Advanced Packaging Materials Research Articles

The Dynamic Properties at Elevated Temperature of the Thermoplastic Polystyrene Matrix Modified with Nano-Alumina Powder and Thermoplastic Elastomer.

The performance improvement of advanced electronic packaging material is an important topic to meet the stringent demands of modern semiconductor devices. This paper studies the incorporation of nano-alumina powder and thermoplastic elastomer (TPE) into thermoplastic polystyrene matrix to tune the thermal and mechanical properties after injection molding process. In the sample preparation, acetone was employed as a solvent to avoid the powder escape into surrounding during the mechanical mixing in a twin-screw mixer. The pressure and shear force were able to mix the composite with good uniformity in compositions. The samples with different compositions were fabricated using injection molding. The measured results showed that adding 5 wt.% of TPE into the simple polystyrene was able to raise the melt flow index from 12.3 to 13.4 g/10 min while the thermal decomposition temperature remained nearly unchanged. Moreover, the addition of small amount of nano-alumina powder could quickly improve the mechanical property by raising its storage modulus. For example, the addition of 3 wt.% of nano-alumina powder had an increase of 7.3% in storage modulus. Over doping of nano-alumina powder in the composite, such as 10 wt.%, on the other hand, lowered the storage modulus from 2404 MPa to 2069 MPa. The experimental study demonstrated that the tuning in the polystyrene’s thermal and mechanical properties is feasible by composition modification with nano-alumina powder and TPE. The better concentration of the additives should be determined according to the specific applications.

N-doped carbon dots incorporated chitosan/polyvinylpyrrolidone based polymer film for advanced packaging applications

We have explored the use of N-doped carbon dots (NCDs) as a strengthening agent for the preparation of advanced packaging materials. The incorporation of NCDs in chitosan-polyvinylpyrrolidone (chitosan-PVP) film was achieved by a simple solution casting method to improve the mechanical properties and biodegradability of the film. Orange peel extract has flavouring and antimicrobial properties, incorporated into the film. The synthesized films showed enhanced tensile strength and elongation at break and moisture resistance properties. Moreover, it showed excellent biodegradation ability and promotes plant growth. Therefore, NCDs incorporated film with orange peel extract can be recommended for food packaging applications.

Fractionated Lignosulfonates for Laccase-Catalyzed Oxygen-Scavenging Films and Coatings.

Lignin derivatives have potential as antioxidants in advanced packaging materials through their ability to scavenge oxygen in reactions catalyzed by phenol-oxidizing enzymes, such as laccase. The effects of size fractionation of lignosulfonates on laccase-catalyzed reactions were investigated in experiments with aqueous solutions, films, and coated paperboard. Four industrial lignosulfonate preparations were compared: Feed (unfractionated), Prod (5–60 kDa enriched), Conc (≥60 kDa enriched), and Perm (≤60 kDa enriched). Extraction of lignosulfonates from films showed that the enzymic reaction increased the average molecular weight from <10,000 to up to 66,000. The enzymatic reaction resulted in an increase in the water contact angle of the films from the range 25–49° to 56–81°. The four preparations showed relatively small differences with regard to their ability to scavenge oxygen in aqueous solution and in experiments with coated paperboards in sealed chambers. Coatings with lignosulfonates where the contents of low-molecular weight material had been reduced (i.e., Prod and Conc) showed improved water resistance after the enzymic reaction. Thus, in both aqueous and solid media, fractionation of lignosulfonates had little effect on oxygen scavenging, but fractionation was beneficial for other reasons, such as improved cross-linking resulting in higher molecular weight and superior water resistance.

