Bismaleimide-triazine Resin Research Articles

Design and manufacturing of resistive wall mode control coil of JT-60SA

Resistive wall mode control coils (RWMCs) will be installed in the vacuum vessel of JT-60SA. Since 200 °C baking of vacuum vessel on JT-60SA is performed to remove the impurity in the plasma facing components, in-vessel components must be made with heat-resistant materials such as metal and ceramic or must be cooled with water. We looked for the heat-resistant organic insulator for JT-60SA RWMC and performed the heat resistant test for several resins. However, no resin passed the test (Sukegawa et al., 2015). We again performed the heat resistant test of several organic insulator in the circumstances without air and finally found that the some Bismaleimide–Triazine (BT) resin has enough heat resistance without air. We designed the eight-turn RWMC with the BT resin. Based on this design, the specification of RWMC and power supply requirement are decided. For the design of RWMC, the finite element (FEM) analysis of electromagnetic force during disruption and thermal stress during baking and operation were performed. Manufacturing of the RWMC has already launched.

A highly-crosslinked phthalonitrile modified bismaleimide-triazine resin for PCB substrates: The synergistic effect on curing behavior and properties

In view of the problems of difficult processing and poor toughness, bismaleimide-triazine (BT) resin was modified by the 4-(4-amino-phenoxy)phthalonitrile (4-APN). The effect of 4-APN on the curing behavior of BT resin was investigated, followed by the calculated activation energy. The possible curing mechanism of this ternary system was also proposed, with the further study of the relationship between chemical structures and properties. The results showed that 4-APN can increase the reactivity and decrease the curing temperature of BT resin. Meanwhile, due to the fact that 4-APN exerted a thermal synergistic curing effect on the BT resin, poly(BT/APN)s with a high crosslinking density exhibited the superior overall performance. Concretely, the high heat-resistance of poly(BT/APN)s was displayed, especially the glass transition temperature up to 347 ℃ of poly(BT/30APN). More intriguingly, poly(BT/APN)s with a high breakdown strength possessed better insulation properties, and the dielectric constant and loss reduced to 3 and 0.005 (1 MHz), respectively, while remaining a good stability at high temperature. Additionally, the moisture resistance and toughness of poly(BT/APN)s were also significantly improved. Based on these merits, poly(BT/APN)s can be considered as an ideal material for microelectronics.

Improving the delamination bridging performance of Z-pins through the use of a ductile matrix

This paper presents a characterisation of the effect of varying the polymer matrix in Z-pin through-thickness reinforcement in pre-preg based laminates. Four matrix systems of increasing elongation at break are considered, namely: 1) a low glass-transition temperature (LTG) epoxy; 2) a high glass-transition temperature (HTG) epoxy; 3) a bismaleimide triazine (BT); 4) a bismaleimide (BMI). The last matrix is that used in commercially available Z-pins. The manufacturing of T300 carbon-fibre Z-pins employing the first three matrices via micro-pultrusion is discussed. The BT resin is considered as a benchmark for the manufacturing process. A preliminary screening of the mode II bridging performance of through-thickness reinforcement manufactured using the three matrix systems is carried out. A novel experimental set-up based on an acrylic glass carrier, which allows the failure mode of the through-thickness reinforcement to be visualised, is introduced. The preliminary tests reveal a 7-fold increase of work-to-failure for the candidates with the highest elongation at break, LTG Z-pins, compared to their baseline BMI-based counterparts. LTG Z-pins were then inserted in quasi-isotropic E-glass epoxy laminates and their bridging performance characterised across the full mode-mixity range. The experimental results indicate that LTG Z-pins provide a peak mode I interlaminar fracture toughness of the order of 40 kJ/m2, compared to the 28 kJ/m2 yielded by BMI Z-pins. Moreover, the transition from full pull-out to rupture for the LTG pins occurs at a mode-mixity of 0.55, whereas BMI Z-pins start failing at a mode-mixity of 0.2. The superior bridging performance of the LTG Z-pins is correlated with the enhanced ductility and toughness of the constituent matrix via detailed fractographic observations.

