Bi-2212 Phase Research Articles

Enhanced magnetic properties and leakage current mechanism in bismuth lanthanum ferrite thin films coupled with impedance and magnetic studies

A highly crystalline and pure phase Bi0.993La0.007FeO3 (BLFO) thin films have been grown using a pulsed laser deposition technique. The structural analysis confirmed the thin film is well crystallized with a rhombohedral crystal structure with an R3c space group. The BLFO phase and composition are also confirmed by transmission electron microscopy and EDAX analysis. The surface chemistry of thin films, analysed by X-ray photon spectroscopy, reveals Fe's presence in Fe3+ and Fe2+ states. At RT, the deposited film exhibited high dielectric permittivity (∼4 × 102) and low dielectric loss (∼10−1). The isothermal magnetization on highly oriented (001)-MgO and LaAlO3 (LAO) substrates is investigated. The response is compared to the randomly oriented polycrystalline films on low-cost substrates (Pt/TiO2/SiO2/Si and n-type Si substrate). The enhanced saturation magnetization of 57 emu/cm3 and 36 emu/cm3 at 10 K and 300 K are observed at 2.5 kOe applied field for the film grown on the LAO substrate. Additionally, the low leakage current density of the film is obtained around ∼1 × 10−7 A/cm2 at a field of 100 kV/cm. Acquiring single-phase BLFO thin films with enhanced electrical and magnetic properties can be relevant in designing multiferroic materials for multiple-state memories, magnetic field sensors, and spintronics applications.

In Situ Atomic-Scale Deciphering of Multiple Dynamic Phase Transformations and Reversible Sodium Storage in Ternary Metal Sulfide Anode.

Ternary metal sulfides (TMSs), endowed with the synergistic effect of their respective binary counterparts, hold great promise as anode candidates for boosting sodium storage performance. Their fundamental sodium storage mechanisms associated with dynamic structural evolution and reaction kinetics, however, have not been fully comprehended. To enhance the electrochemical performance of TMS anodes in sodium-ion batteries (SIBs), it is of critical importance to gain a better mechanistic understanding of their dynamic electrochemical processes during live (de)sodiation cycling. Herein, taking BiSbS3 anode as a representative paradigm, its real-time sodium storage mechanisms down to the atomic scale during the (de)sodiation cycling are systematically elucidated through in situ transmission electron microscopy. Previously unexplored multiple phase transformations involving intercalation, two-step conversion, and two-step alloying reactions are explicitly revealed during sodiation, in which newly formed Na2BiSbS4 and Na2BiSb are respectively identified as intermediate phases of the conversion and alloying reactions. Impressively, the final sodiation products of Na6BiSb and Na2S can recover to the original BiSbS3 phase upon desodiation, and afterward, a reversible phase transformation can be established between BiSbS3 and Na6BiSb, where the BiSb as an individual phase (rather than respective Bi and Sb phases) participates in reactions. These findings are further verified by operando X-ray diffraction, density functional theory calculations, and electrochemical tests. Our work provides valuable insights into the mechanistic understanding of sodium storage mechanisms in TMS anodes and important implications for their performance optimization toward high-performance SIBs.

Effect of incident laser wavelength on structural and morphological properties of Bi1.6Pb0.4Sr2Ca2Cu3Oy films grown by pulsed laser deposition

A Bi1.6Pb0.4Sr2Ca2Cu3Oy superconductor target was obtained by a solid-state reaction at 860 °C by 130 h. Afterward, Bi1.6Pb0.4Sr2Ca2Cu3Oy thin films were grown by pulsed laser deposition at room temperature, from pellets of the synthesized target, on (111) silicon substrates. Bi1.6Pb0.4Sr2Ca2Cu3Oy films were deposited using an Nd:YAG laser with two different incident wavelengths (532 and 1064 nm) and by varying the distance between the target and the substrate: 20, 25, and 30 mm. X-ray diffraction results showed that Bi1.6Pb0.4Sr2Ca2Cu3Oy films were obtained with Bi-2223 and Bi-2212 superconductor phases.

