Agent For Epoxy Resin Research Articles

硬化剤の最近の進歩

硬化剤の最近の進歩

Synthesis and polymerization of tris(alkylamino)‐silance with epoxy prepolymers

AbstractPhenyltris(methylamino)silane, phenyltris(ethylamino)silane, and vinyltris(hexylamino)silane were synthesized and evaluated as curing agents for epoxy resins. Cured resins derived therefrom have very good physical and dielectric properties. The moisture resistance of the resins evaluated was especially good for those derived from the vinyltris(hexylamino)silane. Typical dielectric properties of a phenyltris(ethylamino)silane‐cured epoxy specimen include a dielectric constant of 3.7 at 25°C. and a dissipation factor of 0.8%. Elevated temperature data are also presented.

Correlation between structure and thermal stability of epoxy resins

A number of polycarboxylic acids, anhydrides, phenols, amines and catalysts, were evaluated as curing agents for epoxy resins and the resulting resins screened for thermal stability. As the basic resin molecule, Bisphenol A was also replaced by other diphenols. The thermal behaviour of these resins was related to their structure. In spite of a certain instability of the ester bond, the anhydride-cured resins gave the highest heat distortion and the best ageing stability. The BF3-amine complex is effective as a catalyst, especially with resins having more than two epoxy groups. Phenols and amines as curing agents gave low heat distortion values. Of the anhydrides investigated pyromellitic dianhydride is best, followed by maleic anhydride. Chlorendic anhydride, which gives fast curing and high heat distortion, has low ageing stability. Replacement of Bisphenol A as-the basic resin by naphthalene, diphenyl or diphenylsulphone derivatives might raise the heat distortion. However, structures like Resin B seem to be more promising.