excellent thermal stabilities were deposited using plasma-assisted molecular layer deposition (PA-MLD) with a tetraisocyanatesilane (Si(NCO)4) precursor, N2 plasma, and phloroglucinol (C6H3(OH)3). By adjusting the order of the N2 plasma exposure steps within the PA-MLD process, we successfully developed a deposition technique that allows accurate control of thickness at the Ångström level via self-limiting reactions. The thicknesses of the thin films were measured through spectroscopic ellipsometry (SE). By tuning the N2 plasma power, we facilitated the formation of -NH2 sites for phloroglucinol adsorption, achieving a growth per cycle of 0.18 Å/cycle with 300 W of N2 plasma power. Consequently, the thickness of the films increased linearly with each additional cycle. Moreover, the organic linkers within the film formed stable bonds through surface reactions, resulting in a negligible decrease in thickness of approximately -11% even upon exposure to a high annealing temperature of 600 ℃. This observation was confirmed by SE, distinguishing the as-prepared film from previously reported low-k films that fail to maintain their thickness under similar conditions. X-ray photoelectron spectroscopy (XPS) and current-voltage (I-V) and capacitance-voltage (C-V) measurement were conducted to evaluate the composition, insulating properties, and dielectric constant according to the deposition and annealing conditions. XPS results revealed that as the plasma power increased from 200 to 300 W, the C/Si ratio increased from 0.37 to 0.67, decreasing the dielectric constant from 3.46 to 3.12. Furthermore, there was no significant difference in the composition before and after annealing, and the hysteresis decreased from 0.58 to 0.19 V owing to defect healing, while maintaining the leakage current density, breakdown field, and dielectric constant. The low dielectric constant, accurate thickness control, and excellent thermal stability of this MLD SiONC thin film enable its application as an interlayer dielectric in back-end-of-line process.&#xD.

Interface Characterization of Graphene‐Silicon Heterojunction Using Hg Probe Capacitance–Voltage Measurement

AbstractInvestigating the intrinsic properties of the Schottky interface between graphene and 3D bulk silicon is crucial. However, the semiconductor technology introduces extra doping and defects in graphene, which significantly disturbs the property of the graphene‐silicon interface. Here, the interface parameters of graphene/n‐Si heterojunction are derived by the damage‐free Hg‐probe capacitance–voltage measurement. Due to its low‐density states, the Fermi level of graphene can be pushed upward, which results in a lower Schottky barrier height (ΦB0) of Hg/graphene/n‐Si (HGS) heterostructure than that of Hg/n‐Si (HS) structure. Additionally, the series resistance (Rs) of HGS becomes lower than that of HS, which can be attributed to the narrowed depletion layer width (WD) and the decreased interface state density (Nit). Furthermore, the frequency characteristic is also investigated. Because of the weak interface state charge trapping–detrapping process and the decreased Nit at high frequency, electrons will accumulate in graphene, and the Fermi level will be pushed up. Hence, the ΦB0 and Rs will decrease with increasing frequency. This study contributes to a deep understanding of the graphene/silicon heterojunction interfaces, which is crucial for designing and optimizing the new electronic and optoelectronic devices based on 2D/3D heterostructure.

Interface Characterization of Graphene‐Silicon Heterojunction Using Hg Probe Capacitance–Voltage Measurement

AbstractInvestigating the intrinsic properties of the Schottky interface between graphene and 3D bulk silicon is crucial. However, the semiconductor technology introduces extra doping and defects in graphene, which significantly disturbs the property of the graphene‐silicon interface. Here, the interface parameters of graphene/n‐Si heterojunction are derived by the damage‐free Hg‐probe capacitance–voltage measurement. Due to its low‐density states, the Fermi level of graphene can be pushed upward, which results in a lower Schottky barrier height (ΦB0) of Hg/graphene/n‐Si (HGS) heterostructure than that of Hg/n‐Si (HS) structure. Additionally, the series resistance (Rs) of HGS becomes lower than that of HS, which can be attributed to the narrowed depletion layer width (WD) and the decreased interface state density (Nit). Furthermore, the frequency characteristic is also investigated. Because of the weak interface state charge trapping–detrapping process and the decreased Nit at high frequency, electrons will accumulate in graphene, and the Fermi level will be pushed up. Hence, the ΦB0 and Rs will decrease with increasing frequency. This study contributes to a deep understanding of the graphene/silicon heterojunction interfaces, which is crucial for designing and optimizing the new electronic and optoelectronic devices based on 2D/3D heterostructure.