Enhancements of critical current density in Bi1.6Pb0.4Sr2Ca2Cu3O10+δ superconductors by additions of SnO2 nanoparticles

The impact of adding SnO2 nanoparticles on the enhancements of critical current density (Jc) of the Bi1.6Pb0.4Sr2Ca2Cu3O10+δ superconductors was studied. Polycrystalline superconductors with stoichiometry of (Bi1.6Pb0.4Sr2Ca2Cu3O10+δ)1−x(SnO2)x where was x was ranged from 0.000, 0.002, 0.004, 0.006, 0.008 to 0.010 were made through traditional solid state reaction technique. X-ray diffraction data revealed that all fabricated samples consisted of Bi-2223 and Bi-2212 superconducting phases. The volume fraction of the Bi-2223 phase decreased with SnO2 addition. Analyses of textural structure using scanning electron microscopy data evidenced a clear decrease in grain orientation and porosity with increased doping levels. SnO2 presence in connection to Bi-2223 deceleration reduced the critical temperature. Values of Jc deduced from the magnetization hysteresis loops measured at different temperatures of 35 K, 45 K, 55 K, 65 K were found to enhance for the SnO2 added samples. In the x = 0.002 samples, the field dependent Jc achieved its maximum values. In order to have a deeper understanding in the improvements of flux pinning properties, small and large bundle fields were determined by using the collective pinning theory. The obtained values indicate the expansion of the two corresponding regimes with appropriate. By analyzing the dependence of normalized Jc versus normalized critical temperature, the dominant flux pinning mechanisms in all samples were consistent with δl pinning. Besides, the addition of SnO2 nanoparticles was likely to produce pinning centers in form of core point as evidenced by using the Dew–Hughes model.

Spin-momentum locking and quantum anomalous Hall effect in d+id-density wave ordered pseudo gap phase of Bi2212

We model Bi 2 Sr 2 CaCu 2 O 8 + δ (Bi2212) bilayer system by a time reversal symmetry (TRS) and inversion symmetry (IS) broken Bloch Hamiltonian H. The pseudo-gap phase of the bilayer is assumed to be chiral d-density wave ordered. One of the focal points of the paper is the theoretical study of the spin-momentum locking (SML), due to the presence of a strong spin–orbit coupling in Bi2212, reported earlier in this phase in a spin-and angle-resolved photoemission spectroscopic measurement. The non-trivial spin texture in k -space, which is an outcome of the broken IS for the bilayer system, is found tuneable by electric field (and also by intercalation). We also show that this system exhibits anomalous quantum Hall effect due to the broken TRS and the presence of a strong spin–orbit coupling. • The emergent quantum anomalous Hall state due to the time reversal asymmetry. • The tuneable non-trivial spin-texture by electric field and intercalation. • The CDDW order is the raison d’etre of the freezing of anti-nodal quasi-particles. • The spin current density is a skew matrix only at the anti-nodal points. • The Majorana zero mode exists for the Zeeman field ⩾ a critical value.

Effects of Bi and Cu addition on mechanical properties of Sn9Zn alloy and interfacial intermetallic growth with Ni substrate

Sn9ZnxBixCu (x = 0, 1.0, 2.0, 3.0 and 4.0 wt%) solder alloys were prepared by adding different contents of Bi and Cu elements, and the effects of Bi and Cu addition on the mechanical properties, wettability, and interfacial intermetallic compound (IMC) layer were researched. The addition of Bi and Cu can significantly improve the mechanical properties and creep resistance of the alloy. When the addition of Bi and Cu reaches 2 wt%, small Bi phases are dispersed in the matrix, and moderate Cu5Zn8 phases appear, which strengthens the solder matrix. The ultimate tensile strength (UTS) of the Sn9Zn2Bi2Cu alloy reaches 51.01 MPa, which is 149.32% higher than that of the Sn9Zn alloy, and the elongation reaches 26.56%. Nanoindentation results show that the holding displacement of the Sn9Zn4Bi4Cu alloy decreased by 28.48% compared with that of the Sn9Zn alloy at a loading rate of 0.1 mN/s. In addition, proper addition of Bi and Cu can improve the wettability of the solder alloy and inhibit the growth of interfacial intermetallic compounds (IMCs) between the solder and Ni substrate. When the reflow time reaches 40 min (min), the interfacial IMC thickness of the Sn9Zn2Bi2Cu/Ni solder joint is 1.93 µm, which is 46.09% smaller than that of the Sn9Zn alloy. Moreover, the shear strength of the Sn9Zn2Bi2Cu/Ni solder joint increases by 33.3%, reaching the maximum value (38.76 MPa). When the Bi and Cu addition reaches 2 wt%, the wetting area reaches a larger value (13.525 mm2), which is 28.35% higher than that of Sn9Zn alloy.

