Acidified Copper Sulphate Solution Research Articles

Corrosion inhibition effect of expired ibuprofen drug on copper in sulfuric acid solution

The application of copper as a material in various fields is widely recognized. However, in acidic environments, the electrical and mechanical properties of copper undergo negative alterations, resulting in its dissolution. To protect copper from degradation, the most effective approach is to employ inhibitors. Hence, in this paper, the expired ibuprofen drug has been investigated as a corrosion inhibitor for copper in 0.5 M H2SO4, employing weight loss and electrochemical tests. Compared with the pharmaceutical products used by other researchers in this field, the results showed that ibuprofen is highly effective in protecting copper from corrosion. It was noted that the inhibitory efficacy of ibuprofen increases with concentration. In addition, it was found that its adsorption follows Langmuir isotherm.

Double open mouse-like terpyridine parts based amphiphilic ionic molecules displaying strengthened chemical adsorption for anticorrosion of copper in sulfuric acid solution

In this study, the benign target double terpyridine parts based amphiphilic ionic molecules (AIMs 1, 2) and the reference single terpyridine segment included AIMs (AIMs 3, 4) were synthesized through a multi-step method, and the molecular structures were fully characterized. The excellent anticorrosion of the target AIMs for copper surface in H2SO4 solution was demonstrated by the electrochemistry analysis, which was more superior over those of the reference AIMs. The standard adsorption free energy changes of the target AIMs calculated by the adsorption isotherms were lower than –40 kJ·mol−1, suggesting an intensified chemical adsorption on metal surface. The molecular modeling and molecular dynamic computation of the studied AIMs were performed, demonstrating that the target AIMs exhibited lower highest occupied molecular orbital-lowest unoccupied molecular orbital energy gaps and greater adsorption energies than the reference ones. The chemical adsorption of the AIMs on metal surface was revealed by various spectroscopic methods including scanning electron microscopy, atomic force microscopy, Fourier transform infrared spectroscopy, attenuated total reflection infrared spectroscopy, Raman and X-ray diffraction.

Dimocarpus longan Lour Leaf Extract as Green Corrosion Inhibitor for Copper in Sulfuric Acid Solution

Dimocarpus longan Lour Leaf Extract as Green Corrosion Inhibitor for Copper in Sulfuric Acid Solution

Passiflora edulia Sims leaves Extract as renewable and degradable inhibitor for copper in sulfuric acid solution

In this research, we obtained Passiflora edulia Sims leaves Extract (PESLE) using a simple and green pure water extraction method. Experiment and theoretical calculations data show that PESLE can effectually restrain Cu corrosion in H2SO4 medium. Electrochemical results demonstrate that the PESLE is 800 mg/L, its anti-corrosion nature can reach about 96%. And with the augment of temperature, the anti-corrosion capacity of PESLE can still reach about 95% at a temperature of 318 K. SEM and AFM morphology test data show that PESLE is adsorbed onto the copper interface, the copper sample is effectively protected and the surface becomes relatively flat. The morphology test results directly prove that PESLE efficaciously restrain the corrosion of Cu in H2SO4 environment. XPS test results show that PESLE adsorption onto the Cu interface can detect Cu-N bond, which proves that chemical adsorption occurs. Quantum chemistry calculation data manifest that the three components of PESLE can reveal high anti-corrosion property. Molecular dynamics simulation data manifest the three components of PESLE can be adsorbed at the Cu (111) surface with paralleled way, and can have a large binding energy.

Simple and prompt protonation of new dyes containing double conjugated imine bonds to strengthen the protection of copper in aggressive sulfuric acid solution

This study employs a simple and rapid protonation method for organic dyes to intensify solubility, adsorption and corrosion resistance to copper in sulfuric acid solution. Thus, three novel dyes including double conjugated imine bonds and fatty chain linkers were synthesized as targets. For a contrast, the dyes including a single imine bond were also prepared as references. The chemical structures of these dyes were characterized by nuclear magnetic resonance (NMR), mass spectrometry (MS), elemental analysis, etc. The results suggest that the target dyes can be dissolved rapidly in sulfuric acid solution due to strong protonation. The electrochemistry measurements show that the target dyes present a corrosion resistance effect better for copper in sulfuric acid solution than the reference dyes (the maximal corrosion inhibition efficiency, the target dyes, 97.5% versus the referenced dyes, 86.7%). The chemical adsorption of the target dyes on the copper surface was well demonstrated by various means. Accordingly, more hydrophobic and tougher adsorption layers of the target dyes carrying more protonated positive charges were yielded on the copper surface compared to the reference dyes. The adsorption isotherms of the target and reference dyes on the copper surface were also analyzed and discussed.

