Paper present a study enhancement of wire bonding process in the integrated circuit package with 2N AuPd coated Cu wire (2N-AuPdCu) for Automotive devices. Wire bonding is the electrical connection between pad and leadframe. In present, Au wire is recently use for interconnection while the gold price still exorbitant and caused concern to the wire bonding cost. Cu wire is a lower price and considered to be an alternative for the interconnection but still concern in term of corrosion and reliability. Recently, 4N AuPd coated Cu wire (4N-AuPdCu) material have been introduced for automotive device but still encounter the reliability problem. The 2N AuPd coated Cu wire was developed version for more reliability enhancement and consider to use for alternative wire of automotive device. In the experiment, Au wire, 4NAuPdCu wire and 2N AuPd coated Cu wire were used for wire bonding process on 8 leads Small Outline Integrated Circuit Package (8L-SOIC) and 14 leads Thin Shrink Small Outline Package (14L-TSSOP) to compare wire bond ability. Analysis, this package tested wire bond ability and reliability. The results performed well in wire bond ability and reliability for 2N AuPd coated Cu wire when comparing with Au wire and 4N AuPd coated Cu wire. Therefore, 2N AuPd coated Cu wire can enhance the quality and reliability for 8L-SOIC package and 14L-TSSOP package for automotive device.
Read full abstract