Built-in Current Research Articles

Response of a Bose-Einstein condensate of dipole excitons to static and dynamic perturbations

Studies of the interaction of a Bose-Einstein condensate of two-dimensional spatially indirect excitons with the static fields of impurities, surface acoustic waves, and elementary excitations of a degenerate electron gas have been reviewed. The effects of screening of charged impurities and absorption of a Bleustein-Gulyaev surface acoustic wave by an exciton condensate have been considered. Friedel oscillations of the exciton density in a hybrid electron-exciton system, which consists of spatially separated layers of condensed exciton gas and degenerate electron gas, have been studied. The lifetimes of quasiparticle excitations (electrons, plasmons, and bogolons) in the hybrid system have been calculated. The contributions to the effects under study from condensate and above-condensate particles have been determined. The properties of an excitonic insulator have been analyzed within the Bardeen-Cooper-Schrieffer model with a built-in dissipation-free current.

Study on Schottky Diode Characteristics Improving by X-Ray Irradiation

The effect of soft X-ray irradiation to the Schottky diode properties was analyzed in this paper. The built-in voltage, leakage current, and work function of Schottky diode were investigated. The current-voltage characteristics of the Schottky diode are measured at room temperature. After irradiation at 70 keV for 55 seconds the forward current and leakage current are increase slightly. On the other hand, the built-in voltage is decrease from the initial value about 0.12 V. Consequently, this method can cause the Schottky diode has low power consumption. The results show that soft X-ray can improve the characteristics of Schottky diode.

Study of the Method on Cutting-Force Modeling Based on the Current of High-Speed Electric Spindles

It is important to build the models for calculating the cutting-forces in high-speed machining, but it is difficult as the special test-bed with the cutting-force measurement system is complicated, cost much and cannot be applied directly on general machining tools. Aiming at the problems above, a new method was put forward about cutting-force modeling based on the current of high-speed electric spindles, in which the cutting-force models could be gained indirectly by analyzing the built-in motor current and the data gotten from cutting experiments on those general machining tools which are installed with electric spindles. Then on a vertical milling machine tool which is equipped with a high-speed electric spindle, a model for calculating the milling force was gotten using the method put forward by this paper. The results show that the method is simple and easy to be used in routine machine tools in plant spots and need no any special test-beds and any complicated measurement systems possessed only in the laboratory conditions.

Architecture for fault diagnosis of CMOS ICs withBICbased I DDQ testing

An architecture for simplifying fault diagnosis is presented. The method is applied to circuits incorporating built-in current (BIC) sensors and is based on hardware partitioning, does not increase the number of pins and is independent of the fault diagnosis heuristic at the logic level.

Implementation of BIC monitor in balanced analogueself-test

The authors present the design of a dynamic built-in current (BIC) monitor for a new on-chip analogue self-test methodology. This methodology uses dynarnic power supply current monitoring, and takes advantage of a redundancy in the structure of fully balanced circuits. The dynarnic BIC monitor is based on a second generation current conveyor CCII+, and offers accurate measurement of supply current with minimal degradation in power supply voltage.

Design of ICs applying built-in current testing

Built-in Current (BIC) sensors have proven to be very useful in testing static CMOS ICs. In a number of experimental ICs BIC sensors were able to detect small abnormal I DDQ currents. This paper discusses the design of the circuit under test and Built-in Current (BIC) sensors, which provide: maximum level of defect detectability, minimum impact of BIC sensor on the performance of the circuit under test and minimum area overhead needed for BIC sensors implementation.

Built-in current testing

Built-in current (BIC) testing has proven to be useful through a number of IC fabrication experiments. In this paper the experience gained from these experiments is summarized. >