Advanced Packaging Materials Research Articles

Sustainable valorization of waste plastic into nanostructured materials for environmental, energy, catalytic and biomedical applications: A review

The extensive production and utilization of plastic products are inevitable in the current scenario. However, the non-degradable nature of waste plastic generated after use poses a grave concern. Comprehensive efforts are being made to find viable technological solutions to manage the escalating challenge of waste plastic. This review focuses on the progress made in transformation of waste plastic into value-added nanomaterials. An overview is provided of the waste plastic issue on a global level and its ecological impacts. Currently established methodologies for waste plastic management are examined, along with their limitations. Subsequently, state-of-the-art techniques for converting waste plastic into nanostructured materials are presented, with a critical evaluation of their distinct merits and demerits. Several demonstrated technologies and case studies are discussed regarding the utilization of these nanomaterials in diverse applications, including environmental remediation, energy production and storage, catalytic processes, sensors, drug delivery, bioimaging, regenerative medicine and advanced packaging materials. Moreover, challenges and prospects in the commercial level production of waste plastic-derived nanomaterials and their adoption for industrial and practical usage are highlighted. Overall, this work underscores the potential of transforming waste plastic into nanostructured materials for multifaceted applications. The valorization approach presented here offers an integration of waste plastic management and sustainable nanotechnology. The development of such technologies should pave the way toward a circular economy and the attainment of sustainable development goals.

Organic nanoparticles incorporated starch/carboxymethylcellulose multifunctional coating film for efficient preservation of perishable products

Most of postharvest agricultural produces are perishable due to microorganisms infections and physiological change. Herein, one kind of multifunctional coating film of SC-ECCNPs was developed by incorporating organic nanoparticles of ECCNPs into starch/carboxymethylcellulose (SC) to prolong shelf life of food with excellent performances. The SC-ECCNPs coating was prepared with starch and sodium carboxymethylcellulose as film substrate (SC) to incorporate with organic nanoparticles of ECCNPs formed by integrating epigallocatechin-3-gallate (EGCG), cysteine (Cys), and cinnamaldehyde (CA). The incorporation of ECCNPs improves the UV-resistance and physical properties of SC-ECCNPs coating and also endows it with excellent antioxidative and broad-spectrum antibacterial activity. The application possibilities of SC-ECCNPs coating were explored with strawberries and oranges as samples, validating that the SC-ECCNPs coating can prolong the shelf life of fruits at room temperature. The biosafety of the coating was further confirmed with hemolysis and MTT experiments. The SC-ECCNPs coating film was prepared with natural substrates via a simple and green method. The investigation provides an instructive way for developing advanced packaging materials with high performances.

Paper-based material with hydrophobic and antimicrobial properties: Advanced packaging materials for food applications.

The environmental challenges posed by plastic pollution have prompted the exploration of eco-friendly alternatives to disposable plastic packaging and utensils. Paper-based materials, derived from renewable resources such as wood pulp, non-wood pulp (bamboo pulp, straw pulp, reed pulp, etc.), and recycled paper fibers, are distinguished by their recyclability and biodegradability, making them promising substitutes in the field of plastic food packaging. Despite their merits, challenges like porosity, hydrophilicity, limited barrier properties, and a lack of functionality have restricted their packaging potential. To address these constraints, researchers have introduced antimicrobial agents, hydrophobic substances, and other functional components to improve both physical and functional properties. This enhancement has resulted in notable improvements in food preservation outcomes in real-world scenarios. This paper offers a comprehensive review of recent progress in hydrophobic antimicrobial paper-based materials. In addition to outlining the characteristics and functions of commonly used antimicrobial substances in food packaging, it consolidates the current research landscape and preparation techniques for hydrophobic paper. Furthermore, the paper explores the practical applications of hydrophobic antimicrobial paper-based materials in agricultural produce, meat, and seafood, as well as ready-to-eat food packaging. Finally, challenges in production, application, and recycling processes are outlined to ensure safety and efficacy, and prospects for the future development of antimicrobial hydrophobic paper-based materials are discussed. Overall, the emergence of hydrophobic antimicrobial paper-based materials stands out as a robust alternative to plastic food packaging, offering a compelling solution with superior food preservation capabilities. In the future, paper-based materials with antimicrobial and hydrophobic functionalities are expected to further enhance food safety as promising packaging materials.