Comparative Study of Plasma-Enhanced-Atomic-Layer-Deposited Al2O3/HfO2/SiO2 and HfO2/Al2O3/SiO2 Trilayers for Ultraviolet Laser Applications.

High-performance thin films combining large optical bandgap Al2O3 and high refractive index HfO2 are excellent components for constructing the next generation of laser systems with enhanced output power. However, the growth of low-defect plasma-enhanced-atomic-layer-deposited (PEALD) Al2O3 for high-power laser applications and its combination with HfO2 and SiO2 materials commonly used in high-power laser thin films still face challenges, such as how to minimize defects, especially interface defects. In this work, substrate-layer interface defects in Al2O3 single-layer thin films, layer-layer interface defects in Al2O3-based bilayer and trilayer thin films, and their effects on the laser-induced damage threshold (LIDT) were investigated via capacitance-voltage (C-V) measurements. The experimental results show that by optimizing the deposition parameters, specifically the deposition temperature, precursor exposure time, and plasma oxygen exposure time, Al2O3 thin films with low defect density and high LIDT can be obtained. Two trilayer anti-reflection (AR) thin film structures, Al2O3/HfO2/SiO2 and HfO2/Al2O3/SiO2, were then prepared and compared. The trilayer AR thin film with Al2O3/HfO2/SiO2 structure exhibits a lower interface defect density, better interface bonding performance, and an increase in LIDT by approximately 2.8 times. We believe these results provide guidance for the control of interface defects and the design of thin film structures and will benefit many thin film optics for laser applications.

Analysis of interface trap induced ledge in β-Ga2O3 based MOS structures using UV-assisted capacitance–voltage measurements

A ledge feature in the capacitance–voltage (CV) profiles of Ga2O3 MOS (metal–oxide–semiconductor) capacitors is investigated using UV-assisted CV measurements. A model is presented whereby the capacitance ledge is associated with carrier trapping in deep-level states at the Al2O3/Ga2O3 interface. Following UV assisted emptying of interface traps at a constant bias, a voltage ramp toward flatband results in a CV ledge when the trap recombination current becomes equal to the quasi-static sweep charging current. The ledge continues until all the traps below the corresponding pinned surface potential have been filled. Varying the UV energy varies the ledge voltage range and allows a density of states to be determined as a function of energy. A broad interface state peak with maximum density ∼8 × 1012 cm−2 eV−1 for deep trap energies lying between 2.4 and 4.1 eV below the conduction band (CB) edge is extracted. Using the conductance method, the interface trap density is also found to rise toward the CB edge in the range 0.25–0.45 eV below the CB edge, reaching a maximum density of ∼1 × 1012 cm−2 eV−1. Combining these two techniques, an interface trap distribution is estimated for almost the entirety of the bandgap of Ga2O3. This novel technique probes deep interface states where standard methods fail to quantify interface states reliably.

C-V characterization of the trap-rich layer in a novel Double-BOX structure

A new Double-BOX structure is introduced to explore the electrical properties of the trap-rich layer used to enhance the performance of radio frequency Silicon-on-Insulator substrates. Capacitance-voltage (C-V) measurements reveal anomalous behavior with a “shoulder” emerging in the electron accumulation region and a shift towards negative gate voltage in hysteresis. TCAD simulation shows that these features are related to trap states at the grain boundary in the trap-rich polycrystalline silicon (polysilicon) layer. These traps form a potential barrier and affect the C-V curves. To determine the traps density in polysilicon, a three-element circuit model is used. The effective density of fast traps is evaluated from the corrected C-V curve, while the hysteresis of double-sweep C-V measurement yields the slow traps density at the grain boundary in polysilicon.