A novel low-dielectric nanocomposite with hydrophobicity property: Fluorinated MOFs modified bismaleimide-triazine resin

A fluorine-functionalized zirconium-based metal organic framework (F4-UiO-66) was successfully synthesized via the reflux method, and the F4-UiO-66/BT nanocomposites of F4-UiO-66 modified bismaleimide-triazine resin (BT resin) were prepared. The effects of F4-UiO-66 on the crosslinking structure and properties of BT resin were evaluated for the first time. The investigations showed that the active H in F4-UiO-66 effectively catalyzed the self-polymerization of cyanate ester and promoted the formation of more rigid triazine rings which increased the initial storage modulus of nanocomposites. But the steric hindrance effect of F4-UiO-66 reduced the crosslinking density, which increased the free volume of nanocomposites. So, the dielectric constants of the nanocomposites were significantly reduced with the increase of F4-UiO-66 for the reduction of molecular polarization due to triazine rings and C–F bonds, and the decrease of polarization density caused by the nanopores and free volume. In addition, F4-UiO-66 was evenly dispersed in BT resin. On the basis of maintaining the thermal stability, the toughness and hydrophobic properties of nanocomposites were also enhanced. This study provided a novel approach for low-dielectric materials with hydrophobic property through the synergy between the nanopores and the C–F bonds.

New Types of Organic Resins for Insulation of Warm Magnets

Two types of new organic resins are under development at KEK for the magnet insulation materials. One is Cyanate ester resins which will be used in warm magnet insulation instead of usual epoxy resins. One of its important characteristics is its radiation hardness. We have already developed a new type of the insulation resin based on Bismaleimide-Triazine (BT) resin. Most magnets of J-PARC, Japanese high intensity proton accelerator complex, were assembled with BT resin. However sometimes thermal characteristic of the BT resin was too keen at the curing stage. Therefore somewhat moderate thermal characteristics of Cyanate ester resin may be superior as magnet insulation resin. R&D work of Cyanate ester resin has started at KEK and good results as magnet insulator have already been obtained. Another trial is to utilize resins which can be hardened by Ultra Violet light. Therefore the resin is called as “UV-resin”. Their very important characteristic is its rapidness to be hardened. Some UV-resin will be hardened within several second from smooth liquid by irradiation of UV-LED light. This phenomenon will help us to assemble warm magnet coils with very much complicated shape. However its mechanical strength and radiation hardness etc. must be investigated.

Tailoring the structure of aligned carbon nanotube bundle by reactive polymer for strengthening its surface interaction with thermosets and the excellent properties of the hybrid thermosets

Aligned carbon nanotube bundles (ACNTB) with multi-level hierarchical structures were tailored by reactive polymer vinyl-terminated polyphenylene ether (PPE) for the excellent integrated property of bismaleimide-triazine (BT) resin. The PPE-tailored ACNTB (ACNTB@PPE) has increased strength for the penetration of PPE into porous ACNTB strengthening the interaction between each CNT. The strong interaction at the interface of ACNTB@PPE and BT matrix can be created owing to the reaction of the vinyl group in PPE on the surface of ACNTB and maleimide group in BT. BT with 2% ACNTB@PPE composite shows the optimal flexural strength, fracture toughness and tensile strength, which are 88%, 115% and 77% higher than those of BT, respectively. The introduction of ACNTB@PPE slightly enhances the thermal property of BT. ACNTB@PPE can significantly improve the flame retardancy of BT composites. As compared to individual ACNTB, ACNTB@PPE effectively improves the integrated property of BT composites mainly due to the chemical interaction at the interface of ACNTB@PPE and BT matrix and the increased interaction between each CNT.

High performance fluorinated Bismaleimide-Triazine resin with excellent dielectric properties

A series of high performance fluorinated bismaleimide-triazine (BT) resins were prepared from 2, 2′-Bis(4-cyanatophenyl) propane (CY-1), 2′-Bis[4-(4-maleimidephenoxy) phenyl] hexafluoropropane (6FBMP) and diallyl hexafluorobisphenol A (6FDABPA). The effect of the fluorinated groups on the curing behavior, thermal stability, mechanical and dielectric properties was studied. Dielectric constant of the fluorinated BT resin was 2.89–2.94 and the dielectric loss could reach 0.002–0.004 at 1 MHz, which were dramatically improved compared with the reported cyanate ester resins. The fluorinated BT resins also exhibited excellent thermal stability, with a high glass transition temperature above 220 °C and 5% weight loss thermal decomposition temperature (Td5) exceeding 400 °C. Meanwhile, the impact strength of the fluorinated BT resins could reach 20 kJ/m2 and the flexural strength was 120 MPa. Small dipole, low polarizability, high bond energy of the carbon-fluorine (C-F) bond and symmetrical hexafluoroisopropyl group were the reason for the enhanced properties. This work suggested that the fluorinated BT resins had great potential to be used as the matrix of the advanced structural and functional composites.

