Design Rules For Assembly Research Articles

Interconnect Technique for Tight Clearance in Stacked-die Package

The paper focused in addressing wire-related assembly issues due to tight clearances in the semiconductor package design. Package design characterization was done considering the assembly design rules and the advanced rules, resulting to the integration of an interposer in the package design. With the new design, the assembly limitations and capability could be improved specifically for semiconductor devices with tight clearance requirement. Furthermore, gross assembly rejections related to tight clearances could be mitigated with the design solution and process improvement.

Interactions and design rules for assembly of porous colloidal mesophases.

Porous mesophases, where well-defined particle-depleted 'void' spaces are present within a particle-rich background fluid, can be self-assembled from colloidal particles interacting via isotropic pair interactions with competing attractions and repulsions. While such structures could be of wide interest for technological applications (e.g., filtration, catalysis, absorption, etc.), relatively few studies have investigated the interactions that lead to these morphologies and how they compare to those that produce other micro-phase-separated structures, such as clusters. In this work, we use inverse methods of statistical mechanics to design model isotropic pair potentials that form porous mesophases. We characterize the resulting porous structures, correlating features of the pair potential with the targeted pore size and the particle packing fraction. The former is primarily encoded by the amplitude and range of the repulsive barrier of the designed pair potential and the latter by the attractive well depth. We observe a trade-off with respect to the packing fraction of the targeted morphology: greater values support more spherical and monodisperse pores that themselves organize into periodic structures, while lower values yield more mobile pores that do not assemble into ordered structures but remain stable over a larger range of packing fraction. We conclude by commenting on the limitations of targeting a specific pore diameter within the present inverse design approach as well as by describing future directions to overcome these limitations.

SiP Technology Trends

System-in-Package (SiP) has become a mainstream package technology of choice by both IC suppliers and OEMs in recent years, and the adoption of package technology is evidenced by the increasing number of devices that utilize this package technology in handsets and mobile segment. However, the adoption of SiP is not limited to only the mobile market, but is also present in IoT, Wearables, as well as in high-end computing market segments. The drivers for adoption of SiP in each market segments, in addition to package technologies suitable within each segment vary. Amongst the many drivers for SiP adoption, the higher integration trend is a common theme across all market tiers as form factor reduction or miniaturization, performance increase, and faster time-to-market are all enabled by such integration schemes. These integration trends impact not only the OSAT's package technologies, but are also impacting the more traditional module assemblies that were historically done at EMS side. The differentiation between OSATs and EMSs become apparent in the level of integration that each can achieve and how their technologies can complement each other in order to collectively provide the highest level of integration possible. The technology blocks used to achieve this higher integration level in 2D packages include the conversion of package design from laminate FC to FOWLP, integration of passives on RDL, and the implementation of IPD's, or in some cases simply through utilization of improved assembly design rules and adoption of more complex process flows. These 2D SiP technologies are well suited for RF devices, and other types of control modules. For 2.5D package configurations, integration scheme is built on the Package-on-Package (PoP) technology framework, and can incorporate both laminate FCPoP as well as FOWLP (eWLB PoP). Here Interposers in combination with micro-bumps and high density interconnects are also used to enable applications in high-end computing. The value-add through such 2.5D technologies, in some cases is the departure from SoC designs with transition to Si partitioning, which yields lower system level cost in advanced nodes, and in other cases is the enhanced performance and form factor reduction that is enabled.

Disparate attributes algorithm for semantic assembly design rule management

To expedite a semantic product design environment, the relevant minimal set of design rules could optimally be distilled from the given disparate design rules. However, in disparate design rules, some attributes are frequently unused in other design rules. Treating all the attributes in all the rules increases reasoning complexity. In the situation of incomplete information, treating the attributes, which may be relevant to some rules and not to others, as “missing” ones is found to cause reasoning problems. In this paper, we present a new algorithm, i.e. the disparate attributes algorithm, for managing semantic assembly design rules. The proposed disparate attributes algorithm by identifying “inapplicable” information extends a rough set approach for managing semantic assembly design rules with systematic selection of various minimal sets of rules. To validate the disparate attributes algorithm, the approach is tested with multiple realistic assembly design cases.

A Rule Based Assembly Sequence Generation Method for Product Design

In concurrent engineering, the integration of the designers' knowledge and experience, and computer technology into the design process is very important to improve design quality and production efficiency. A feasible design alternative that follows the design rules for assembly will make product manufacturing and assembly more successful. However, designers seldom consider assembly problems in their product development processes. This drawback often occurs due to conflicts in communication between the design and production departments and will cause severe assembly and manufacturing problems. To assist designers with the assembly issue in the design process this research presents a contact relation matrix (CRM) approach to generate assembly sequences for product design. The procedure developed for the CRM approach is based on the four rules identified from the part contact relations and a matrix representation to match the recommended design alternative with the four rules. A procedure is then employed to identify the assembly priority for the recommended design alternative. The part assembly sequence is generated with a sorting procedure. A hand-held hairdryer and an Italian style coffee maker are used as cases to help explain the feasibility of the CRM approach. The results from this study should help designers to examine the possible part combinations and make the necessary modifications for the recommended design alternative. The CRM approach can also be linked with an existing matrix approach in generating and evaluating design alternatives. By integrating the CRM and matrix approaches, the design quality and efficiency will be greatly improved.

Design standards for effective MCM design

MCM design requires many elements of both IC and printed circuit board (PCB) design. The combination of industry standards and well developed processes is yielding excellent design systems for leading electronics firms. The MCM industry, however, is lacking many of the standards necessary for creating effective design systems. Significant efforts need to be made to overcome major shortcomings in industry infrastructure, concurrent engineering, staff expertise, and design tools. The current state of MCM design is assessed using the IC design process as an positive example. Significant industry investment has yielded enormous gains in IC design productivity, time-to-market, and functional costs. The electronic packaging industry can benefit from similar approaches. Successful MCM design first requires a standard method for modeling all of the elements in a design, including the components, substrates, assembly processes, and performance requirements. Data for these models must be gathered from a wide range of sources; it is not unusual on a single design to receive information from 20 manufacturers. Since data gathering is very time-consuming, these models should be available before starting actual designs. The paper gives detailed examples of specific issues concerning modeling components, substrates, and assemblies. Systems for capturing die data, substrate design rules, and assembly design rules are described. These systems are being used in work conducted as part of the IMAPS' Ceramic Interconnect Initiative. The results of developing and using design standards will be significant: better products built at lower cost and brought to market quickly.