Thermally conductive h-BN reinforced PEI composites: The role of processing conditions on dispersion states

In this study, h-BN, reinforced PEI composites were studied up to 30 wt% through optimizing process conditions of melt-mixing to tune the thermal conductivity at relatively low-filler ratios while possessing a scalable manufacturing process with thermoplastics operating at high temperatures. The effects of processing parameters on the rheological properties and thermal conductivities of resulting h-BN/PEI composites were determined. DSC and TGA analyses showed that h-BN addition did not lead to a significant change in Tg; however, thermal decomposition temperatures of PEI were shifted. At 30 wt% h-BN loading, a high thermal conductivity as 0.82 W/mK was achieved, which is three times that of neat PEI. The significant enhancement in thermal conductivity was attributed to effective dispersion state of h-BN, creating an enhanced phonon transport mechanism confirmed through rheological analysis. This work provides a thermo-economic solution with relatively low-filler loading ratios in a high temperature and high performance operating polymer. These polymer composites were successfully fabricated in a filament form as candidates for lightweight advanced packaging materials by either injection molding or 3D printing.

In Situ Grafting of Silica Nanoparticle Precursors with Covalently Attached Bioactive Agents to Form PVA-Based Materials for Sustainable Active Packaging

Sustainable antibacterial–antioxidant films were prepared using in situ graftings of silica nanoparticle (SNP) precursors with covalently attached bioactive agents benzoic acid (ba) or curcumin (cur) on polyvinyl alcohol (PVA). The modified PVA-SNP, PVA-SNP-ba and PVA-SNP-cur films were characterized using spectroscopic, physicochemical and microscopic methods. The prepared films showed excellent antibacterial and antioxidant activity, and increased hydrophobicity providing protection from undesired moisture. The PVA-SNP-ba films completely prevented the growth of the foodborne human pathogen Listeria innocua, whereas PVA-SNP-cur resulted in a 2.5 log reduction of this bacteria. The PVA-SNP-cur and PVA-SNP-ba films showed high antioxidant activity of 15.9 and 14.7 Mm/g TEAC, respectively. The described approach can serve as a generic platform for the formation of PVA-based packaging materials with tailor-made activity tuned by active substituents on silica precursors. Application of such biodegradable films bearing safe bioactive agents can be particularly valuable for advanced sustainable packaging materials in food and medicine.

Three-dimensional skeleton assembled by carbon nanotubes/boron nitride as filler in epoxy for thermal management materials with high thermal conductivity and electrical insulation

Due to high aspect ratio, excellent thermal conductivity, and electrical insulation, boron nitride exhibits a great potential in the field of electronic packaging. However, its longitudinal thermal conductivity is far poor than horizontal thermal conductivity, which limits its application in a wider field. Herein, a three-dimensional (3D) network structure is constructed by coating boron nitride nanosheets/carbon nanotubes on foam skeleton derived from the commercial polyurethane (PU) (3D BNNS/CNTs). The in-situ grown CNTs on the surface of BNNS produce an interconnected network structure. The resultant 3D skeleton coupled with cross-linked BNNS/CNTs endows it with excellent thermal and mechanical properties. After curing with epoxy resin, the optimized 3D BNNS/CNTs15 %/Epoxy composite obtains a high thermal conductivity of 1.49 W m−1 K−1 at a low loading of 20 wt%, which achieves a thermal conductivity enhancement of 1046 % compared to neat epoxy resin. Meanwhile, the synthesized 3D BNNS/CNTs15 %/Epoxy composite maintains a high electrical resistivity above 1010 Ω m, high elastic modulus of 1.0 GPa and tensile stress of 35 MPa. Thus, this strategy may offer a new insight for constructing advanced packaging materials with excellent thermal and mechanical performances for electronic device.

Enhanced thermal conductivity and mechanical properties of natural rubber-based composites co-incorporated with surface treated alumina and reduced graphene oxide

Polymer composites with high thermal conductivity and good mechanical properties have considerable potential for application in modern micro-electronic devices. In this study, novel core-shell structured fillers (denoted as F-GA) were synthesized by covalently linking aluminum oxide modified with poly (dopamine) and graphene oxide. F-GA/natural rubber (NR) composites were prepared by vacuum-assisted filtration and their thermal conductivity and mechanical properties were investigated. The thermal conductivity of the F-GA/NR composites was 0.863 W/m·K at 25 wt% F-GA filler loading. In addition, the F-GA/NR composites exhibited outstanding mechanical properties and good electrical insulation properties. The interfacial thermal resistance was reduced because of the presence of covalent bonds and three-dimensional structures. The F-GA/NR composites prepared in the present study have a broad application prospects in advanced electronic packaging materials.

