Ag Grains Research Articles

Silicon carbide nanowire-reinforced micro-Ag joint based on pinning effect for power electronics packaging

Low-temperature sintering Ag technology is a feasible approach employed in power electron devices. In this study, the influence of the different amounts (0, 0.03, 0.05, 0.07, 0.10, 0.20 wt%) of silicon carbide nanowires (SiC NWs) on the properties and microstructure of micro-Ag paste sintered at 250 °C without pressure has been investigated. The results exhibit that the bonding strength of the Ag-SiC joint reaches a maximum of 43.57 MPa after doping 0.07 wt% SiC NWs, with an increase of 13 % compared with pure Ag joint. This enhancement mechanism can be owed to the Orowan mechanism and the pinning effect of SiC NWs, which nail at grain boundaries that will restrain the dislocation motion of Ag grains. Meanwhile, the electrical resistivity of Ag-0.07SiC shows a minimum value of 5.20 μΩ cm, approximately 10.65 % lower than pure Ag joint. This is attributed to the well-sintered Ag network and the bridging effect of SiC NWs distributed in Ag particles. Thus, incorporating appropriate content of SiC NWs into micro-Ag paste can strengthen the mechanical performance and electrical conductivity of sintered Ag joint. It is hoped that this research could develop a new micro-Ag paste with outstanding properties that could be employed in high-power electronic devices.

Microstructure evolution and enhanced mechanical performance of multilayer MXene-reinforced silver matrix composites

In this study, multilayer MXenes were first incorporated into an Ag matrix through a hetero-agglomeration process followed by spark plasma sintering (SPS), with the microstructural evolution of MXenes during composite fabrication characterized using transmission electron microscopy. The partial decomposition of MXene and transformation into rutile-TiO2 nanoparticles occurred during SPS, facilitating the generation of submicron Ag grains through effective pinning. As revealed by the Vickers hardness measurements and tensile tests, the addition of 3 vol% MXene increased the hardness and yield strength of the Ag matrix from 57.7 HV and 97.5 MPa to 116.0 HV and 129.1 MPa, representing increases of 101 % and 32 %, respectively. Quantitative calculations suggested that the improved mechanical properties of the MXene/Ag composites were primarily due to grain refinement strengthening. Meanwhile, the electrical and thermal conductivities of the 3 vol% MXene/Ag composite decreased by 9 % and 11 %, respectively. However, the ultimate tensile strength and ductility of the composites were lower than those of pure Ag, attributed to the weak MXene-Ag interfacial bonding and fracture surface observations, as well as the presence of accordion-like structures in MXene. Compared with conventional Ag matrix composites, MXene/Ag composites demonstrate a superior balance of mechanical and physical properties, making them highly suitable for applications in electrical devices. This work enhances our understanding of the interface phenomena between MXenes and metals, providing new insights for designing novel Ag matrix composites for use in conductive devices.

Self-oxidized AgCu nano-foam with unique phase structure for ethanol sensors breaking through the trade-off between sensitivity and upper linear limit

Comparing to gas ethanol sensors, electrochemical ethanol sensors are promising owing to the low operating temperature, high sensitivity and good accuracy. Common electrochemical ethanol sensors suffer from a general trade-off relationship between sensitivity and upper limit for linear detection. In this work, facile self-oxidized AgCu nano-foam is obtained by simply dealloying of Mg65Ag12.5Cu12.5Y10 metallic glass ribbon in citric acid, which breaks through the trade-off by showing an ultra-high upper linear limit of 1.5 M and good sensitivity of 109.6 μA mM-1 cm-2. Combined experiment and simulation investigations confirm that the ligaments of the AgCu nano-foam is composed of surfaces with interlacing Ag and Cu2O grains that are driven by surface energy, and cores consist of Ag and Cu grains that result from phase separation. Such phase structures, coupled with the geometry merits, lead to fast oxidation dynamics, abundant electroactive sites, good reversibility and stable microstructure, which results in high upper linear limit and a sensitivity improvement of ∼30 times comparing to Cu nano-foam. This work develops a candidate material for high performance sensing of concentrated ethanol, and verifies a promising strategy to prepare efficient catalysts by multilevel-design of geometry and phase structure.

