Abstract This paper describes the results of the risk reduction testing task recently completed by Embedded Systems LLC under the Air Force SBIR contract {5} titled “Improved Full Authority Digital Engine Control (FADEC) System”. The objective of this program has been to develop a hierarchical, distributed architecture for future propulsion FADEC and aerospace control systems with flexible, scalable and reconfigurable Smart Nodes (SN) built with high temperature capable devices. A key part of this program is the design, development and validation of the System On Chip (SOC) chipset in high temperature (225 Deg. C) SOI (Silicon On Insulator) technology ASIC (Application Specific Integrated Circuit) devices. The SOC chipset designed by Embedded Systems LLC provides the scalability and reconfigurability that enables the Smart Node to interfaces with most sensors and actuators found in FADEC and other aircraft control systems. The analog portion of this 2-chip SOC chipset fabricated by Honeywell using their SOI process is working properly. The digital portion of the SOC chipset, currently implemented in a commercial temperature FPGA (Field Programmable Gate Array), contains important computational functions needed for reconfiguring the SOC and performing complex control functions, such as real time control of an actuator, The risk reduction task was therefore focused on verification and validation of these key functions in a real environment before converting the design into an ASIC. The recent successful demonstration of the real time actuator control capability has minimized the risks and cleared the way for the digital ASIC implementation. The complete high temperature SOC chipset is expected to be available in late 2016.