Abstract The purpose of this presentation is to examine how certain mainline silicon substrate and semiconductor wafer manufacturing processes, can be and are being applied to applications in the manufacture of some of the most advanced digital devices including advanced packaging applications. Periodically, the manufacturing steps and procedures of advanced semiconductor devices have changed dramatically enough that they are termed “paradigm shifts.” Two of the more dramatic manufacturing paradigm shifts in our professional lifetimes have been Precision Ultra-Thinning, and Chemical Mechanical Polishing to achieve planarization of substrates and specifically thin films that have been deposited on those substrates. In addition to the many activities in all or nearly all semiconductor IC manufacturing operations (Integrated Circuits), these two advanced technologies are now being applied to the manufacture of MEMS, MOEMS, LEDs, OLEDs, Nanotechnology and their associated Advanced Packaging methods and procedures. In our technology driven world, it is safe to say that hardly anything in the world of microelectronics, semiconductors, and nanotechnology has been invented only for its awe-inspiring beauty alone, with no intrinsic value toward the improvements in form factor (miniaturization), and functional operation (speed, capacity, reliability, etc.). The same can be said about these two interesting technologies.