The prediction of vibration fatigue life of leads and solder joints at low excitation from that obtained during high-level testing is possible but the extrapolation exponent depends not only on the S- N curve of the failed material, but also on the type of excitation and on whether failure is due to component or to support resonance. For single-frequency excitation the exponent for copper lead-wire failures is 8 if the circuit board resonates, 3.2 or, more realistically, 2.6 if the forcing frequency is constant at the initial value of component resonance, and 1.5 if it tracks the component resonance. For swept frequency the exponent is approximately 8 if failure is due to board resonance, 2.3 if due to component resonance, and this difference prevents extrapolation from swept-frequency tests which in the one sweep cover both component and support resonances. A similar problem exists for broadband random excitation. For 50/50 solder joints the exponent was 5.6 for non-resonant excitation, failure times being approximately log-normally distributed. The resonant frequency of components drops as vibration damage accumulates in the leads. The chenge in f n can serve as a measure of damage before fracture occurs, but also leads to incorrect, optimistic conclusions from fixed-frequency, initially resonant, testing, owing to the component's detuning.
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