In recent years, there has been increasing interest in the demand for heat dissipation of electronic devices. Constructing micro/nanostructures and using nanofluid for the pool boiling heat transfer have proved to be a notoriously effective method to increase the critical heat flux (CHF) as well as the heat transfer coefficient (HTC). When the tested samples with micro/nanostructures are soldered to the upper of the heated copper block, the CHF boiling curves of the tested samples always shift right, which may be caused by the thermal contact resistance (TCR) from the soldering interface. However, it is rarely for the research to be reported the effect of the thermal contact resistance on the pool boiling heat transfer performance. This paper highlights the effect of the TCR on the CHF and HTC for pool boiling heat transfer by comparing the boiling curve of the non-soldering, the soldering, and the Rohsenow curve. The relationship between the difference in temperature with increased heat flux is established by measuring the TCR of the soldering interface, and the relationship at the different soldering interface morphology has been explored. The results show that the CHF boiling curve with soldering shift right 106–144 % than that of the non-soldering, and the HTC decreases by 45.6–63.5 %. The shifted boiling curve could be corrected by the relationship between the TCR with increased heat flux. However, the boiling curve cannot be corrected by the relationship when the soldering interface has voids. This work demonstrates that the deviation between the boiling curve of soldering with the boiling curve of non-soldering is universal for engineering applications by comparing similar studies. Regardless of whether soldering is used in pool boiling heat transfer experiments, the Rohsenow curve is still an important reference, but the effect of TCR must be considered in the pool boiling curve of soldering.