Kinetic Model for Dissolution of Cement Copper in Sulfuric Acid Solutions Containing Cupric Ions

In this paper, the dissolution kinetics of cement copper powder in sulfuric acid solutions containing cupric ions was examined. It was observed that the dissolution rate of copper increased with increasing the acid concentration, temperature, and stirring speed. It was determined that the dissolution rate of copper enhanced with increasing the cupric ion concentration up to 0.025 M. It was found that the temperature and concentration of cupric ion had more considerable effects on the dissolution of copper powder. The kinetic analysis of the process was performed, and it was observed that it fits the first order pseudo-homogenous reaction model. The activation energy was calculated to be 31.1 kJ/mol.

Performance and Mechanism of Alkylimidazolium Ionic Liquids as Corrosion Inhibitors for Copper in Sulfuric Acid Solution.

The addition of corrosion inhibitors is an economic and environmental protection method to prevent the corrosion of copper. The adsorption, performance, and mechanism of three 1-alkyl-3-methylimidazolium hydrogen sulfate ([BMIM]HSO4, [HMIM]HSO4, and [OMIM]HSO4) ionic liquids (ILs) on the copper surface in 0.5 M H2SO4 solutions were studied by quantum chemical calculation, quantitative structure-activity relationship (QSAR), and molecular dynamics simulation. It is found that the main reactive site is located on the imidazolium ring (especially the C2, N4, and N7 groups). When the alkyl chain of the imidazolium ring is increasing, the molecular reactivity of the ILs and the interaction between the ILs inhibitor and copper surface are enhanced. The imidazole ring of the ILs tends to be adsorbed on Cu (111) surface in parallel through physical adsorption. The order of adsorption energy is [Bmim]HSO4 < [Hmim]HSO4 < [OMIM]HSO4, which is in agreement with the experimental order of corrosion efficiency. On the imidazole ring, the interaction between the copper surface and the C atom is greater than that between the copper surface and the N atom. It is found that ILs addition can hinder the diffusion of corrosion particles, reduce the number density of corrosion particles and slow down the corrosion rate. The order of inhibition ability of three ILs is [Bmim]HSO4 < [Hmim]HSO4 < [OMIM]HSO4,which agree well with experimental results. A reliable QSAR correlation between the inhibition corrosion efficiency and molecular reactivity parameters of the ILs was established.

Solvothermal synthesis of functionalized carbon dots from amino acid as an eco-friendly corrosion inhibitor for copper in sulfuric acid solution

In this work, novel N-doped carbon dots (N-CDs) were synthesized from citric acid and l-serine. The results of fourier transform infrared (FT-IR) and X-ray photoelectron spectroscopy (XPS) show that there are many unsaturated bonds and polar groups in the N-CDs. The inhibition performance of the concerned zero-dimensional nanomaterial for copper was investigated by electrochemical, combining FT-IR, XPS and Raman to investigate the corrosion products. Results indicate that the N-CDs were found to be effective inhibitor with the suppression efficiency as high as 98.5% means after immersed for 24 h, and they interacted with copper substrate by chemical & physical adsorption. Moreover, the related anticorrosion mechanism was explored and elucidated in detail. The purpose of this work is to explore eco-friendly and efficient corrosion inhibitor materials for metal protection.

Synthesized carbon dots with high N and S content as excellent corrosion inhibitors for copper in sulfuric acid solution

In this study, a novel N and S co-doped carbon dots (N,S-CDs) had been prepared with content of N and S as high as 17% and 19%, respectively. Combining electrochemical, Fourier transform infrared (FT-IR), Raman, X-ray photoelectron spectroscopy (XPS) and micromorphology techniques to assess the inhibition performance of the N,S-CDs for copper in sulfuric acid solution. The new nanomaterials dispaly excellent effectiveness for copper (99.88%) at the concentration of 50 mg/L in 0.5 M H2SO4 solution, this work could provide a new idea for exploring environment-friendly and high efficient corrosion inhitiors for metal protection.