A Route to High Thermoelectric Performance: Solution‐Based Control of Microstructure and Composition in Ag2Se

AbstractThermoelectric materials convert heat into electricity, with a broad range of applications near room temperature (RT). However, the library of RT high‐performance materials is limited. Traditional high‐temperature synthetic methods constrain the range of materials achievable, hindering the ability to surpass crystal structure limitations and engineer defects. Here, a solution‐based synthetic approach is introduced, enabling RT synthesis of powders and exploration of densification at lower temperatures to influence the material's microstructure. The approach is exemplified by Ag2Se, an n‐type alternative to bismuth telluride. It is demonstrated that the concentration of Ag interstitials, grain boundaries, and dislocations are directly correlated to the sintering temperature, and achieve a figure of merit of 1.1 from RT to 100 °C after optimization. Moreover, insights into and resolve Ag2Se's challenges are provided, including stoichiometry issues leading to irreproducible performances. This work highlights the potential of RT solution synthesis in expanding the repertoire of high‐performance thermoelectric materials for practical applications.

Effect of Ag agglomeration-driven nanovoids formation on fatigue reliability of Cu–Ag alloy flexible interconnects

Fatigue failure under cyclic deformation remains longstanding challenge in the flexible interconnect for the long term application. In this study, we design Cu–Ag alloy interconnects with excellent fatigue resistance by adopting nanovoid structures acquired by a simple post-annealing process. Nanovoids are generated during Ag agglomeration in the Cu matrix because of the low solubility of Ag in Cu, which enhances the fatigue property of a Cu–Ag alloy deposited on a polyimide film. The effect of high-density nanovoids located at the triple junction of the Cu and Ag grain boundaries on the mechanical fatigue lifetime is investigated by microstructure analysis (HAADF, HR-TEM and ASTAR™-coupled TEM). The fatigue damage of the Cu–Ag alloy has been observed to originate from grain boundary decohesion, unlike typical long fatigue cracks and extrusions. This can be attributed to the uniform distribution of nanovoids, which leads to stress concentration relief and consequently reduces the level of deformation.

Comparative study of parallel gap resistance welding joints between different interconnected foils and GaAs solar cells: Microstructure and thermal reliability

Deployed in space orbits, solar cell arrays are subjected to daunting challenges posed by exceedingly harsh thermal environments. During their operational lifespan in space, potential failures at the joints between solar cells and interconnecting strips can adversely affect the longevity of solar cell arrays. To enhance the thermal reliability of solar cell joints in intricate space conditions, this study delved into the influence of thermal cycle on mechanical properties and microstructures of parallel gap resistance welding (PGRW) joints utilizing both silver (Ag) and Ag-plated Kovar foils. Operating at respective current densities of 410 A/mm2 and 420 A/mm2, these two types of foils exhibit solid-phase interfaces characterized by elemental diffusion. Interface of the joint of Ag foil experiences microscopic deformation and accumulated strain during the thermal cycle, with cracks initiating and propagating at the edges of joint interface. With an escalation in the number of thermal cycles, tensile-shear performance deteriorates, and the fracture morphology shifts from a ductile fracture with evident dimples to a deformation-intensive fracture attributed to thermal fatigue, draped in Ag grains. Conversely, the joints of Ag-plated Kovar foil demonstrate minimal alterations in mechanical properties, microstructures, and fracture morphology due to thermal cycling. This phenomenon reflects noteworthy thermal reliability spanning from −160 °C to 120 °C. The investigation into PGRW joints of Ag-plated Kovar foil holds significant implications for satisfying the high-reliability of solar cell arrays in hostile space environments.

Complexity in the Au–Ag–Hg system: New information from a PGE (‘osmiridium’) concentrate at Waratah Bay, Victoria, Australia