Reinforcement of biodegradable SiO2NPs-modified cellulose-gelatin hydrogel films with antioxidant and antibacterial properties as potential food packaging composite

This study proposed an innovative approach to the development of sustainable and biodegradable food packaging materials by incorporating inexpensive nano-silica (SiO2NPs) in designed hydrogel (CSG) film employing biodegradable polymers: synthetic polymer polyvinyl alcohol (PVA), natural polymer - carboxymethyl cellulose (CMC) and protein-based bio-polymer –gelatine, and a commercial crosslinker, tetraethoxysilane (TEOS) through a conventional air-dry casting technique. The CSG hydrogel blends were modified with varying amounts of SiO2NPs (0.05g, 0.1g, 0.15g and 0.2g) and compared with the blend without SiO2NPs to determine the effect of SiO2NPs loading through various characterisation techniques and applications including antioxidant and antimicrobial activity. Comprehensive characterizations of the CSG films revealed that CSG 0.1 (containing 0.1g SiO2NPs) exhibited the most favourable functional properties, low crystallinity, high flexibility, suitable pore size, thermal stability, adequate tensile strength, elongation at the breaking point and maximum stability by swelling and diffusion test. The addition of SiO2NPs consistently enhanced thermal and mechanical stability in all CSG films. Further, these CSG films were implemented for antioxidant test and antimicrobial activity against gram-positive Bacillus cereus and gram-negative Escherichia coli. SiO2NPs integration significantly elevated the antioxidant capacity in all films, with CSG 0.1 showing ⁓7% improvement. The antimicrobial activity of SiO2NPs-modified CSG films was also notable, with CSG 0.1 effectively inhibiting B. cereus by 1.2cm zone and E. coli by 0.5cm zone. A soil burial test was performed to pattern the biodegradability of CSG hydrogels. Therefore, the outstanding improvements in the intrinsic properties of CSG films, owing to SiO2NPs modification, positioned these CSG hydrogels as promising candidates for advanced food packaging materials in various industries.

Facile Construction of Chestnut-Like Structural Fireproof PDMS/Mxene@BN for Advanced Thermal Management and Electromagnetic Shielding Applications.

Composite polymer materials featured superior thermal conductivity, flame retardancy, and electromagnetic shielding performance are increasingly in demand due to the rapid development of highly miniaturized, portable, and flexible electronic devices. Herein, a facile and green ball milling shear method is utilized for generating MXene@Boron nitride (MXene@BN). The multi-functional fillers (MXene@BN) are constructed and incorporated into polydimethylsiloxane (PDMS) to prepare a multifunctional composite (PDMS/MXene@BN) for achieving improved electromagnetic interference (EMI) shielding performance and thermal conductivity as well as flame retardancy simultaneously. When the PDMS/MXene@BN composite has a MXene@BN loading of 2.4 wt.%, it exhibits a high thermal conductivity of 0.59Wm-1K-1, which is 210% higher than that of the pure PDMS matrix. This is attributed to its unique chestnut-like double-layer structure. With a smoke production rate (SPR) of 0.04 m2s-1 and total smoke production (TSP) of 3.51 m2, PDMS/MXene@BN 2.4 composite exhibits superb smoke suppression properties. These SPR and TSP values are 63.20% and 63.50% lower than the corresponding values of pure PDMS. Moreover, the EMI SE of the PDMS/MXene@BN 2.4 can reach 26.3dBat 8.5GHz. The work reported herein provides valuable insight into developing composites with multiple functions, which show strong potential for application in advanced packaging materials.

Techno-functional properties of active film based on guar gum-propolis and its application for “Nanguo” pears preservation

Guar gum (GG) composite films, incorporating the ethanolic extract of propolis (EEP), were prepared and subjected to a comprehensive investigation of their functional characteristics. The addition of EEP resulted in a discernible enhancement in the opacity, moisture barrier capacity, and elongation at break. Incorporating EEP led to a noteworthy increase in the total phenolic and total flavonoid content of the films, resulting in superior antioxidant capacity upon GG-EEP films. Remarkably, the addition of 5 % EEP yielded noteworthy outcomes, manifesting in a DPPH radical scavenging rate of 47.60 % and the ABTS radical scavenging rate of 94.87 %, as well as FRAP and cupric reducing power of 331.98 mmol FeSO4-7H2O kg−1 and 56.95 μg TE mg−1, respectively. In addition, GG-EEP films demonstrated antifungal effect against Penicillium expansum and Aspergillus niger, along with a sustained antibacterial effect against Escherichia coli and Staphylococcus aureus. GG-EEP films had superior inhibitory ability against Gram-positive bacteria than Gram-negative bacteria. Crucially, GG-EEP composite films played a pivotal role in reducing both lesion diameter and depth, concurrently mitigating weight loss and firmness decline during the storage period of “Nanguo” pears. Therefore, GG-EEP composite films have the considerable potential to serve as advanced and effective active packaging materials for food preservation.

