The electrochemical behaviour of two copper-nickel alloys is studied in 0.1 M Na2SO4 using cyclic voltammetry, potentiodynamic and current time transient techniques. The microstructure of the compounds formed during anodic sweep is characterized using x-ray diffraction analysis. The forward sweep is characterized by the existence of two well-defined potential regions; the selective dissolution and the simultaneous dissolution potential regions. The first potential region consisted in two anodic peaks A1 and A2 corresponding to the formation of Ni(OH)2 and NiO, and Cu2O, respectively. The second potential region consisted in two anodic peaks A3 and A4 corresponding to the formation of CuO and Ni2O3, respectively. It is found that the Cu-Ni system in sulphate solution follows the dissolution-redeposition mechanism of the dissolution of metals from the alloys. The X-ray diffraction analysis confirmed the existence Ni2O3 and CuO on the electrode surface of nickel rich alloy polarized to potential more noble than the potential of A4 and the existence of Cu2O and NiO on the surface of copper-rich alloy polarized to a potential in the A2 region. Atomic Force microscope images show surface enlargement beyond the critical potential Ecrit.