AbstractAu–Hg–Ag phases have been described from a variety of metallogenic orebodies and the placer deposits derived from them. In many documented placer deposits, the phases typically occur intergrown as ‘secondary’ rims to primary Au–Ag grains. The origin of these rims has been ascribed to supergene redistribution reactions during deposition or to the effects of amalgamation (i.e. use of mercury) during mining for gold. Difficulties in determining compositions and crystal structures on such a small scale have made full characterisation of these phases problematic. This paper describes a new occurrence of these phases, found by accident during investigation of a historical concentrate of ‘osmiridium’ containing a number of gold grains from beach sands at Waratah Bay, in southern Victoria, Australia. The phases occur as rims to gold grains and are intergrown on a scale of tens of micrometres or less. Application of electron microprobe analysis (EPMA) and limited electron back-scattered diffraction (EBSD) was required to characterise them. These techniques revealed the presence of the approved mineral weishanite (Au–Hg–Ag) and a phase with compositional range Au2Hg–Au3Hg surrounding primary Au–Ag (electrum) containing trace amounts of Hg. EBSD analysis showed weishanite is hexagonal P63/mmc and Au2Hg to be hexagonal P63/mcm. Comparison with published data from other localities (Philippines, British Columbia and New Zealand) suggests weishanite has a wide compositional field. Textures shown by these phases are difficult to interpret, as they might form by either supergene processes or by reaction with anthropogenic mercury used during mining. However, in the absence of any historical evidence for the use of mercury for gold mining at Waratah Bay, we consider the formation of the Au–Hg phases is most probably due to supergene alteration of primary Au–Ag alloy containing small amounts of Hg. In addition to revealing some of the reaction sequences in the development of these secondary Au–Hg–Ag rims, this paper illustrates methods by which these phases can be more fully characterised and thereby better correlated with the Au–Hg synthetic system.

Enhancing overall performances of Cu/Ag/AZO multilayer films for transparent heaters via laser/furnace step-by-step annealing mode

Four different step-by-step annealing modes based on furnace and/or laser annealing (i.e. F + L, F + F, L + F and L + L) were developed and compared with one-step furnace or laser annealing mode (i.e. F and L), with an aim to enhance overall performances of Cu/Ag/AZO (CAA) multilayer films applied to transparent heaters. It was found that the L + F step-by-step annealing mode improved the transmittance and conductivity of the CAA film to the greatest extent, and therefore the resulting sample L + F achieved the best overall performance with a figure of merit of 4.26 × 10−2 Ω−1. These results should be ascribed to that laser annealing for the AZO layer in the first step facilitated growth and recrystallization of AZO grains to provide better nucleation sites for overlying Ag and Cu grains, and furnace annealing of the whole CAA film in the second step promoted the melting of the surface Ag and Cu grains to re-aggregate with the nearby AZO grains. The transparent heater prepared from the sample L + F exhibited a high steady-state temperature of 127.1 °C within a short response time of 80 s under an input voltage of 3 V, as well as good heating stability and effective deicing function.

The effect of phonons-surface and grain-boundary scattering on electrical properties of metallic Ag

Explain in this study, thickness has an inverse relationship with electrical resistivity and a linear relationship with Grain boundary scattering. According to the (Fuchs-Sondheier, Mayadas-Shatzkces) model, grain boundary scattering leads To an Increase in electrical Resistivity. The surface scattering Coefficient of Ag, which Fuchs-Sondheier and Mayadas-Shatzkces measured at , Ag's grain boundary reflection coefficient , which Mayadas-Shatzkces measured at , If the concentration of material has an effect on metal's electrical properties, According to this silver is a good electrical conductor and is used frequently in electrical and electronic circuits.

Effect of B on the microstructure and mechanical properties of Cu–Cu joints with in-situ Ag–Cu–Zn–Sn filler metal

With the development of advanced manufacturing, traditional Ag-based filler metals cannot reconcile the contradiction between high performance and complex processing. It also unable to meet the requirements of new materials, new structures and new processes for brazing connection performance. In this paper, based on the Ag–Cu–Zn–Sn flux-cored filler metal, the effect of the addition of B on the microstructure and mechanical properties of Cu–Cu brazing joints was investigated using FESEM‒EDS, EPMA, EBSD, TEM, microindenter and universal tensile testing machine. The results indicated that the microstructure in the brazing seam was mainly composed of Ag (s.s), Cu(s.s) and (Ag + Cu) eutectic. With increasing B content, the grain size and texture strength of Ag(s) and Cu(s) gradually decreased. The refinement of Ag-rich dendrites was mainly due to the enrichment of B atoms around the dendrite, which limited the diffusion of solute atoms in the melt and the release of solidification latent heat in front of the liquid‒solid interface, further inhibiting the growth of Ag-rich dendrites. The refinement behavior of Cu-rich dendrites was mainly attributed to the increase in B content, which reduced the tip radius of Cu-rich dendrites. The mass transfer path of B → B2O3 and B → liquid CuSn alloy → mixed melt of CuSn alloy + solder skin alloy → liquid filler metal in the brazed joint → Cu rich phase and grain boundary in the brazed joint → Ag rich phase and grain boundary in the brazing seam was clarified. The addition of B can improve the microhardness of the brazing seam. The shear strength reached a maximum value of 237.2 MPa when B was added at 2%. The fracture models mainly included intergranular fracture, dimple fracture and cleavage fracture. The strength of brazed joints can be improved by solid solution strengthening, process hardening strengthening and fine grain strengthening. The tangle and jog of dislocations within the crystal, the presence of a large number of grain boundaries and B-rich areas can prevent crack tip extension and enhance the toughness of brazing joints.