Influence of gamma ray irradiation on thermal conductivity of bismaleimide-triazine-based insulation tape at cryogenic temperature

Recent accelerator-based experiments for particle physics require the superconducting magnets that can be operated under high radiation environment. An electrical insulation tape, which is composed of polyimide film and a boron free glass fabric pre-impregnated with epoxy resin blended with bismaleimide-triazine resin, is developed to enhance the radiation tolerance for superconducting magnets. Since the thermal conductivity of insulation tape is one of key parameters that affects the coil temperature during the operation, the influence of gamma-ray irradiation on the thermal conductivity of the insulation tape is investigated with a maximum dose of 5 MGy. The thermal conductivity is measured at cryogenic temperature from 5 K to 20 K cooled by a Gifford-McMahon cryocooler. By comparing the thermal conductivity before and after the gamma ray irradiation, no significant degradation on the thermal conductivity has been observed.

Synthesis of functionalized GO for improving the dielectric properties of bismaleimide-triazine resin

A type of functionalized graphene oxide (GO), named GO-POSS-BPA, was synthesized by nucleophilic substitution reaction with chloropropyl polyhedral oligomeric silsesquioxanes (POSS) and bisphenol A (BPA). Subsequently, the GO-POSS-BPA was added into bismaleimide-triazine (BT) resin to improve dielectric properties of bismaleimide-triazine resin. The structure of GO-POSS-BPA was characterized by Fourier-transform infrared spectra (FTIR), X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD) and transmission electron microscopic (TEM). The effects of GO-POSS-BPA on the dielectric, mechanical, thermal and water resistant properties of BT resin were investigated systematically. The results show that, GO-POSS-BPA decreased the dielectric constant and dielectric loss of BT resin over the testing frequency from 10 to 50 MHz, also enhanced the stability of dielectric constant. Meanwhile, the appropriate content of GO-POSS-BPA can enhance the impact and flexural strengths of BT resin to a certain extent. In addition, GO-POSS-BPA can also enhance the thermal stability and moisture resistance of BT resin.

Development of high radiation-resistant glass fiber reinforced plastics with cyanate-based resin for superconducting magnet systems

Glass fiber reinforced plastics (GFRPs) with cyanate ester resin/epoxy resin, bismaleimide resin/epoxy resin, and bismaleimide-triazine resin as matrices were developed for the superconducting magnet systems used in high intensity accelerators. The radiation resistance of these GFRPs was evaluated based on their gas evolution and changes in their mechanical properties after gamma-ray irradiation with dose of 100MGy in vacuum at ambient temperature. After irradiation, a small amount of gas was evolved from all of the GFRPs, and a slight decrease in mechanical properties was observed compared with the conventional epoxy resin-GFRP, G10. Among the GFRPs, the smallest amount of gas (6×10−5mol/g) was evolved from the GFRP with the bismaleimide-triazine resin, which also retained more than 88% of its flexural strength after 100 MGy irradiation; this GFRP is thus considered the most promising material for superconducting magnet systems.

Highly mechanical strength and thermally conductive bismaleimide–triazine composites reinforced by Al2O3@polyimide hybrid fiber

Bismaleimide–triazine (BT) resins have received a great deal of attention in microelectronics due to its excellent thermal stability and good retention of mechanical properties. Thereafter, developing BT based composites with high mechanical strength, thermal conductivity and dielectric property simultaneously are highly desirable. In this study, one hybrid fiber of Al2O3 nanoparticle (200nm) supported on polyimide fiber (Al2O3@PI) with core–shell structure was introduced into BT resin to prepare promising Al2O3@PI–BT composite. The results indicated that the resultant composites possessed high Young’s modulus of 4.06GPa, low dielectric constant (3.38–3.50, 100kHz) and dielectric loss (0.0102–0.0107, 100kHz). The Al2O3@PI hybrid film was also conductive to improve thermal stability (Td5% up to 371°C), in-plane thermal conductivity (increased by 295% compared to that of the pure BT resin). Furthermore, the Al2O3@PI–BT composite were employed to fabricate a printed circuit substrate, on which a frequency “flasher” circuit and electrical components worked well.