Multicomponent chitosan complex/polyvinyl alcohol blended film with full-band UV-shielding performance and excellent antioxidant property for active food packaging

Utilizing renewable natural resources to construct multifunctional packaging materials is critical to achieving sustainable development in the food packaging industry. In this study, we crafted transparent films with comprehensive UV-shielding and antioxidant properties by blending a multicomponent chitosan complex with polyvinyl alcohol (PVA), subsequently applied to preserve peanut butter. The multicomponent chitosan complex, synthesized from chitosan, ferulic acid (FA), and 5-oxo-3,5-dihydro-2H-thiazolo [3,2-a] pyridine-7-carboxylic acid (TPCA) through direct heating in water, served as the foundation. This chitosan complex was seamlessly blended with PVA, resulting in the creation of a transparent film through the solvent casting method. A meticulous investigation into the chemical structure and physicochemical properties of the blended films was conducted. The FA and TPCA components exhibited robust ultraviolet absorption properties, conferring virtually complete full-band ultraviolet shielding ability to the blend film. Additionally, FA endowed the blended film with significant antioxidant activity. The effectiveness of the chitosan complex/PVA blended film in preserving peanut butter from oxidative spoilage was demonstrated, showcasing its robustness in food preservation. Our research underscores the significance of creating advanced packaging materials from sustainable sources.

High-strength and high-conductivity nanotwinned Cu lightly doped with Ni

We utilized a Cu–Ni co-electrodeposition method to enhance the mechanical strength of nanotwinned copper (NT-Cu), achieving an ultimate tensile strength (UTS) of over 866 ± 20.1 MPa, a 13.1% increase from the original NT-Cu (UTS max of 766 ± 2.7 MPa). ICP-MS analysis showed a nickel content of 0.467 ppm. The Cu–Ni alloy also demonstrated an international annealed copper standard (IACS) value of over 81%, outperforming cold-rolled Cu foils in terms of mechanical strength and IACS value. The addition of Ni was to reduce the Cu grain size, and to increase the twin density of the NT-Cu. A modified confined layer slip (CLS) model is proposed to account for the refined microstructure of the NT-Cu-Ni alloys. Therefore, this approach can tailor the microstructure of NT-Cu, increase its strength, and maintain high electrical conductivity, making it a promising option for advanced packaging materials.

Liquid Metal Embedded Elastomers as High-performance S-TIM Replacements

Thermal interface materials are used as part of comprehensive thermal management strategies in modern electronic devices, ranging from personal computers to automotive and server applications. One crucial material is the thermal interface material that goes in between the die and heat spreader, called the TIM1 material. Key desirable properties of TIM1 materials include: easy application, low thermal resistance, high electrical resistivity, and robustness to thermal cycling and bake. Aiming to achieve these properties, popular choices of TIM1 include gap fillers (rubbery thermal pads), thermal greases (fluidlike polymer TIMs with suspended metal-oxide particles such as aluminum and zinc oxides), solid TIMs (such as sintered silver and indium), and liquid metals (such as Gallium Indium Tin alloys). However, as power densities in semiconductor packages have increased dramatically in recent years, thermal engineers are finding it difficult to find TIMs that have suitably low thermal resistance and can survive the attendant extreme thermal cycling profiles. Recently, researchers have proposed using liquid metal embedded elastomers (LMEEs) as thermal interface materials, leading to Arieca Inc. developing a TIM1 LMEE suitable for the most demanding of applications. In this presentation, we explore the application of LMEEs as a TIM1, subjecting LMEEs to a test suite spanning a wide range of material properties, ranging from complex viscosity to DSC, TGA, and even measuring thermal resistance before and after applying strains of 380% to an interface bonded together using only LMEE. We find that by adjusting the polymer composition, cure temperatures can be tuned, without significantly affecting thermal reliability. Additionally, we observe thermal resistance approaching 2 mm2K/W in an ASTM D5470 test setup, and highlight how this range of properties can be used to directly bond two surfaces together without a lid sealant and maintain good thermal contact. Finally, we conclude with some remarks to highlight the expanding opportunities on the technological frontier opened up by this class of advanced packaging materials.