MXene confined in shape-stabilized phase change material combining enhanced electromagnetic interference shielding and thermal management capability

For new-generation miniaturized and high-frequency electronics, it is of vital importance to develop advanced electronic packaging materials, which combine high electromagnetic interference (EMI) shielding effectiveness (SE) and efficient thermal management capabilities, including heat absorption, thermal conductivity (TC) and heat dissipation. However, high EMI SE and efficient thermal management usually cannot complement each other for the same packaging material, because EMI shielding devices convert electromagnetic radiation directly into heat consumption, leading to consequent severe challenge to dispose heat dissipation. Herein, we have newly developed a high-performance phase change composites, in which MXene is confined in shape-stabilized phase change material (PCM) for simultaneous achievement of high EMI SE and efficient thermal management. Regarding high EMI, MXene can effectively shield electromagnetic radiation by converting the radiation into heat consumption. As for thermal management, PCM enables efficient heat absorption via the phase change process, and MXene enhances the thermal conductivity (TC) of MXene/PCM composite to facilitate heat dissipation. As a result, our developed MXene/PCM composite can achieve a high EMI SE of 64.7 dB in X-band, with an improved TC of 0.74 W/m·K. Furthermore, the interlayer capillary effect of MXene inhibits the leakage of liquid PCM during the solid-liquid phase transition, which can maintain the PCM shape stability. Our newly-designed shape-stabilized MXene/PCM composites with high EMI SE and large TC shed new light on designing EMI shielding materials with prolonged exposure to electromagnetic radiation, which can be envisioned to exhibit vast implications for advanced new-generation miniaturized and high-frequency electronics.

Ice-templated assembly strategy to construct three-dimensional thermally conductive networks of BN nanosheets and silver nanowires in polymer composites

Polymer composites have been widely employed as electronic packaging materials, due to their low cost, flexibility, chemical stability, and high malleability, etc. However, the thermal conductivity of polymer composites becomes increasingly requirement, with the rapid growth of electronics toward miniaturization and high-power density. Conventional method to enhance the thermal conductivity of polymer is addition of high-content thermally conductive fillers, but it will deteriorate other significant properties of polymers, such as optical, electrical, and mechanical performance. Herein, we report an ice-templated assembly strategy to construct three-dimensional thermally conductive networks of BN nanosheets (BNNS) and silver nanowires (AgNWs) in epoxy resin composites. The thermal-conduction pathway can be easily built by the synergistic effects between two-dimensional BNNS and one-dimensional AgNW. Furthermore, the welding of the adjacent AgNWs through low-temperature sintering process enlarges the total contact area per unit filler volume. The resulted polymer composite thus exhibits a through-plane thermal conductivity of 1.10 Wm−1K−1 at only about 5.0 vol% fillers content, which is six times higher than that of the pure epoxy resin. This work shows great potential in advanced packaging materials, such as substrate materials and printed circuit board materials.

Thermoplastic Polymer Compounding with ZnS Nanostructures: Innovations and Applications

This study investigates the compounding of thermoplastic polymers with ZnS nanostructures, focusing on innovative synthesis methods and applications. The principal objective was to enhance the mechanical, thermal, and electrical properties of thermoplastic polymers by incorporating well-characterized ZnS nanoparticles. Utilizing a chemical precipitation method, ZnS nanoparticles with controlled size and high purity were synthesized. Characterization techniques, including XRD, SEM, TEM, EDS, and FTIR, confirmed the crystalline structure and elemental composition of the nanoparticles. Three compounding techniques—melt blending, solution casting, and in-situ polymerization—were explored for integrating ZnS nanoparticles into thermoplastic matrices. Each method was optimized for uniform nanoparticle dispersion and strong interfacial bonding. The findings revealed that nanocomposites produced via these techniques exhibited significantly enhanced tensile strength, impact resistance, thermal stability, and electrical conductivity compared to pure thermoplastics. The study's implications extend to industrial applications in electronics, automotive components, aerospace parts, and advanced packaging materials. The environmental benefits, such as reduced material consumption and improved recyclability, along with potential economic savings, underscore the broader impact of these advanced materials. This research provides a solid foundation for future development of high-performance ZnS-thermoplastic nanocomposites, promoting innovation in material science and industrial applications.