Microstructural Characterization of Sn57Bi1Ag Solder Alloy Joints

Sn57Bi1Ag alloy system meets the basic solderability requirements while reliability of solder is less known. The presence of intermetallics that form at the solder-joint interface and in the bulk solder is the primary reason to cause joint failure on simple loading. Furthermore, dissolution of soldered surface (copper, gold, silver, nickel, etc.) into the solder during reflow alters the composition of the interface leading to the formation of intermetallic phases. The present paper addresses the characterization of low temperature Sn57Bi1Ag solder alloy, its joint interface metallurgy and integrity. Generally, formation of intermetallic phases (Cu3Sn, Cu6Sn5, Ag3Sn, AuSn2, Ni3Sn4, etc.) at the solder-pad interface is in the range of 0.3 to 1.0µm. On thermal ageing at 75°C (0.55Tm), the intermetallic phases grow further up to 2.3µm, particularly CuSn and AuSn phases. In addition, to distributed eutectic tin (Sn) and bismuth (Bi) phases, fine eutectic tin and bismuth phases and primary tin (β-Sn) are also observed. Coarsening of Bi and Sn phases is noticed on thermal ageing (75°C and 100°C). The rate of coarsening increases with the supply of thermal energy promoting Sn/Bi atomic diffusion and movement of eutectic boundaries (grain boundaries). However, the Sn-Bi interface is stable without any significant changes in eutectic structures and its morphologies. The mechanical drop test of the Sn57Bi1Ag solder joint passed 120 drops, characteristic life corresponds to the number of drops for a failure of 63.2%. Evaluated as per JESD22-B111 specification to a maximum peak acceleration of 1500G and half-sine shock pulse duration of 0.5 milliseconds, soldered the alloy to copper OSP surface. The solder joint also passed 1200cycles evaluated at -40 to +125°C. Electrical connectivity of the solder joints soldered to ENIG plated test boards is recorded continuously. Crystallographic orientation of Sn and Bi second phases is observed using electron back scattered diffraction (EBSD) of thermal aged solder joints and are also presented in this paper.

A Low-Cost Burn-In Tester Architecture to Supply Effective Electrical Stress

Burn-In test equipment usually owns extensive memory capabilities to store pre-computed patterns to be applied to the circuit inputs as well as ad-hoc circuitries to drive and read the DUT pins during the BI phase. The solution proposed in this paper dramatically reduces the memory size requirement and just demands a generic microcontroller unit (MCU) equipped with a couple of embedded processors, some standard common peripheral units, and a few KB memories. Moreover, the proposed Burn-In tester could be integrated into a System Level Test equipment which is typically based on MCUs to communicate functionally with the DUT. This paper provides full details about the architecture of such a low-cost innovative tester, which can supply the DUT with unlimited pseudo-random patterns created autonomously by the MCU firmware from any selected seed. The tester prototype developed to collect experimental results includes a low-cost System-on-Chip based on a multi-core MCU and a set of peripheral cores, encompassing timers and Direct Memory Access modules. The tester prototype is used to stress an automotive chip accounting for about 20 million gates, 700 thousand scan flip-flops, and several scan modes. The combination of pseudo-random pattern generation with the ability to control different scan and Design for Testability (DfT) modes, including LBIST, permits to reach a higher coverage of stress metrics than by the application of a limited set of pre-computed ATPG patterns. The toggle coverage level reached is up to 95.89%. The application speed achieved by the tester with non-optimized connections is up to about 10MHz.

PAINTED POTTERY FROM OZHEVE-OSTRIV SETTLEMENT AND ITS FACTOR IN THE UNDERSTANDING OF CULTURAL CHANGES IN THE POPULATION OF CUCUTENI-TRYPILLIA CULTURAL COMPLEX OF BI STAGE

