Sb-heterostructure backward diodes are attractive for passive millimeter-wave sensing techniques in Earth Observation applications, facilitating superior sensitivity (non-linearity) and low noise as compared to traditional zero-bias Schottky diodes. Reducing diode active area is imperative to achieve both increased sensitivity and operation at higher frequencies. In this work, we report a wet etch method utilizing citric acid, phosphoric acid, and hydrogen peroxide for simplified fabrication of vertical (250 nm height) Sb-heterostructure (InAs/AlSb/AlGaSb/GaSb) devices down to active area of 0.04 μm2 (critical dimensions 0.2 × 0.2 μm2). While conventional citric/peroxide etch chemistries are ineffective for removal of Sb-based etch products, including Sb2O5, the addition of phosphoric acid has shown to promote dissolution of etch stop layers, maintaining a linear etch rate throughout the device heterostructure. Furthermore, we found that citric acid plays a crucial role in the underlying etch mechanism which can be attributed to the formation of soluble Sb(V)-citrate complexes. Conducting the etching at reduced temperatures has also shown to promote slow-etching facets at reduced etch temperature (4 °C) drastically improving anisotropy. Finally, the etch method is evaluated by current-voltage characterization of the fabricated diodes achieving predictible active area scaling of performance-metrics across 190 devices indicating formation of defect free sidewalls.