Microstructural Investigation of Some Bronze Artifacts Discovered in a Dacian Site Using Non-Destructive Methods

Dacian civilization flourished on the actual territory of Romania during the Late Iron Age and had its peak from the first century BC to the first century AD. They had intensive relations with Hellenistic and Roman civilizations. Therefore, it is difficult to evaluate the origin of some widely spread artifacts discovered in the Dacian archeological sites. The present research is focused on two bronze artifacts (a bronze coin and a mirror fragment) found in the Alun-Piatra Rosie site and a silver coin found in the Ardeu site. Artifacts were investigated with nondestructive methods such as SEM-EDX for microstructural and elemental characterization, and the crystalline phases were investigated using XRD. Bronze coin proves to be an Istrian issue having an elemental composition of 75.0% Cu, 20.8% Sn, and 4.1% Pb, which corresponds to a structure of Cu grains mixed with Cu5.6Sn grains. The bronze mirror fragment has an elemental composition of 52.3% Cu and 47.7% Sn, which corresponds to a structure containing grains of Cu6Sn5 mixed with grains of Cu41Sn11. It has a smooth surface that was investigated with AFM microscopy, which evidences a Ra roughness of 51 nm for the patina surface and 33.7 nm for the clean metal surface, proving the high quality of the original mirror luster of the artifact. The silver coin was identified as a Radulesti–Hunedoara type meaning that it was produced in local Dacian metallurgic workshops. It has an elemental composition of 63.1% Ag, 25.3% Sn, 7.8% Cu, and small traces of P and Fe, which corresponds to a structure of Ag grains and Ag3Sn grains. Silver coins show that Dacians uses Sn as alloying element in their metallurgic workshops. Istrian bronze coin proves to be typical for Hellenistic or Roman bronze type with Sn content no more than 25% Sn. The bronze mirror fragment has an unusual composition that might be a result of al local metal charge elaboration with several Hellenistic and Roman bronze pieces as raw material and an extra Sn addition during the melting process. This material facilitates the polishing properties of the active surface that has a very low roughness even after 2000 years of ground resting and adherent oxides patina.

The effect of the surface patterning by ion beam irradiation on the Ag directional outflow in Ag/AlN nano-multilayers

Surface templating of nano-multilayers is a promising step for the advanced industrial application of these nanomaterials. In the present work, the effect of focused ion beam modification of Ag/AlN nano-multilayer near-surface region on the Ag surface outflow is revealed. Surface patterning by ion beam irradiation leads to the formation of a higher amount of Ag crystals in relation to the intact surface region. Heat treatment initiates grooving of Ag grain boundaries, resulting in the formation of channels in the nano-multilayer volume. These channels act as pathways for mass transport of Ag to the film surface. Ion bombardment creates regions of high concentration of non-equilibrium defects, which locally increase the driving force for grooving and channeling, thereby promoting creation of more pathways for Ag surface migration. The obtained experimental results indicate that surface modification by focused ion beam can be used for production of nano-multilayers with designed templates of surface outflow.

Preparation of Ag–Fe2O3-Based black and electrically insulating coatings by magnetron sputtering from metal targets

Black and electrically insulating coatings provide touch panel displays with a classic appearance. In this study, black and electrically insulating Ag–Fe2O3-based coatings were prepared using reactive magnetron sputtering, stainless steel and silver foil. The thin films prepared with oxygen introduction and no Ag foil showed blue light absorption and high electrical resistance, which are comparable to those of Fe2O3 single crystals. The optimal Ag foil size for maintaining a high electrical resistivity of 108 Ω·sq−1 was determined to be 54 mol%Ag in the film samples. Black and electrically insulating thin films composed of metallic Ag, amorphous Ag–Fe–O, and slightly crystallized Fe2O3 were prepared using 3.4 or 3.9 %O2. Metallic Ag segregated randomly in the high-refractive-index Fe2O3-based matrix, resulting in plasmonic absorption over a wide range of wavelengths centered in the red-wavelength region. At 3.9 %O2, a high sheet resistance of 108 Ω·sq−1 and strong visible absorption of 35.2 μm−1 (on average), slightly deviating by 2.4 μm−1 were simultaneously achieved by clear phase separation of the Ag grains and Fe2O3-based matrix. A clear phase separation mechanism based on thermodynamic nonequilibrium oxidation of the metallic Ag phase is proposed.

