Boiling phase-change plays a crucial role in heat transfer as it can dissipate higher heat fluxes than single phase. Bubble nucleation, growth, motion (oscillation or leaping), coalescence and departure, govern the boiling and the heat transfer performance on wires. Many factors affect the bubble mechanisms and interactions taking place, which include the nature of the fluid, experimental conditions, thermocapillary effects, etc. This work investigates the bubble oscillation and leaping phenomena caused by thermocapillary effects in the presence of oxygen and air as non-condensable gases during boiling on a platinum micro-wire. More in particular, the bubble oscillation performance is compared under various bulk temperatures and heat fluxes for two different non-condensable gases. It is observed that for a similar fluid bulk temperature, the lower the heat flux the longer the bubble displacement. Moreover, bubble oscillation phenomenon is influenced by the concentration of non-condensable gas dissolved in the liquid showing larger harmonic periods and shorter waiting times with decrease in the contact line pinning force by approximately 7–44% in the presence of air when compared to nitrogen. Last during oscillations, bubble leaping phenomenon was observed as a consequence of the interaction between the jet flows above the oscillating bubble.