Advanced Packaging Materials and Open Innovation at Resonac

GBC Presentation Outline: • Corporate Introduction • Introduction of Packaging Solution Center JOINT2 • R Status for Advanced Package

Soft-template-assisted bottom-up fabrication of tunable porosity monolithic copper film for interconnection in microelectronics

Background: Third-generation devices offer superior attributes, necessitating advanced packaging materials for harsh operating environments. Incorporating 3D porous architectures to increase the reaction area further enhances the reaction rate, making transient liquid phase bonding an ideal interconnection process. Methods: Fabrication of monolithic porous Cu films using a bicontinuous microemulsion (BME) as a dynamic soft template is reported. The BME phase consists of interconnected three-dimensional networks of aqueous and oil phases, separated by surfactants and cosurfactants. This unique structure enables the selective electrodeposition of Cu exclusively within the aqueous region, preventing any unwanted reactions in the oil phase. Tunable porosity in the monolithic Cu film is achieved by adjusting the water to oil phase ratio in the BME. Significant findings: The Sn-plated porous Cu films exhibit low-temperature reflow capability while still maintaining high service temperatures. The utilization of the BME soft template offers a promising approach for fabricating monolithic Cu films with tunable porosity, providing flexibility in controlling the compositions and performance of interconnections. The compatibility of the BME with existing wafer deposition techniques makes it a viable and scalable solution for mass production. The electrodeposition of monolithic Cu arrays on Cu pillars demonstrates its potential applicability in advanced packaging technologies.

Facile Synthesis and the Thermal Properties of Al/Si Composites Prepared via Fast Hot-Pressing Sintering

In this paper, a novel power sintering technique, named fast hot-pressing sintering (FHP), which is able to achieve an ultrahigh heating rate similar to the spark plasma sintering (SPS) technique, but at a much lower cost, was applied to prepare a series of Al/Si composites with different Si volume ratios (12 vol.% to 70 vol.%) to meet the requirements of advanced packaging materials for electronic devices. In contrast to SPS, the FHP oven possesses a safe and budget-friendly current power supply, rather than a complex and expensive pulse power supply, for its heating power. The optimized sintering parameters (temperature, pressure and holding time) of FHP for preparing Al/Si composites were investigated and determined as 470 °C, 300 MPa and 5 min, respectively. In order to characterize the potential of Al/Si composites as packaging materials, thermal conductivities and coefficients of thermal expansion were studied. The thermal conductivity of the Al-40Si composite sintered by the FHP method is higher than that of the conventional SPS method (139 to 107 W m−1 K−1). With the increase in Si, the thermal conductivities and coefficients of thermal expansion on both decreases. Furthermore, the thermal conductivities obey the Agari model, whereas the coefficient of thermal expansion and Si volume ratios obey additivity. The numeric modeling would help develop required packaging materials based on the thermal performances of the substrate materials, like Si or GaAs semiconductor devices.

Supramolecular cross-linking affords chitin nanofibril nanocomposites with high strength and water resistance

Polysaccharide nanofibrils of chitins or celluloses are emerging biobased building blocks for sustainable, high-performance bioinspired nanocomposites fusing high stiffness, strength, and other functionalities. Owing to their hygroscopicity, a crucial challenge towards real-life applications of these nanocomposites is to maintain their mechanical performances in the humid or even fully swollen conditions. Here, we report water resistant nanocomposites composed of sustainable chitin nanofibrils (ChNFs) and polyvinyl alcohol (PVA) that are physically cross-linked by tannic acid (TA) to enhance and stabilize wet mechanical properties. We demonstrate that the formation of polymer-coated core/shell nanofibrils at the intermediate stage is crucial for the well-defined nanopaper structures after casting. By infiltrating TA, the formation of hydrogen bonding in the PVA matrix and at the ChNF/PVA interface renders the nanocomposites with extremely high strength and stiffness, even under high humidity and swelling conditions. With the increase in the amount of conjugated TA, the Young's modulus and tensile strength of the swollen nanocomposites reach up to 3.0 GPa and 70 MPa, respectively, which are superior to the existing water-borne nanofibils/polymer nanocomposites. Moreover, the nanocomposite films show excellent gas barrier properties at high relative humidity (90%), as well as UV shielding, antibacterial properties and biodegradability, complementing the multifunctional property profile and allowing a transfer into applications as advanced packaging materials.