Highly strong interface in Ag/Si sintered joints obtained through Ag2O–Ag composite paste

In this study, the interfacial strength and fracture behavior of Ag/Si interfaces formed by a composite paste comprising Ag2O microparticles, Ag microflakes, and terpineol is demonstrated through microscale tensile testing. This paste induces a delayed reduction of Ag2O and subsequent interconnection between the Ag grains and Si substrate. This is owing to the interface formation by the direct bonding of Ag and a layer with Ag nanoparticles intermediated bonding using the newly generated Ag nanoparticles. This characteristic interface formation helps achieve a high joint strength (>30 MPa) at a bonding temperature of 250 °C, inducing a substrate fracture at 275 °C. Microscale tensile testing reveals the high-strength Ag/Si (>200 MPa) interface formation and intrinsic fracture morphology within the Ag layer at a nanoscale; the fracture occurs in the Ag layer and not at the interface.

Microstructure Evolution of Ag/Ta Nanostructured Films for Surface-Enhanced Raman Scattering Substrates

Surface-enhanced Raman scattering (SERS), a nondestructive, ultrasensitive detection method, has a wide range of potential applications. However, its application is limited due to the weak Raman scattering signals. Therefore, it is urgent to explore a simple physical method to prepare SERS substrates with high detection limits and excellent reproducibility. In this work, Ta–Ag alloy films were prepared by magnetron sputtering at room temperature, and a large number of Ag nanoparticles were self-formed on the alloy films’ surface by adjusting the deposition time, Ag content, and annealing temperature. Further research reveals that this is because the amorphous Ta in the alloy films prevents the growth of Ag grains inside Ta–Ag alloy films, resulting in the diffusion of Ag atoms to the alloy film’s surface to form Ag nanoparticles. The results demonstrate that Ag nanoparticles/Ta 55.5 at % Ag alloy films used as SERS substrates have excellent reproducibility and high sensitivity to detect 5 × 10–16 mol L–1 rhodamine 6G (R6G) solution and 5 × 10–12 mol L–1 crystal violet (CV) solution. This method provides a simple approach to developing high-performance SERS substrates.

Epitaxial electrodeposition of Cu2O on Ag substrates in sulfate baths

A series of Cu2O samples were electrodeposited on polycrystalline Ag substrates in an electrolyte containing 0.4 M cupric sulfate and 1.3 M lactic acid at different electrolyte temperatures, pH values, and current densities. The electron backscatter diffraction technique was used to characterize the epitaxial orientation relationship (OR) between the deposited Cu2O films and underlying Ag grains. Epitaxial growth was mostly prohibited for the films deposited at pH 9 and 25 °C, whereas epilayers consisting of crystals of a single orientation were deposited on most of the substrate grains at conditions of pH 12/25 °C, pH 9/60 °C, and pH 12/60 °C. In addition to the expected cube-on-cube OR, four more ORs were identified. The existence of multiple ORs was probably a result of coincidence site lattice matching. The adoption of the epitaxial OR for Cu2O films strongly depended on the orientations of the substrate grains. Finally, transmission electron microscopy analysis indicated that the epilayer deposited at 60 °C contained a relatively low density of threading dislocations on the order of 109 cm−2 and thus exhibited low electrical resistivity values of 1–3 × 103 Ω·cm.