Effect of films thickness and hydrogen annealing on passivation performance of plasma ALD based Hafnium oxide films

We investigate the silicon surface passivation property of Plasma Atomic Layer Deposited (PALD) hafnium oxide thin films and study its dependence on silicon (Si) doping type, film thickness, and post-deposition annealing conditions. Our results demonstrate that as-deposited HfOx films exhibit poor passivation quality that can be improved by performing post-deposition annealing at 450 °C in hydrogen ambient. We demonstrate that the films can effectively passivate p-Si surfaces as compared to n-Si, where the surface passivation quality of the films improves with increasing film thickness for both silicon doping types. The best performance with a minority carrier lifetime of 1.7 ms, corresponding surface recombination velocity (SRV) ∼10 cm s−1, is achieved for HfOx films thickness ∼23 nm deposited on the p-Si substrate. The Capacitance-Voltage (C–V) measurements give an insight into the passivation mechanism of the studied films. Field effect passivation is found to be an important passivation mechanism in PALD-deposited HfOx films, as revealed by C–V measurements. The films are also characterized using Fourier transform infrared spectroscopy (FTIR) and x-ray photoelectron spectroscopy (XPS), which reveals the chemical passivation provided by hydrogen ambient annealing. Overall, the impact of hafnium oxide film thickness and hydrogen ambient annealing conditions on silicon surface passivation is investigated. Our findings will help in utilizing plasma ALD process based HfOx films for silicon solar cell device application.

Effect of substrate temperature on growth mechanism and properties of PEALD-MgO dielectric films for amorphous-IGZO TFTs

Magnesium oxide (MgO) films have been prepared by plasma enhanced atomic layer deposition with bis(cyclopentadienyl)magnesium precursor and oxygen plasma reactant at substrate temperature between 150 °C and 450 °C. The structural, morphological, optical, and chemical properties of the prepared MgO films were studied by spectroscopic ellipsometer, grazing incidence X-ray diffraction (GIXRD), field emission scanning electron microscopy, atomic force microscopy, X-ray photoelectron spectroscopy (XPS). The electrical property of MgO film was obtained by performing capacitance-voltage measurement on the Al/MgO/Si structures. The experiment result shows that growth rate of MgO film decreases with the deposition temperature increased. GIXRD analysis presented that MgO films are cubic with predominantly (220) crystal orientation. XPS analysis shows that ratio of Mg/O is highest in MgO film prepared at 350 °C. To illustrate the possible applications of MgO film as a gate dielectric in thin film transistor (TFT), indium‑gallium‑zinc oxide (IGZO) was used as channel layer. The optimized IGZO/MgO TFT showed an electron mobility of 1.63 cm2/Vs, an on/off current ratio of 106, and a subthreshold swing of 0.50 V/decade at a low operation voltage of −0.11 V.

Optical and electronic properties of MgPc-Ch-diisoQ blend organic thin film as an active layer for photovoltaic cells.

Organic photovoltaic cells are a promising technology for generating renewable energy from sunlight. These cells are made from organic materials, such as polymers or small molecules, and can be lightweight, flexible, and low-cost. Here, we have created a novel mixture of magnesium phthalocyanine (MgPc) and chlorophenyl ethyl diisoquinoline (Ch-diisoQ). A coating unit has been utilized in preparing MgPc, Ch-diisoQ, and MgPc-Ch-diisoQ films onto to FTO substrate. The MgPc-Ch-diisoQ film has a spherical and homogeneous surface morphology with a grain size of 15.9 nm. The optical absorption of the MgPc-Ch-diisoQ film was measured, and three distinct bands were observed at 800-600 nm, 600-400 nm, and 400-250 nm, with a band gap energy of 1.58 eV. The current density-voltage and capacitance-voltage measurements were performed to analyze the photoelectric properties of the three tested cells. The forward current density obtained from our investigated blend cell is more significant than that for each material by about 22%. The photovoltaic parameters (Voc, Isc, and FF) of the MgPc-Ch-diisoQ cell were found to be 0.45 V, 2.12 μA, and 0.4, respectively. We believe that our investigated MgPc-Ch-diisoQ film will be a promising active layer in organic solar cells.

High performance of Ag/AlN/Si Schottky diode: Study of the DC sputtering power effect on its electrical properties

The DC sputtering power (DCSP) effect on the chemical composition, structural and electrical properties of Ag/AlN/Si Schottky diode was studied. The AlN films grown on Si substrate were examined by X-ray diffraction (XRD), Fourier Transformed Infra-Red (FTIR), and Raman spectroscopy. The analyzes by XRD, FTIR and Raman show stability at the level of the structure and the qualitative chemical composition of the AlN layer for DCSP of 200 W and 400 W. However, the quantity of chemical compounds on the surface of AlN is affected by this variation. From Current-Voltage (I-V) measurements, the ideality factor (n), barrier height (φb), and series resistance (Rs) were extracted by adopting Cheung functions. Diodes with an AlN interlayer elaborated at 400 W have good rectifying behavior with n, Rs and φb of 3.11, 1930 Ω, and 0.93 eV, respectively. The enhancement of the Ag/AlN/Si diode performance was attributed to the reduction of undesirable impurities in the Ag/AlN interface as well as the morphological improvement of the AlN layer. Capacitance-Voltage (C-V) measurements showed that carrier donor concentrations are strongly affected by DC sputtering power. The elaborate structures may provide new materials with electrical properties having a wide range of applications in electronics and photovoltaic field.