Tuning the mechanical properties of glass fiber-reinforced bismaleimide–triazine resin composites by constructing a flexible bridge at the interface

We demonstrate a new method that can simultaneously improve the strength and toughness of the glass fiber-reinforced bismaleimide–triazine (BT) resin composites by using polyethylene glycol (PEG) to construct a flexible bridge at the interface. The mechanical properties, including the elongation, ultimate tensile stress, Young’s modulus, toughness and dynamical mechanical properties were studied as a function of the length of PEG molecular chain. It was found that the PEG molecule acts as a bridge to link BT resin and glass fiber through covalent and non-covalent bondings, respectively, resulting in improved interfacial bonding. The incorporation of PEG produces an increase in elongation, ultimate tensile stress and toughness. The Young’s modulus and Tg were slightly reduced when the length of the PEG molecular chain was high. The elongation of the PEG-modified glass fiber-reinforced composites containing 5 wt% PEG-8000 increased by 67.1%, the ultimate tensile stress by 17.9% and the toughness by 78.2% compared to the unmodified one. This approach provides an efficient way to develop substrate material with improved strength and toughness for integrated circuit packaging applications.

Effect of functionalized multiwall carbon nanotubes on the curing kinetics and reaction mechanism of bismaleimide–triazine

Functionalized multiwall carbon nanotubes (f-MWCNTs) with varying functionalization degrees were prepared by chemical methods. The effect of f-MWCNTs on the cure kinetics of bismaleimide–triazine (BT) resin was studied through nonisothermal differential scanning calorimetry (DSC) methods. The reaction activation energy (Eα) was determined by Flynn–Wall–Ozawa method. The results show that f-MWCNTs have more acceleration ability than pristine MWCNTs, due to more groups on the surface of f-MWCNTs than that of pristine MWCNTs. The activation energy was decreased from a value of 91.3 kJ mol−1 for the neat BT resin to 74.2 kJ mol−1 at the small mass loading (1.0 %) of f7-MWCNTs. The effect of f-MWCNTs on the reaction mechanism has been investigated. It shows that the f-MWCNTs accelerate the cure reaction of BT resin by providing the Lewis acids (H+) to make the “Diels–Alder” reaction and “ENE” reaction of BT resins more efficient. These findings offer useful insights into the cure technology of thermosetting resin filled with f-MWCNTs, without negative effect on the cure reaction.

Properties of the glass fibre/interpenetrating polymer network composites based on novel naphthalene-contained bismaleimide and cyanate resin

To obtain attractive properties, the structure of interpenetrating polymer networks (IPNs) is made from 2,7-bis (4-maleimidophenoxy) naphthalene (BMPN) and 2,7-dihydroxynaphthalene dicyanate (DNCY) containing 0.11 mmol/mol Fe(AcAc) 3 and 2% nonylphenol. The glass fibre reinforced composites are made from the novel IPNs bismaleimide-triazine (BT) resin containing BMPN and DNCY. Two T g s and high storage modulus are shown in DMA curves of these composites. Two glass transitions could be detected between 250°C and 350°C, and the storage modulus show higher than 19,000 MPa. Opposed to composites of co-cure BT resin, the flexural property, dielectric property and moisture uptake value of composites are improved obviously due to the formation of IPNs structure for the composites. This composites show good flexural property, low dielectric constants (DC) and low moisture absorption.

Preparation and properties of siloxane polyimide films containing silver nanoparticles and microparticles as conducting adhesive films

Electrically conducting adhesive films containing silver nanosized particles (AgNPs) were prepared using siloxane polyimide resin (SPI), and their physical properties were investigated. AgNPs with diameters of ca. 6 nm were prepared using oleylamine as a stabilizer. A mixture of the AgNPs and SPI was vigorously stirred, and cast on a polyethylene terephthalate support. Films were then fabricated using a doctor blade method. The heat resistance of the SPI film containing 60 wt% AgNPs was 35 °C higher than that of the SPI film without AgNPs. In addition, epoxy composite SPIAg (Epo-SPIAg) films containing a mixture of AgNPs and micro-sized silver flakes were prepared. Inclusion of AgNPs in these films strengthened their adhesion to silicon or bismaleimide triazine resin substrates. The glass transition temperature of the Epo-SPIAg films containing AgNPs was slightly higher than that of the film containing only micro-sized silver flakes.

0.25 mm 초박형 두께를 가지는 회로기판형 리드프레임 백색 LED 램프

0.25 mm thickness super thin surface mounted device LED Lamp is developed with PCB type lead frame in which BT (Bismaleimide Triazine) resin is used. BT resin is removed by a laser beam in order to reduce the thermal resistance below <TEX>$1\;^{\circ}C/W$</TEX> and transfer molding is used with silicone. Compared to conventional 0.4 mm thickness LED lamp, the developed LED lamp can be derived in high current and the luminance of the LED lamp is increased up to 240 mA.