Mapping the kinetics of hydrogen evolution reaction on Ag via pseudo-single-crystal scanning electrochemical cell microscopy

AbstractElucidating the structure-activity relationship in electrocatalysis is of fundamental interest for electrochemical energy conversion and storage. However, the heterogeneity in the surface structure of electrocatalysts, including the presence of various facets, poses an analytical challenge in revealing the true structure-activity relationship because the activity is conventionally measured on ensemble, resulting in an averaged activity that cannot be unequivocally associated with a single structural motif. Scanning electrochemical cell microscopy (SECCM) [1] combined with colocalized electron backscatter diffraction (EBSD) offers a direct way to reveal the correlative local electrochemical and structural information. Herein, we measured the hydrogen evolution reaction (HER) activity on Ag and its dependence on the crystal orientation. From the combined EBSD and SECCM mapping, it is found that Ag grains closer to {111} show a higher exchange current density, while those closer to {110} show a lower Tafel slope. The Tafel slope is also found to decrease with the step density increase. The ability to measure the electrocatalytic activity under a high mass-transfer rate allows us to reveal the activity difference at a high current density (up to 200 mA/cm2). The approach reported here can be expanded to other systems to reveal the nature of active sites of electrocatalysis.

Facile process for surface metalization: Rational design of Ag nanoparticle/polymer brush toward high-efficiency electroless plating

In order to realize the convenient process of metalization on different materials and make electroless plating more efficient and fast, a multi-dentate ligand Ag complex (MLAg) was synthesized, which components include deionized water, 3-aminopropyl triethoxysilane, polyvinyl alcohol, and silver nitrate. It is worth noting that because the surface of MLAg contains a large number of -NH2 and -OH groups, it can be coated on different substrate surfaces through a process of rapid film formation (in situ film generation, brush coating, and dip coating) with a special structure (silver nanoparticles/polymer brush (Ag/PB) structure). Of note, we introduced polyvinyl alcohol as a structural optimization scheme to improve the structure of the Ag/PB interface (enhancing the Ag adsorption strength and electronic structure), which has a beneficial inhibitory effect on the growth of Ag grains. Of note, the MLAg/Ag interfacial force is a strong bond cooperation by means of covalent bond. The results show that the polyhedral Ag particles are composed of triangular (111) and square (100) crystal planes, and are evenly distributed on the surface of the substrate with outstanding film-forming performance, speed and catalytic ability. In the Cu chemical plating solution, HCHO exhibits an unstable free state and transforms into H-COOH, Ag d-orbitals and open orbitals donate their charge to Cu2+, enabling reduction to Cu atom, and thereby deposition on substrate surface. Furthermore, the excellent film-forming and catalytic capacity of as-fabricated MLAg make it suitable for a pre-treated material with a metallized surface.

Boost thermoelectric properties of n-type PbSe:Ag2Se:Ag in the vicinity of the percolation threshold

We study the microstructure and thermoelectric performance of n-type (PbSe)100-x-y:(Ag2Se)x:(Ag)y (x = 0 − 6, y = 0–28) films. For the (PbSe)71:(Ag2Se)5:(Ag)24, the carrier concentration enhanced in the vicinity of the percolation threshold. The high carrier concentration leads to a large average PFavg at the low temperature range of 300−523 K, the maximum PFavg for (PbSe)100-x-y:(Ag2Se)x:(Ag)y samples is ∼37.83 μW cm−1 K−2, which is about 200% higher than that of pure PbSe films (∼19.16 μW cm−1 K−2). In addition, PbSe:Ag2Se:Ag grain boundary and edge dislocation can engender intrinsically low thermal conductivity. The low thermal conductivity leads to a high zT and the maximum zT values for (PbSe)71:(Ag2Se)5:(Ag)24 samples is ∼0.63 at room temperature, which is more than 250% higher than that of pure PbSe films (zT = 0.25).

Low-Temperature Direct Bonding of 3D-IC Packages and Power IC Modules Using Ag Nanotwinned Thin Films

Ag has the lowest stacking fault energy of all metals, which allows twin formation to occur more easily. The (111)-preferred orientation Ag nanotwinned films is fabricated by either sputtering or evaporation method exhibit columnar Ag grains grown vertically on Si substrates. Ag nanotwinned films have a (111)-preferred orientation with a density about 98% and diffusivity that is 2 to 5 orders of magnitude higher than those of (100) and (110) surfaces. Low temperature direct bonding with (111)-oriented Ag nanotwins films is proposed to fulfil the requirements for wafer-on-wafer (WoW), chip-on-wafer (CoW), and chip-on-wafer-on-substrate (CoWoS) advanced 3D-IC packaging, with the process temperature drastically reduced to 100°C. Such an innovative bonding method also provides a promising solution for die attachment of Si chips with DBC-ceramic substrates for power module packaging.