The characteristics of the painted pottery of the Ozheve-ostriv settlement is considered in the paper. Despite the small percentage of painted pottery among the ceramic complex of the Ozheve-ostriv this category is extremely important for determining the place of the settlement in the cultural-chronological structure of the Cucuteni-Trypillia cultural complex. By techniques all the painted vessels of the settlement have common features with the exception of the system of styles — the sequence of applying paint to the surface of the vessel. The styles identified at the settlement are characterized as synchronous, taking into account that features characteristic of the previous phase of the period (Cucuteni A3) and the synchronous phase (Cucuteni A4) have survived. Some of the forms presented at the settlement are also characterized by the forms of the previous phase, although new ones also appear (pear-shaped vessels with vertical crowns, helmet-shaped tires). With minor exceptions, the main stylistic features of the vessels in the form of ornamental schemes have also survived.
 Due to the comparison of this pottery with the sites of the stage BI, it is possible to attribute this settlement to the Northern Moldovan local variant of the late phase of the stage BI (Cucuteni A4). Local variants of this phase are also synchronous with the settlement of Ozheve-ostriv. The issue of the synchronicity of the settlement with other ones such as Corlăteni and Vorniceni, characteristic of Cucuteni AB1 settlements, is considered separately.
 It is proposed to assume a gradual resettlement of the population of the Cucuteni-Trypillia cultural complex to the territory of Middle Dniester region, in contrast to those processes of migratory «burst» that took place in the previous phase of the BI stage. In addition, attention is drawn to a certain «dependence» of cultural traditions on the region of the «core» of culture — Romanian Carpathian Region. The reasons for such dependence could be the general economic situation among the populations of the stage BI, when the population of the «core» of the culture could supply «prestige» objects made of copper in exchange for products of the raw material direction.

Microstructure changes in Sn-Bi solder joints reinforced with Zn@Sn particles in thermal cycling and thermomigration

BackgroundIn the field of electronic packaging, Sn-58Bi solder paste is a promising low-temperature option for step soldering. However, the tendency for the Bi-rich phase to coarsen and segregate poses a significant challenge to the long-term reliability of the solder joints. MethodsThe Sn coated Zn (Zn@Sn) core-shell particles were prepared through a chemical plating process and incorporated into the Sn-58Bi low-temperature solder paste to enhance its reliability. The microstructural and mechanical characteristics of the solder joints were evaluated under thermal cycling and thermomigration conditions to assess their long-term service reliability. Significant findingsThe addition of Zn lowers the nucleation energy and promotes the refinement of the eutectic structure, avoiding a significant reduction in shear strength after thermal cycling. In thermomigration, the heat transfer Q* of Bi is calculated to be 22.5 kJ/mol. The Zn-rich phases hardly move and are evenly distributed within the solder joints, acting like a barrier to prevent the Bi phase diffusing from the hot end to the cold end.

Excellent energy-storage performance in Bi0.5Na0.5TiO3-based lead-free composite ceramics via introducing pyrochlore phase Sm2Ti2O7

The comprehensive performance of ferroelectric ceramic materials is a significant factor limiting the practical application. In this work, a novel strategy of constructing diphase compounds is proposed to significantly enhance the energy storage properties of Bi0.5Na0.5TiO3-based ceramics. A composite ceramic of pyrochlore phase Sm2Ti2O7 modified perovskite phase Bi0.5Na0.5TiO3 is successfully prepared and systematically studied. As the concentration of Sm2Ti2O7 increases, the dielectric breakdown strength is greatly strengthened because of expanded band gap and shrunk grain size, and the relaxor behavior is enhanced due to the effect of linear character pyrochlore. As a result, the optimized composition demonstrates excellent energy storage properties including high recoverable energy storage density (Wrec) of 6.387 J/cm3 at 402 kV/cm, superior stability of temperature (<6% variation in − 120 ∼ 120 °C), frequency (∼4% variation in 5 ∼ 500 Hz) and cycling (∼2% variation within 106 cycles). Besides, fast discharge behavior of t0.9 ∼ 29.4 ns and high power density of 80.49 MW/cm3 at 200 kV/cm are also achieved. This study presents a novel strategy to enhance the performance of BNT-based materials through forming composite ceramic, which is anticipated to be a general method for other material systems as regards the design of advanced energy storage ceramics.

Study of Bond Formation in Ceramic and Composite Materials Ultrasonically Soldered with Bi-Ag-Mg-Type Solder.

This research aimed to study a Bi-Ag-Mg soldering alloy and the direct soldering of Al2O3 ceramics and Ni-SiC composites. Bi11Ag1Mg solder has a broad melting interval, which mainly depends on the silver and magnesium content. The solder starts to melt at a temperature of 264 °C. Full fusion terminates at a temperature of 380 °C. The microstructure of the solder is formed by a bismuth matrix. The matrix contains segregated silver crystals and an Ag (Mg, Bi) phase. The average tensile strength of solder is 26.7 MPa. The boundary of the Al2O3/Bi11Ag1Mg joint is formed by the reaction of magnesium, which segregates in the vicinity of a boundary with a ceramic substrate. The thickness of the high-Mg reaction layer at the interface with the ceramic material was approximately 2 μm. The bond at the boundary of the Bi11Ag1Mg/Ni-SiC joint was formed due to the high silver content. At the boundary, there were also high contents of Bi and Ni, which suggests that there is a NiBi3 phase. The average shear strength of the combined Al2O3/Ni-SiC joint with Bi11Ag1Mg solder is 27 MPa.