MXene-Layered Double Hydroxide Reinforced Epoxy Nanocomposite with Enhanced Electromagnetic Wave Absorption, Thermal Conductivity, and Flame Retardancy in Electronic Packaging.

Due to the increased integration and miniaturization of electronic devices, traditional electronic packaging materials, such as epoxy resin (EP), cannot solve electromagnetic interference (EMI) in electronic devices. Thus, the development of multifunctional electronic packaging materials with superior electromagnetic wave absorption (EMA), high heat dissipation, and flame retardancy is critical for current demand. This study employs an in-situ growth method to load layered double hydroxides (LDH) onto transition metal carbides (MXene), synthesizing a novel composite material (MXene@LDH). MXene@LDH possesses a sandwich structure and exhibits excellent EMA performance, thermal conductivity, and flame retardancy. By adjusting the load of LDH, under the synergistic effect of multiple factors, such as dielectric and polarization losses, this work achieves an EMA material with a remarkable minimum reflection loss (RL) of -52.064dB and a maximum effective absorption bandwidth (EAB) of 4.5GHz. Furthermore, MXene@LDH emerges a bridging effect in EP, namely MXene@LDH/EP, leading to a 118.75% increase in thermal conductivity compared to EP. Simultaneously, MXene@LDH/EP contributes to the enhanced flame retardancy compared to EP, resulting in a 46.5% reduction in the total heat release (THR). In summary, this work provides a promising candidate advanced electronic packaging material for high-power density electronic packaging.

Constructing Hierarchical Polymer Nanocomposites with Strongly Enhanced Thermal Conductivity.

The rapid advancement of communication technology has substantially increased the demand for advanced electronic packaging materials with high thermal conductivity and outstanding electrical insulation properties. In this study, we design polyvinyl alcohol/polydopamine-modified boron nitride nanosheet (PVA/BNNS@PDA) nanocomposites with hierarchical structures by combining electrospinning, vacuum filtration deposition, and hot pressing. The modified BNNS@PDA improves the interaction between the filler and the polymer matrix while reducing the interfacial thermal resistance, resulting in superior thermal conductivity, excellent insulation, and perfect flexibility. The PVA/BNNS@PDA nanocomposites possess an ultrahigh in-plane thermal conductivity of 16.6 W/(m·K) at 35.54 wt % BNNS@PDA content. Even after 2000 folds, the nanocomposites do not undergo any crack, showing their ultrahigh thermal conductivity behavior. Furthermore, the nanocomposites exhibit a volume resistivity above 1014 Ω·cm, which is well above the standard for insulating materials. Based on these results, this work provides a novel method to produce nanocomposites with high thermal conductivity, offering a new perspective to design advanced thermal management materials.

Low dielectric silsesquioxane-modified benzocyclobutene composites

Benzocyclobutene (BCB) resin has been widely used as an advanced electronic packaging material due to its excellent low-dielectric (low-k) properties, good thermal stability, and high planarization. However, it is still urgent to further reduce its dielectric constant for high-frequency applications. Herein, a series of organoalkoxysilane (D4Sin)-functionalized thermosetting benzocyclobutene (BCB) resins were reported. Precursors with the large hindrance of 2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane (D4Vi) ring as the core, as well as tunable vinyl and methoxyl substituents as pendant groups, have been successfully prepared by the efficient platinum-catalyzed hydrosilylation reaction. They can further undergo the pre-polymerization via hydrolytic condensation of methoxyl groups and post-thermal curing processes via thermal-induced ring-opening and Diel-Alder reactions between vinyl groups and bis (benzocyclobutenyl) divinyltetramethylsiloxane (DVS-BCB), respectively. The fully cured materials exhibited excellent dielectric properties with a dielectric constant (Dk) of 2.20 and a dissipation factor (Df) of 7.04 × 10−4, good thermal stability (the 5% weight loss temperature, Td5 ˃ 445 °C), strong hydrophobicity (water contact angle >100°) and good mechanical properties. Compared with traditional thermosetting BCB resins, this procedure combined BCB resins with silsesquioxanes including the ladder/cage-like or network topological structures. This work provided a simple and universal method to construct intrinsically porous materials of organoalkoxysilane-functionalized BCB resins, laying the foundation for the future fabrication of ultra-low dielectric electronic packaging materials with nanoscale pores.