Data-Driven Analysis of High-Resolution Hyperspectral Image Data Sets through Nanoscale Capacitance–Voltage Measurements to Visualize Ferroelectric Domain Dynamics

Data-Driven Analysis of High-Resolution Hyperspectral Image Data Sets through Nanoscale Capacitance–Voltage Measurements to Visualize Ferroelectric Domain Dynamics

Photoelectrical characterization of heavily doped p-SiC Schottky contacts

The availability of photoelectrical characterizations of heavily Al-doped p-SiC Schottky contacts was clarified. We conducted a systematic study of four samples with different Al doping concentrations from 1 × 1018 to 5 × 1019 cm−3. Although the current–voltage (I–V) characteristics had lost rectification, reasonable Schottky barrier height (qϕ B) values were obtained up to 1 × 1019 cm−3 by capacitance voltage, photo response, and scanning internal photoemission microscopy (SIPM) measurements. In the two-dimensional characterization by SIPM, large photocurrent spots corresponding with low qϕ B were observed in an average density of 103 to 104 cm−2. However, except for these spots, a high uniformity of about 2 meV standard deviation was obtained for qϕ B over the entire observed electrodes. These results indicate that SIPM is able to characterize the inhomogeneity of heavily doped p-SiC contacts with very leaky I–V characteristics.

Impact of TiO2, ZnO, and Methylene Blue Doping on the Dielectric anisotropy of planar 8CB nematic liquid crystal

In this study, the impact on the dielectric properties of 8CB with the dispersion of TiO2, ZnO, and methylene blue (0% to 5%) is examined. Employing capacitance–voltage (C–V) measurements across frequencies ranging from 10 kHz to 2 MHz, we explore the combined effects of dispersed photoactive nanoparticles and mono/polymeric materials like MB. Our investigation provides novel insights into the nuanced variations induced by transition-metal oxide loaded 8CB, highlighting the role of their oxidation states, and elucidates the influence of larger photoactive monomers on 8CB’s dielectric polarizability. The study found that the dielectric anisotropy was strongly influenced by frequency and doping, changing sign at a critical frequency. Our work represents the first comparative analysis incorporating these oxides alongside photoactive materials like MB.

Improved β-Ga2O3 Schottky Barrier Diodes via thermal oxidation of titanium insertion layer

In realm of β-Ga2O3 Schottky Barrier Diodes (SBDs), insertion layer appeared as an effective strategy for enhancing breakdown voltage. Presently, insertion layer techniques typically employed atomic layer deposition (ALD) to grow insulators with low electron affinity (e.g., Al2O3, HfO2). Although these insertion layers enhanced the reverse break-down characteristics, substantially degraded forward con-duction was also induced. In this study, a TiO2 thin layer by thermally oxidized Titanium metal was inserted to elevate the breakdown voltage and power figure of merit (PFOM) of β-Ga2O3 SBDs, while maintaining the on-resistance nearly unchanged. In comparison with the conventional met-al/semiconductor-SBD (MS-SBD), the thermally oxidized metal/insulator/semiconductor-SBD (MIS-SBD) exhibited 2.75 times elevation of breakdown voltage with only 11.6% reduction of forward current at +5V. The PFOM of the thermally oxidized MIS-SBD was enhanced by 7.6-fold compared to conventional MS-SBD, and by 15.7-fold com-pared to the counterpart ALD MIS-SBD. Analysis of the TiO2/β-Ga2O3 interface characteristics through X-ray photo-electron spectroscopy (XPS) and capacitance-voltage (C–V) measurements revealed that the thermally oxidized TiO2-SBD possesses smaller band offset and larger interface trap density (Dit) compared to the ALD counterpart, which contribute to the higher PFOM of the thermally oxidized TiO2-SBD. This novel TiO2/β-Ga2O3 structure exhibited superior electrical properties, providing potential solution for high performed SBD.