Field-induced reentrant insulator state of a gap-closed topological insulator ( Bi1−xSbx ) in quantum-limit states

In the extreme quantum limit states under high magnetic fields, enhanced electronic correlation effects can stabilize anomalous quantum states. Using band-tuning with a magnetic field, we realized a spin-polarized quantum limit state in the field-induced semimetallic phase of a topological insulator Bi_{1-x}Sb_x. Further increase in the field injects more electrons and holes to this state and results in an unexpected reentrant insulator state in this topological semimetallic state. A single-particle picture cannot explain this reentrant insulator state, reminiscent of phase transitions due to many-body effects. Estimates of the binding energy and spacing of electron-hole pairs and the thermal de Broglie wavelength indicate that Bi_{1-x}Sb_x may host the excitonic insulator phase in this extreme environment.

Reversible conversion–alloying of cobalt–bismuth oxide nanoneedles for long-life lithium storage anodes

Materials that undergo combined conversion and alloying reactions are promising as anodes for lithium storage application because they can accommodate multiple lithium ions. However, irreversible conversion reactions, large voltage hysteresis, poor rate capabilities, and low initial Coulombic efficiencies during continuous discharge–charge cycling make practical applications of conversion–alloying materials challenging. Herein, we present cobalt–bismuth oxide (CBO) nanoneedles, a new bimetallic material in which Li+-ion uptake proceeds stepwise, thus effectively suppressing volume expansion. During the initial lithiation stage, the CBO nanoneedles undergo a conversion reaction to form nanodomains of low-oxidation-state Coδ+ (δ ≤ 2) in a Li2O matrix. At the next potential platform, the Bi phase attracts Li+ ions via an alloying reaction, while the Coδ+/Li2O phase hinders excessive volume expansion. Consequently, the CBO electrode delivers a high reversible discharge capacity of 392 mAh g−1 at 50 mA g−1 for up to 100 cycles. Further, an ultrastable long-term capacity of 300 mAh g−1 at 250 mA g−1 is realized over 1000 cycles. The stepwise lithiation process decreases volume expansion significantly (by ∼10%), which leads to good cyclability. Owing to their ease of preparation and excellent performance characteristics, CBO nanoneedles are an attractive long-life anode material for lithium-ion batteries.

Effect of Graphene Nanosheets on the Microstructure and Mechanical Properties of Sn-20Bi Solder.

The application of Sn-Bi series solder is limited due to the brittleness of Bi phase. Sn-20Bi solder with less Bi element content has great research prospects, but it needs modification to make it a substitute for traditional Sn-Pb solder. In this article, we mixed graphene nanosheets with nanometer Sn powder by means of ultrasonic oscillation, and Sn-20Bi-qGNS (q = 0.01, 0.02, 0.04, 0.06, and 0.1 wt.%) solder alloys were prepared by the melt-casting method. The effects of graphene nanosheets (GNSs) on the microstructure, physical properties, mechanical properties, and corrosion resistance of solder alloys were investigated. Scanning electron microscopy, energy dispersive spectroscopy, X-ray diffraction, and X-ray photoelectron spectroscopy were used to determine the microstructural morphology and composition. The results showed that the melting point, density, and wettability of the solder decreased slightly with the addition of GNSs. The addition of GNSs as a second phase refined the solder structure and improved the tensile strength of the molten Sn-20Bi composite solder to 99.6 MPa, while elongation decreased with the addition of GNSs. Furthermore, GNSs prevented the MC Sn-20Bi-qGNSs/Cu intermetallic compound layers' growth by interfering with atomic diffusion and grain boundary movement. In addition, the addition of 0.02 wt.% GNSs enhanced the shear strength of MC Sn-20Bi solder joints to 46.3 MPa. The electrochemical experimental results show that the surface corrosion products of MC Sn-20Bi-qGNSs under 3.5% NaCl solution were Sn3O(OH)2Cl2, with MC Sn-20Bi-0.01GNSs exhibiting the best corrosion resistance.