The effects of copper oxides on the thermal degradation of bismaleimide triazine prepreg

The effect of copper oxides on the thermal degradation of bismaleimide triazine (BT) prepreg has been studied with infrared spectroscopy (IR), attenuated total reflection infrared spectroscopy (ATR), and thermogravimetric analysis (TGA). The results of IR and ATR analyses indicate that the thermal degradation in the bulk BT is mainly from the epoxy constituent while that in the copper oxides contacted BT happens not only from the epoxy but also from the more stable cyanate ester constituent. From ATR, it is concluded that the BT contacted with copper oxides have a different degradation behaviour from the bulk BT and this surface related effect can extend to two microns deep into the BT prepreg from the BT/Cu interface. This is partly due to the composition difference in the BT/Cu interfaces resulting from the preferential adsorption on copper surfaces. The TGA results indicate that the BT contacted with the copper oxides degrade at a lower temperature than the bulk BT resin, and the presence of copper oxides would also change the degradation mechanisms of the BT resin.

The Effects of Copper Oxides on the Curing Behaviors of Bismaleimide Triazine Prepreg

AbstractThe effect of copper oxides on the curing behaviors of the bismaleimide triazine (BT) prepreg is studied with infrared spectroscopy (IR), attenuated total reflection infrared spectroscopy (ATR), and X‐ray photoelectron spectroscopy (XPS). The result of IR analyses indicates that there is a concentration distribution present in the prepreg surface layer and the outer surface layer contains less cyanate, imide, and epoxide but more triazine groups than the inner layer. From ATR, it is concluded that the cuprous oxide attracts more cyanate ester resins but less bismaleimide resins from the prepreg to its surface than the cupric oxide. The copper surface affects the curing extent of the BT resin in contact and the cupric oxide has a more pronounced effect than the cuprous oxide, and this surface effect can extend to at least two microns deep into the BT prepreg from the contacted interface. The XPS results confirm that the BT/CuO interface contains more thermally stable and polar functional groups than the BT/Cu2O interface, and both two copper oxides attract only a small amount of brominated epoxy resin onto their surfaces. These results are attributed to the difference in preferential adsorptions and catalytic curing effects of two copper oxides on the BT prepreg in contact. The intensity changes of IR bands obtained from BT prepreg during cure.magnified imageThe intensity changes of IR bands obtained from BT prepreg during cure.

Reliability of the laminate from advanced COPNA-resin/E-glass fabrics system

Reliability of the advanced COPNA-resin laminate which exhibited high glass transition temperature (Tg) at 255/spl deg/C, low coefficient of thermal expansion (CTE) at 5-7 ppm (xy-axis) and at 29 ppm (x-axis) was evaluated by temperature-humidity-bias (THB) test, pressure-cooker (PC) test, heat-shock test, heat-cycle test, and conductive anodic filaments (CAF) test. The laminate exhibited higher reliability than the FR-4 graded epoxy-resin laminate in every test, and exhibited higher reliability than the bismaleimide-triazine resin laminate in the THB test, heat-shock test, and heat-cycle test. The high reliability of the advanced COPNA-resin system is considered to be due to its high Tg and small CTE. In this paper, low CTEs of the advanced COPNA-resin laminate are also theoretically studied by using a model for uni-axially reinforced composites.

A CPU chip-on-board module

A CPU chip-on-board module for low and midrange computers is described. The module consists of a CPU bare chip, 24 SRAM's packaged in SOJ packages, and some decoupling capacitors. The module substrate is a printed circuit board (PCB) made of bismaleimide-triazine resin. The module (156 mm/spl times/58 mm) consists of four signal metal layers and four power/ground metal layers. A square clearance hole (17 mm/spl times/17 mm) for the CPU is formed in the central part of the PCB. A thermal spreading metal is glued to the PCB from the rear side, covering the square hole, and the CPU chip is die-bonded onto the metal plate. The thermal resistance can be made smaller than 2/spl deg/C/W with 0.4 m/s of wind velocity. Numerical analysis of electrical characteristics of the module shows that it can reduce signal delay time from the CPU to cache memories by 10% compared with that of a daughter board type module with the CPU packaged in a pin-grid array package. It is estimated that simultaneously switched noise can be reduced by 60% from that of the daughter board type module.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>