A technique for accurate FTIR determination of boron concentration in CVD homoepitaxial diamond layers

The significant technology progress for fabrication of semiconducting CVD diamonds poses an important task of developing a precise and non-destructive method for estimation the boron content in epitaxial layers. We propose a novel two-step technique to determine the boron concentration in homoepitaxial diamond layers from FTIR measurements. The essence of the method is to evaluate the epilayer thickness from reflectance spectra at the first step, and to recalculate and analyze FTIR spectra in terms of effective optical density at the second step. Spectra are divided into 3 wavelength regions with accurate accounting of passing radiation through a multilayered structure with different thicknesses of absorbing media for various absorbing mechanisms. We have demonstrated the benefit of the method for a set of samples with CVD homoepitaxial layers grown on various HPHT substrates. The data obtained from FTIR spectra are thoroughly compared to the charge carrier concentration derived from electrical capacitance–voltage measurements.

Fluence profiling at JSI TRIGA reactor irradiation facility

We present an analysis of the fluence profile at the JSI TRIGA neutron reactor facility in Ljubljana. For the study, multi-pad Low-Gain Avalanche Diodes (LGADs) are used. The deactivation of acceptor doping in the gain layer implant due to the irradiation, typical of LGAD devices, is exploited to map the fluence profile inside the irradiation channels. The amount of active doping of the LGAD gain layer is extracted via capacitance–voltage measurements for each pad before and after irradiation to a fluence of 1.5 × 1015neq/cm2, where neq stands for 1 MeV equivalent neutron count, providing a precise and prompt measurement of the fluence distribution over the LGAD sensor. Experimental results are compared to neutron fluence expectations calculated with Monte Carlo techniques.

Recovery at room temperature annealing on 4H–SiC SBDs by gamma irradiation

The impact of gamma irradiation and subsequent recovery at room temperature on the device performance of commercial 4H–SiC Schottky barrier diodes (SBDs) was investigated through the analysis of the electrical properties and the deep level transient spectroscopy (DLTS). The ideality factor (n) of the SBDs increased from 1.01 to 1.13 with an increasing irradiation dose, but recovered after 7 days of room temperature annealing. To determine Schottky barrier heights (ΦB), both current-voltage (I–V) and capacitance-voltage (C–V) measurements were performed. The results of the combined I–V and C–V analysis showed that a little variations in ΦB were consistent with the variations in irradiation dose, except for the ΦB calculated by C–V measurement at 30 kGy. Similarly, the ΦB recovered after 7 days at room temperature. DLTS analysis revealed the presence of Z1/Z2 traps in the samples after 7 days at room temperature annealing. These traps exhibited activation energies ranging from 0.46 eV to 0.55 eV. The trap concentration (NT) increased from 9.48 × 1012 cm−3 to 2.23 × 1013 cm−3 with the increasing irradiation dose. These findings indicate that gamma irradiation-induced point defects were the primary cause of the degradation of 4H–SiC SBDs.

Electrical Characterization and Ammonia Gas Response of a p‐Si/n‐poly[benzimidazobenzophenanthroline] Thin‐Film Junction Diode

The electrical characterization and ammonia vapor (NH3) response of a p‐Si/n‐poly[benzimidazobenzophenanthroline] (n‐BBL) thin‐film junction diode are reported. The presence of a depletion layer at the n‐BBL/p‐Si interface is verified via capacitance–voltage measurements, and the built‐in potential is ≈1.8 V. Using the standard diode equation for data analysis, the turn‐on voltage, rectification ratio, and ideality parameter are found to be 2 V, 16, and 6, respectively. The diode is also tested in the presence of NH3 vapor where it retained its asymmetric J–V behavior with increased currents and an insignificant change in device parameters. NH3 is believed to interact with the adsorbed O2− species on the n‐BBL surface liberating electrons that enhance the diode current. The response time, recovery time, and sensitivity of the diode are 65 s, 121 s, and 52%, respectively. The removal of the gas restores the diode characteristics to their near original shape making it reusable. The diode is also electrically characterized as a function of temperature and is found to retain its rectifying behavior down to 150 K. The rectifying and gas‐sensing features make the diode multifunctional, which expands the range of applications of this ladder‐type conducting polymer.