Sapphire has been extensively utilized due to its excellent infrared transmittance. The demand for sapphire optical components has transitioned from flat geometries to more complex curved geometries. This transition necessitates the processing of sapphire from a single crystal plane to multiple crystal planes, presenting a significant challenge. To gain a comprehensive understanding of the anisotropy present in the machining of sapphire multiple crystal planes and to explore strategies for its suppression, various grinding wheels were employed for ultra-precision grinding of the sapphire A-plane, C-plane, M-plane, N-plane, and R-plane. This investigation encompassed multiple facets, including surface roughness, surface topography, residual stress, acoustic emission time-frequency characteristics, and infrared transmittance. A thorough analysis was conducted on the morphology of corrosion damage and the anisotropic mechanisms involved in sapphire ultra-precision grinding, as well as the resulting grinding quality following the implementation of suppression strategies. The findings indicate that the A-plane, C-plane, and M-plane of sapphire exhibit significant anisotropic characteristics when ground with the D25 resin bond grinding wheel, whereas the N-plane and R-plane do not display such characteristics. Furthermore, the application of the D3 ceramic bond grinding wheel effectively suppresses the anisotropy in the grinding of different sapphire crystal planes, achieving a high-quality surface finish with a ductile domain exceeding 90 %, and ensuring high uniformity in the ultra-precision grinding of various sapphire crystal planes.
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