Anaerobic fluid has been used as an industrial adhesive to seal or bond metal components for both large and small scales. Its use has recently extended to micro-electronics packaging. This novel application brings challenges to the dispensing process due to part handling at micro-scale dimensions and high production throughput. Most high-precision dispensers have fluid paths that are constructed of metal components to ensure product robustness and enable dimensional precision of micro-scale parts. This is incompatible with anaerobic adhesives which cure in the absence of oxygen and utilize metal ions as the catalyst. Furthermore curing accelerates with smaller gaps. A non-contact jetting solution has been developed and applied in production environment to dispense anaerobic adhesives with precise volume control, at high speed, and in continuous operation. Dispensing can be optimized to include a range of hardware dimensions, component surfaces, fluid handling, and process control.