The advancement of digital technology in the age of Industrial Revolution 4.0 has driven other engineering sectors to keep up with the progressive demand for high-performance computing and electronics. Thermal management plays a critical role in maintaining the performance of electronic devices by keeping the system temperature at an optimal level and preventing overheating. A heat dissipation device widely employed in computing and other electronic systems’ heat management is a fin-type heat sink, owing to its robust and simple design. In this work, the authors evaluated heat sinks of different pin-fin cross-sectional geometry, arranged in a staggered configuration, in terms of heat transfer characteristics under forced convection. Three basic geometries were chosen on the grounds of manufacturing easiness and market availability: circular, square, and hexagonal. All the tested geometries had approximately the same hydraulic diameter. Therefore, the results could be compared to each other. The investigation revealed that the square cross-section induced an excellent convection coefficient, hence higher heat dissipation, compared to the counterparts. The tradeoff between heat transfer performance and size-related parameters, such as surface area and material volume, is also discussed in this paper.
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