The IC content in automobiles has been steadily increasing for the last twenty years. Emerging automotive applications in the areas of mobile connectivity, automotive safety and electrically powered vehicles are expected to drive semiconductor content well beyond its historic level. Many of these new applications, especially those around automotive safety and electrical power will require extremely high levels of performance and reliability in harsh operating environments. FormFactor and Texas Instruments recently collaborated in a study designed to address new testing challenges presented by these applications. This paper discusses select results from the study.The automotive sector is one of the fastest growing segments in the semiconductor industry. It is projected to outpace established sectors, such as the computer and consumer segments, over the next several years. Per an IC INSIGHTS report [1], the automotive industry is expected to expand at a regular pace of 4.9% from 2015–2020. As shown in Figure 1, the automotive segment is predicted to grow faster than any other semiconductor segment during this time.One of the main reasons for this notable automotive segment growth is that the automotive industry, worldwide, is undergoing some profound changes that are driving an increased dependence on semiconductors. The demand for increasingly versatile electronic systems listed below are believed to be key drivers. These include:Per the World Semiconductor trade statistics [2], the increasing semiconductor content in automobiles will drive the worldwide automotive semiconductor market from its all-time high of $29 billion in 2014 to $44 billion by 2019. This level of growth makes the automotive market highly attractive to many semiconductor manufacturers, since it is being steadier and less cyclical than the consumer and mobile semiconductor markets. This growth outlook is, in part, predicated on the assumption that the future vision of driverless and fully automated cars will soon become reality.These new automotive electronic systems will require specialized ICs that have been tested to guarantee the highest levels of performance and reliability. These various applications will require a range of IC including below examples:ICs used in automotive applications must adhere to the highest performance and quality standards to ensure the safety of both the driver and passengers. Thus, ICs used in these applications must be tested more rigorously and under more extreme conditions than ICs used in most mobile and consumer applications.The electronics incorporated into an automobile, or one of its subsystems, will be expected to operate in a much wider range of temperatures than most mobile consumer devices will experience. A smart phone, for an example, is practically attached to our hands most of our waking hours and, often, is used in an air-conditioned environment. In contrast, cars are used in an outdoor environment. A car's interior can experience a temperature range of −40 to 125°C. In addition, the “hidden” electronics that are mounted under the hood and control the engine, electric power steering, airbag deployment and anti-lock brakes often operate at ambient temperatures of 150°C or higher.When it comes to the deploying electronics, the automotive industry expects zero defects, both for safety and economic reasons. IC manufacturers participating in that sector are expected to use Parts per Million (DPPM) design methodology and manufacture their products using a zero-defect process technology that minimizes early life failures and ensures long MTBF. A 1 ppm IC failure rate can translate to a 1.5% or 15,000 ppm failure rate at the automotive level. Even that low rate can result in a massive recall and serious economic loss for an automotive manufacturer. Thus, automotive IC suppliers are strongly motivated to achieve the goal of zero defects if they want to maintain or grow their share of the automotive IC market.The need for zero defects and the harsh automotive environment create certain challenges for back-end wafer test probing. FormFactor have worked together to address some of these challenges. The two biggest issues concern maintaining thermal agility for wide temperature range probing, and ensuring minimum pad damage with no dielectric punch-through. This section will discuss those challenges and how they were addressed.Emerging automotive applications in the areas of safety, connectivity and electrical power are likely to be the next big area of growth for the semiconductor industry. Many of these new applications, however, present unique challenges for wafer testing automotive ICs, due to formidable dynamics like wide temperature ranges and stringent under-pad cracking requirements to ensure “zero defect” IC performance goals. This study—found that low-force vertical MEMS probe technology and advanced probe card construction design techniques can help to overcome the challenges, while improving production flexibility and uptime.
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