In previous investigations the additive metallization of conductor paths on thermoplastic substrate materials using printing technologies (Inkjet, Aerosol-Jet) was analyzed. Major disadvantages of printing technologies are the double-stage process chain divided in printing and sintering and the low current-carrying capacity of the printed structures. Accordingly, printed conductor paths are mainly used for sensor and control currents. The plasmadust technology, based on a cold active atmospheric plasma beam, offers the possibility for additive metallization of copper circuit paths on a sandwich material. The process consists of a nano and micro scale metal powder (particle size 0.1 μm to 20 μm), which is melted in the plasma nozzle by a highly energetic nitrogen gas. Based on the kinetic and thermal energy of the nitrogen-metal-compound the circuit paths are generated in a thermo-mechanical interconnection on the substrate surface. The plasmadust technology is characterized by a one-stage process chain, a very high coating speed (up to 50 m/min) and a high current-carrying capacity of the generated conductor structures. Hence, it is possible to transfer high currents, e. g. for illumination applications. Additionally three-dimensional substrates (3D MID) can be processed by handling with an industrial robot. In the investigations copper circuit paths on sandwich materials generated with the plasmadust technology were characterized. In this research work the adhesion of the layers and the current-carrying capacity of the copper structures were analyzed. Secondly the specimen were tested in selected reliability studies, a temperature-humidity (85 °C/85 % r.H.) and a temperature-cycling-test (−40 °C/+125 °C). With the first one the influence of moisture absorption of the sandwich material (up to 7 %) to the adhesion of the copper circuit paths is analyzed. With the second one the compound of the substrate and the additive metallization is qualified during thermo-mechanical stress. In conclusion the additive metallization of circuit paths on sandwich materials using plasmadust technology is qualified to mass production as well as different passivation possibilities of the generated structures will be presented.