High pressure amplify the structural characteristic of calcium-doped Bi-2201 phase

High pressure amplify the structural characteristic of calcium-doped Bi-2201 phase

Formation and growth of Bi-2223 phase in Bi-2223/Ag and Bi-2223/AgAu tapes

Formation and growth of Bi-2223 phase in Bi-2223/Ag and Bi-2223/AgAu tapes

Bismuth antiphase domain wall: A three-dimensional manifestation of the Su-Schrieffer-Heeger model

The Su, Schrieffer and Heeger (SSH) model, describing the soliton excitations in polyacetylene due to the formation of antiphase domain walls (DW) from the alternating bond pattern, has served as a paradigmatic example of one-dimensional (1D) chiral topological insulators. While the SSH model has been realized in photonic and plasmonic systems, there have been limited analogues in three-dimensional (3D) electronic systems, especially regarding the formation of antiphase DWs. Here, we propose that pristine bulk Bi, in which the dimerization of $(111)$ atomic layers renders alternating covalent and van der Waals bonding within and between successive $(111)$ bilayers, respectively, serves as a 3D analogue of the SSH model. First, we confirm that the two dimerized Bi structures belong to different Zak phases of 0 and $\pi$ by considering the parity eigenvalues and Wannier charge centers, while the previously reported bulk topological phases of Bi remain invariant under the dimerization reversal. Next, we demonstrate the existence of topologically non-trivial $(111)$ and trivial $(11\bar{2})$ DWs in which the number of in-gap DW states (ignoring spin) is odd and even respectively, and show how this controls the interlinking of the Zak phases of the two adjacent domains. Finally, we derive general criteria specifying when a DW of arbitrary orientation exhibits a $\pi$ Zak phase based on the flip of parity eigenvalues. An experimental realization of dimerization in Bi and the formation of DWs may be achieved via intense femtosecond laser excitations that can alter the interatomic forces and bond lengths.

Mechanical properties and microstructure evolution of Cu/Sn58Bi/Cu solder joint reinforced by B4C nanoparticles

The mechanical mixed Sn58Bi solder reinforced by B4C nanoparticles for the interconnect of Cu/Cu same metal was studied. The hardness of solder alloy and shear strength of joints with Sn58Bi-xB4C (x = 0, 0.2, 0.4, 0.6, 0.8, 1.0 wt%) composite solder were tested. The feasibility of the solution was verified by the performance of melting characteristics, wettability, microstructure, and interfacial IMC structure. It is indicated that the proper amount of B4C nanoparticles can improve the mechanical properties of the solder joint, and the hardness of the solder alloy is decreased to 246.0 HV by 13.65% with the addition of 0.6 wt% B4C and the highest shear strength of the joint reaches 52.282 MPa, which is increased by 8.9%. The failure mode of fracture is mainly considered a brittle fracture. The preferred orientation of the β-Sn phase and Bi phase are (1 0 0) and (1 0 1), respectively, and the number of low-angle grain boundary and dislocation density are increased. The melting characteristics of the solder are less affected by B4C nanoparticles, which will not interfere with its normal use. When the amount of B4C is 0.6 wt%, the spreading area of the solder is increased by 35.44%. Besides, a moderate amount of B4C nanoparticles is able to refine the matrix structure of the solder and inhibit the growth of Cu6Sn5 IMC.

Microstructure design in Bi-Ga-Te system using a combination of thermodynamic calculations and experiments for potential thermoelectric material

Tellurium-based alloys are emerging as attractive candidates for designing new thermoelectric materials. Various phases (e.g., Bi2Te3 and Ga2Te3) in the Bi-Ga-Te system exhibit good thermoelectric behavior. Microstructural features especially phase chemistry and fraction in alloy play a critical role in improving thermoelectric properties like the Seebeck coefficient and thermal conductivity. Although pure stoichiometric phases in Bi–Te and Ga–Te systems such as Bi2Te3 and Ga2Te3 are well investigated in the literature, there is limited study on the microstructure design in the ternary Bi-Ga-Te system that will be best suited for thermoelectric behavior. Accordingly, various alloys were developed using the recently developed thermodynamic database of the Bi-Ga-Te system. Alloys were melted in a vacuum induction furnace followed by microstructure characterization. The thermodynamic calculations and microstructural investigations of the selected compositions reveal varying phase fractions of Bi, β, Bi2Te3, Ga2Te3 and Te as both primary and eutectic phase. In addition, differential thermal analysis (DTA) was used to ascertain the phase transitions in alloys, which will assist in determining their thermoelectric operational temperature.