Electrical insulating MXene/PDMS/BN composite with enhanced thermal conductivity for electromagnetic shielding application

Insulating materials with effective electromagnetic interference (EMI) shielding and heat dissipation are urgently required for modern electronic devices and systems, but it seems that the EMI shielding cannot be compensated without sacrificing the electrical insulation performance. In this study, a layer-by-layer spin coating process has been proposed to prepare multilayer films (MXene/polydimethylsiloxane/boron nitride, MXene/PDMS/BN) with ordered alternate structures, and the EMI shielding effectiveness (EMI SE), thermal conductivity, along with electrical insulation properties of multilayer films have been systematically investigated. The conductive network of MXene/PDMS layer was in-plane constructed, leading to the effective EMI shielding of the multilayer films. Moreover, the BN/PDMS layer can insulate the conductive path through plane and provides effective heat dissipation for multilayer films. The EMI SE of multilayer films is positively related to the number of layers, but the increase in the number of layers will deteriorate the thermal conductivity and electrical insulation performance. The EMI SE of the multilayer film with 11-Layers structure can reach 35.2 dB at 10.9 GHz, with a thermal conductivity of 0.65 W/m·K, and volume resistivity of 2.9 × 1012 Ω cm, as well as a breakdown strength of 3.29 KV/mm, respectively. This research can shed new light on the development of multifunctional composite, which can be envisioned as an advanced electronic packaging material.

Nanocellulose Bio-Based Composites for Food Packaging.

The food industry is increasingly demanding advanced and eco-friendly sustainable packaging materials with improved physical, mechanical and barrier properties. The currently used materials are synthetic and non-degradable, therefore raising environmental concerns. Consequently, research efforts have been made in recent years towards the development of bio-based sustainable packaging materials. In this review, the potential of nanocelluloses as nanofillers or as coatings for the development of bio-based nanocomposites is discussed, namely: (i) the physico-chemical interaction of nanocellulose with the adjacent polymeric phase, (ii) the effect of nanocellulose modification/functionalization on the final properties of the composites, (iii) the production methods for such composites, and (iv) the effect of nanocellulose on the overall migration, toxicity, and the potential risk to human health. Lastly, the technology readiness level of nanocellulose and nanocellulose based composites for the market of food packaging is discussed.

Highly thermally conductive polymer composites with barnacle-like nano-crystalline Diamond@Silicon carbide hybrid architecture

Polymeric composites with the advantages of easy process, light weight and good chemical resistance were employed in thermal management. The construction of a new type thermal conductive filler has become an efficient method for improving the thermal transportation performance of polymer composite. In this work, a barnacle-like nano-crystalline diamond@silicon carbide (ND@SiC) is prepared through depositing ND on SiC powders in a hot filament chemical vapor deposition (HFCVD). ND@SiC/PVDF composite was prepared and their thermal transportation properties were investigated. The obtained composites with 70 wt% ND@SiC loading exhibit a high thermal conductivity of 2.39 W m−1 K−1, which increased by 1132% in comparison with the pure polymer. It is also much higher than that of the composite adding 70 wt% SiC powders (1.48 W m−1 K−1). The high thermal conductivity of polymer composites by adding the ND@SiC filler is mainly attributed to the novel barnacle-like structure. This work provides a new idea to significantly enhance thermal transportation properties of composites as used in advanced packaging materials.

