Controlled material removal by anodic dissolution at high rates forms the basis of non-conventional metal shaping and finishing processes such as Electrochemical Machining (ECM), Electrochemical Micromachining (EMM), and Electropolishing (EP). These processes are employed in the manufacturing and processing industries for a variety of applications ranging from the machining of complex shaped components for heavy industries to the fabrication of microstructures in thin films and foils and microfinishing of superconducting radiofrequency cavities (1-3). Application of these processes for the production of reliable, reproducible, and high-yielding components require an understanding of the parameters that influence the anodic dissolution processes.ECM, EMM, and EP can be understood and theoretically modeled based on the same principles provided the scaling effects related to each process are considered (2). In the first part of this presentation, the high rate anodic dissolution behavior of different materials including refractory materials are described which helps in establishing the basic concepts that govern ECM/EMM/EP processes. Electrochemical reactions taking place at high anodic potentials depend on the metal-electrolyte combination and the operating conditions. These reactions include active metal dissolution, passivity, oxygen evolution, and the phenomena of passive film breakdown leading to the transpassive metal dissolution. In passivating electrolytes (containing oxidizing anions), oxygen evolution and metal dissolution take place simultaneously. The current density dependence of meat dissolution efficiency in such electrolytes provides minimized stray cutting in ECM. Mass-transport, current distribution, and surface film properties play a significant role in the metal removal rate and surface finish. Whereas the formation of a salt film on the dissolving anode in ECM electrolytes is well established, the identification of the rate-controlling species during electropolishing of metals in concentrated acid solutions remains a controversial issue.The second part of the presentation deals with the applications of these processes in the manufacturing of advanced products for the aerospace, biomedical, electronics, and photovoltaics industries. Different ECM techniques such as die-sinking, combined tool machining, EC drilling, and EC deburring are described that are used in the manufacturing of complicated shaped parts such as turbine blades. Maskless EMM methods such as Jet EMM, micro-drilling, and wire EMM are applied to fabricate precision microstructures. For process enhancement, assisted techniques such as laser, abrasive, vibration, and ultrasonic are incorporated with maskless EMM. For through mask electrochemical micromachining (TMEMM), an understanding of mass transport in a cavity and shape evolution modeling is critical. The use of laser patterned oxide film mask for Ti patterning is presented as an interesting application of TMEMM (4). A few case-studies on electropolishing are described which include the fabrication of STM probes and Nitinol stents, and microfinishing of print bands. In the microprocessor industry, a significant effort was invested in the development of EP and electrochemical mechanical planarization (ECMP) approaches as a no-contact or low-contact planarization processes for the integration of ULK/copper interconnects. The development work, including processing details and planarization efficiency of EP and ECMP, are reviewed. A critical evaluation of the current status of EP/ECMP vis a vis the chemical mechanical planarization (CMP) process is presented.References J. McGeough, Principles of Electrochemical Machining, Chapman and Hall, Wiley, London, 1974.M. Datta, Electrodissolution Processes: Fundamentals and Applications, CRC Press/Taylor and Francis, Boca Raton, 2020.E. J. Taylor and M. Inman, Electrochemical Surface Finishing, The Electrochemical Society Interface, Fall 2014, p47.P.-F. Chauvy, P. Hoffmann, D. Landolt, Electrochemical Micromachining of Titanium Through a Laser Patterned Oxide Film, Electrochem. Solid-State Lett., 4(5), C31 (2001).
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