This paper presents a comparative study of the fatigue life of solder joints in a board-level Ball Grid Array (BGA) assembly. It specifically contrasts the commonly used SAC305 alloy with the advanced Innolot-based solder alloy, recognized for its superior tensile strength. Through Finite Element Analysis (FEA), we simulate and predict the reliability of these solder joints under harmonic and random vibration conditions. Following the JEDEC (Joint Electronic Device Engineering Council) standards, two different board-level BGA assemblies are used for the analysis. In both assemblies, the dimensions of the substrate, molding compound, and solder balls remain identical; only the board dimensions are changed to observe how they affect stress in the solder joints. The results indicate that using Innolot raises the volume-averaged stress levels by more than 25% on larger boards and about 5% on smaller boards compared to SAC305. This increase in stress levels is due to the Innolot alloy having a less significant stiffening effect than SAC305, which results in higher stress levels under the same excitation conditions. While the stress in the Innolot-based solder joint is greater than that in the SAC305 joint under identical excitation conditions, the fatigue life of the Innolot joint is significantly higher than that of the SAC305 joint. The results show that the Innolot-based alloy exceeds the performance of SAC305, and that it is suitable for use as a solder alloy in extreme vibration conditions.
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