Implementation of High Gas Barrier Laminated Films Based on Cellulose Nanocrystals for Food Flexible Packaging

In this work, three types of cellulose nanocrystals (CNCs) were used: CNCSO3H extracted from wood pulp by sulfuric acid (H2SO4), CNCCOOH extracted from cotton linters by ammonium persulfate (APS) and CNCCOOR obtained by esterification of the previous two CNCCOOH and CNCSO3H. For a comparative assessment of gas barrier performance, plastic films such as PLA, PET, PE, PP, OPP and OPA were selected, coated with the three types of CNCs and finally laminated with a solvent-based polyurethanic adhesive. First, all dispersed CNCs were characterized by apparent hydrodynamic diameter and Z potential by means of dynamic light scattering (DLS) and electrophoretic light scattering (ELS) techniques, respectively, followed by the crystallinity index (XRD), thermogravimetric analysis (TGA) and evaluation of Fourier-transform infrared spectroscopy (FTIR), as well as the charges density. The surface chemistry of coated plastics (CNCs-P) was assessed by the Z potential through the electrokinetic technique (streaming potential method) and the optical contact angle (OCA). Lastly, laminated films (P-CNC-P) were evaluated by gas permeability measurements at 23 °C and 50–80% RH. It is worth noting that improvements between 90% and 100% of oxygen barrier were achieved after the lamination. This paper provides insights on the choice of cellulosic nanomaterials for the design and development of advanced and sustainable food packaging materials.

Application of MAP and ethylene\u2013vinyl alcohol copolymer (EVOH) to extend the shelf-life of green and white asparagus (Asparagus officinalis L.) spears

In this study, ethylene vinyl alcohol copolymer (EVOH) and polypropylene/polyethylene (PP/PE) films combined with MAP packaging were developed to enhance the shelf-life of green and white asparagus spears. The scope of the research included measurements of weight loss, pH, acidity, color, texture, and sensory analysis as indicators of green and white asparagus spear quality for up to 17 days of storage at 2 and 10 °C. The application of modified atmosphere packaging combined with EVOH-based packaging material and refrigeration at 2 °C promoted a reduction in asparagus weight loss, preventing changes in color and texture as well as sensory quality, thereby extending the shelf-life of the asparagus. According to the obtained results, it was possible to maintain good quality of green and white asparagus for up to 17 and 10 days, respectively, when packed in MAP using EVOH-based packaging stored at 2 °C. Asparagus stored in packaging with PP/PE film showed lower quality during storage at 2 and 10 °C. These results suggest that EVOH films are potential candidates for advanced packaging materials for the asparagus packaging application.

Recent advances in polymer-based electronic packaging materials

Abstract High-density integration and packaging technologies are highly desired to integrate more functionality into a smaller form factor with improved performance, in which the polymer-based electronic packaging materials play a key role. In this short review, we will give a brief summarization of some key polymer-based electronic packaging materials, including flip-chip underfill, thermal interface material, dielectric material and EMI shielding material. The key factors influencing the performance of polymer-based electronic packaging materials, such as the surface modification of filler, orientation of polymer chains and microstructures of materials are discussed. In addition, prospective research opportunities toward the development of advanced polymer-based electronic packaging materials are highlighted and the challenges and outlook of polymer composites for electronic packaging are prospected.

Use of colorimetric hydrogel as an indicator for food packaging applications

A novel hydrogel was synthesized from N,N-dimethyl acrylamide (DMAAm), gelatin, citric acid (CA) and Basilicum extract (BE). This study was aimed at creating an advanced food packaging material that allows the detection of food spoilage, which can be monitored colorimetrically. The poly(gelatin-co-DMAAm)/CA–BE was synthesized in the form of a film on Petri dishes using a redox polymerization technique. Mechanical and water resistance properties of the hydrogel were further improved by the addition of CA and N,N-methylene-bis-acrylamide as crosslinkers; BE was added to the reaction mixture and entrapped in the polymer chains with the aim to introduce antimicrobial, antioxidant and anthocyanin properties for the desired utilization. The characterization of the synthesized hydrogel was carried out using a dynamic and mechanical analyser, thermo gravimetric analyser, Fourier transform infrared spectroscopy and scanning electron microscopy. The antimicrobial activity of the hydrogel was observed as it was tested against Escherichia coli, Bacillus subtilis and Staphylococcus aureus. Furthermore, total antioxidant and anthocyanin activities of the hydrogels were also studied at different pH values to monitor the colour change capabilities. It was concluded that the hydrogel was a strong candidate for use in food packaging.

