The study evaluated copper, boron, and silicon release from wood samples treated with sol-gel formulations based on tetraethoxysilane (TEOS) and 3-aminopropyltriethoxysilane (APTES) functionalized with copper (II) chloride and boric acid, respectively. The adopted leaching procedure was Japanese protocol JIS K 1571 (2004). Inductively Coupled Plasma Atomic Emission Spectroscopy (ICP-AES) and Electron Spray Ionization Mass Spectrometry (ESI-MS) were employed for analyzing the leached solutions. The obtained results highlighted the important role of the amine function that was derived from the APTES precursor, in anchoring both copper and boron through coordinative and ionic interactions, respectively. In fact, copper formulations with TEOS alone (without APTES) showed higher copper leaching. In contrast, the silicon leaching was decreased due to better siloxane reticulation performed by TEOS alone. In addition, ageing (two months) of the samples treated with APTES containing formulation TEOS/APTES/Cu 10:1:0.2 resulted in a reduction of copper leaching (from 27% in the fresh samples to 7% in the aged ones), which was attributable to increased efficiency of inorganic sol-gel polymerization. The TEOS/APTES/B 1:1:0.2 formulation gave a leaching value of 20%, which was lower in comparison with the values reported in previous literature.