Engineering tannic acid with tailored structure into Poly(propylene carbonate) towards supramechanical performance and multi-functions

It's significant but challenging to prepare PPC with supramechanical performance and multi-functions. In this work, a mechanically robust, fluorescent, transparent and UV-shielding PPC composite is successfully prepared for the first time by incorporating a hydroxyalkylated tannin acid (mTA). Compared to TA, mTA shows an excellent compatibility to PPC due to the grafted plentiful flexible isopropanol oligomers with terminal hydroxyl group. The effects of content and grafting degree of mTA on the mechanical properties of PPC/mTA composites are investigated and the mechanism for the high strength and high toughness is revealed. By introducing 3 phr mTA with medium grafting degree (m-mTA), PPC/m-mTA3 shows a tensile strength of 23.38 ± 0.96 MPa and an elongation at break of 852 ± 37%, which is comparable to LDPE and LLDPE and implies the great potential of PPC to replace non-biodegradable PE materials. The supramechanical performance is the result of the combined multiple hydrogen bonding and plastic deformation zone originating from the excellent compatibility. Besides, Tg of mTA will affect the yield strength of PPC/mTA composites. More importantly, PPC/m-mTA film shows the fluorescent effect with dual-mode responsiveness, good UV-shielding effect and transparency, which will expand the application of PPC into advanced packaging materials. We envision that this work opens a novel yet facile way to prepare PPC with supramechanical performance and multi-functions, and will promote the practical application of PPC materials.

Halloysite Nanotube as a Functional Material for Active Food Packaging Application: A Review.

Halloysite nanotubes (HNTs) are naturally occurring nanomaterials with a tubular shape and high aspect ratio, a promising functional additive for active food packaging applications. HNTs have been shown to possess unique properties such as high surface area, thermal stability, and biocompatibility, making them attractive for active food packaging materials. This review summarizes recent research on the use of HNTs as functional additives in active food packaging applications, including antimicrobial packaging, ethylene scavenging packaging, moisture, and gas barrier packaging. The potential benefits and challenges associated with the incorporation of HNTs into food packaging materials are discussed. The various modification methods, such as the physical, chemical, biological, and electrostatic methods, along with their impact on the properties of HNTs, are discussed. The advantages and challenges associated with each modification approach are also evaluated. Overall, the modification of HNTs has opened new possibilities for the development of advanced packaging materials with improved performance for various functional food packaging materials with enhanced properties and extended shelf life.

Recent Advances in Packaging Technology of Seafood Products

Packaging is developing about the development of consumer demands and awareness day by day. Packaging technology is a technology that is constantly evolving. Monitoring seafood products at all stages from the moment they are caught to the moment they are consumed is extremely important for the quality of seafood products and prevention of diseases caused by seafood. Therefore, by using of improved packaging techniques, not only can be prevented the contamination of fishery products with microorganisms, but also the quality and suitability of fishery products for consumption can also be monitored at every stage. In this review, conducted studies regarding advanced packaging materials and products for seafood products have been mentioned and studies on recent advanced packaging applications in fresh and processed fishery products in recent years were compiled.

Enhanced thermal conductivity of epoxy composites reinforced with oriented polydopamine-graphene foam complexed by metal ions

Although graphene has aroused considerable interest in the thermal conductive enhancement of polymer composites for its superb intrinsic thermal conductivity, the enhancement efficiency is still limited by its production-induced defects, misalignment and intense phonon interface scattering. Herein, the three-dimensional (3D) polydopamine-graphene foam (PGF) with high orientation and good interfacial bonding has been prepared by electro-exfoliation, surface modification and unidirectional-freezing. This unique structure imparts excellent thermal conductivity, electrical insulation and good mechanical property to the PGF/epoxy (PGF/EP) composite. The highly arranged and compact stacked PDA-graphene sheets bound by metal ions provide heat conduction paths for effective phonon transport within the matrix. The manufactured PGF/EP shows enhanced through-plane thermal conductivity of 3.48 W/m·K with 3.02 vol% of PGF, excellent surface & volume electrical resistivity (2.7 × 1011 Ω and 1.65 × 1011 Ω·cm) and high mechanical strength (82.74 MPa), as well as the outstanding heat dissipation performance. Therefore, the PGF/EP composites prepared in the present study have a broad application prospect in advanced electronic packaging materials.