Segregated double network enabled effective electromagnetic shielding composites with extraordinary electrical insulation and thermal conductivity

Miniaturization and high frequency are two key features of the next generation electronic devices, thus advanced electronic packaging materials with high thermal conductivity and excellent electromagnetic shielding performance (EMI SE) are highly expected. This work presents poly (vinylidene fluoride)@multi-wall carbon nanotube/boron nitride (PVDF@MWCNT/BN) composites with effective EMI SE and satisfactory insulation and thermal conductivity through a tailor-made segregated double network. PVDF@MWCNT composite microspheres were fabricated as the thermal and electrical conductive micro-network, then another BN macro-network was further prepared to provide electrical insulation and further thermal conductivity enhancement. This so-called double segregated network of PVDF@MWCNT/BN composites shows a thermal conductivity of 0.83 W m−1 K−1, electron insulation of 8.33 × 10−14 S cm−1 and electromagnetic shielding of 8.68 dB at 8.2 GHz when loaded 5 wt% MWCNT and 40 wt% BN. The study sheds new lights on the development of special functional materials and the PVDF@MWCNT/BN composites are highly promising as a future electronic packaging material.

Structures and Properties of Self - crosslinking Silicone Resin

Highly transparent silicone resin with self-crosslinking structure was prepared using phenyltrimethoxysilane, diphenyldimethoxysilane, 1,3,5,7-cyclotetra(methyl siloxane) and bisvinyltetramethyldisiloxane as main raw materials. The structure of silicone resin was determined by Fourier Transform Infrared Spectroscopy (FT-IR). The light transmittance was measured by UV-Vis spectroscopy. Thermogravimetric analysis (TGA) was used to study the thermal decomposition process. The microstructure of cured self-crosslinking silicone resin is more uniform, resulting in better light transmittance up to 100% in the range of 400nm ~ 800nm. The cured has relatively good heat resistance, the initial thermal decomposition temperature of the cured could be up to 315.8 °C. SEM observations show that the self-crosslinking silicone has a uniform, textured structure, higher transparency compared with the existing condensation silicone material, and can be used as advanced architectural translucent materials and optics packaging materials.

Development of antimicrobial polyolefin films containing lauroyl arginate and their use in the packaging of strawberries

Low-density polyethylene (LDPE) films were supplemented with lauroyl arginate ethyl (LAE) and characterized for physical, mechanical and antimicrobial properties as well as their use for fresh ‘Sulhyang’ strawberries packaging. LAE powder was added into the LDPE films at 0, 1, 3, 5, and 10% (w/w) and assessed for physical properties, gas permeation, thickness and color values. The results showed that incorporation of LAE into the LDPE matrix did not affect film thickness and color. The thermal stability of the LAE/LDPE film decreased with increasing concentrations of LAE. The LAE/LDPE film exhibited a rough surface and compact structure. Tensile strength were affected by addition of LAE on the other hand value of elongation at break were increased. The LAE/LDPE containing 5 and 10% LAE showed significant antimicrobial properties against mycelium growth. Further, 5 and 10% LAE/LDPE films were used for storage study and it showed that incorporation of LAE into LDPE film was an effective method for maintaining the quality of strawberries. Films containing LAE were very effective at reducing the total weight loss, maintaining firmness, and reduced fungal decay compared to the control strawberries at 10 °C. These results suggest that LAE/LDPE films are potential candidates for advanced packaging materials for the fruits packaging application.