Strengthened adsorption and corrosion inhibition of new single imidazole-type ionic liquid molecules to copper surface in sulfuric acid solution by molecular aggregation

This study proposes to use molecular aggregation method of organic ionic liquid molecules (OILMs) to intensify adsorption and corrosion inhibition to copper surface in sulfuric acid solution. Three new single imidazole-type OILMs including long carbon chain were synthesized, which were characterized by different methods such as nuclear magnetic resonance (NMR) and elemental analysis. The results suggest that the OILMs could process regular molecular assembly in sulfuric acid solution. The formed OILMs aggregates have been shown dependence on the OILMs concentrations and aggregation time. The chemistry adsorption of the OILMs aggregates on copper surface was demonstrated by various means including attenuated total reflection infrared spectroscopy (ATR-IR), X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD), and spectroscopic ellipsometry and contacting angles, and atomic force microscopy (AFM) as well as scanning electron microscopy (SEM) imaging. Thus, the hydrophobic adsorption layers of the OILMs aggregates were yielded on copper surface. The electrochemistry survey suggests that the OILMs aggregates present nice corrosion resistance effect to copper in sulfuric acid solution (the maximal corrosion inhibition efficiency, >93%). The results were further understood by the theoretical simulation computation.

Long-Term Electrodeposition under a Uniform Parallel Magnetic Field. 1. Instability of Two-Dimensional Nucleation in an Electric Double Layer.

Under a parallel magnetic field, after long-term copper deposition from an acidic copper sulfate solution, numerous spherical secondary nodules of 10 to 100 μm diameters were formed one upon another in dendritic mode. This is a new type of micro-magnetohydrodynamic (MHD) effect arising from the unstable growth of three-dimensional (3D) and two-dimensional (2D) nuclei by specific adsorption of hydrogen ions (second micro-MHD effect). From the viewpoint of instability in electrodeposition, though 3D nucleation in the diffusion layer is always unstable, with ionic specific adsorption such as hydrogen ions, stable 2D nucleation turns unstable after long-term deposition. The resultant competitive growth of 3D and 2D nuclei produces spherical nodules as their composite, leading to their dendritic growth. Furthermore, though negligibly small, nonequilibrium fluctuations occurring in 2D nucleation migrate with the laminar solution flow caused by Lorentz force (MHD flow). Depending on whether the ionic adsorption is specific or nonspecific, the traveling asymmetrical fluctuation changes the direction to the upstream or downstream side, respectively.

Phenothiazine drugs as novel and eco-friendly corrosion inhibitors for copper in sulfuric acid solution

Two phenothiazine drugs, perphenazine (PPZ) and chlorpromazine hydrochloride (CPZ), which contain N, S multiple active sites could be co-adsorbed on the copper surface, so they can play a certain preservative effect for copper in sulfuric acid solution. Therefore, their inhibition performance was studied by means of electrochemical tests, surface analysis and theoretical calculations. The results show that both drugs are cathodic corrosion inhibitors, and the corrosion inhibition efficiency can reach 94.9% and 97.2%, respectively. And the inhibition effect of CPZ is greater than PPZ. Besides, corrosion inhibition efficiency increases with increasing inhibitor concentration. In addition, both inhibitors can form a protective film on the copper surface and follow the Langmuir adsorption model. The theoretical calculation also explains the corrosion inhibition mechanism, and the results obtained are consistent with the experiment.

An Investigation on Anti-Corrosion Properties of Electroplated Copper-Graphene Nano-Composite Films

In this report, graphene sheets used as reinforcements for improvement of anti-corrosion properties have been synthesized by electrochemical intercalation and exfoliation process. The (001) and (002) plane of graphene sheets at a 2θ angle of 13.2 and 26.13 confirmed by X-ray diffraction pattern. High-resolution TEM confirms 8-12 layers of graphene present in the final products. The as-received graphene sheets have been used as reinforcement with copper matrix to synthesize Cu-Gr nanocomposite by electrodeposition method. The results and investigations of Cu-Gr composite thin films deposited from the bath containing 0.1g/L and 0.5g/L graphene concentrations with acidic copper sulfate solution have been compared. The surface morphology and roughness of composites were studied by SEM, AFM and surface profiler. The presence of graphene in Cu-Gr nanocomposite confirmed by EDS analysis. It was observed that the reinforcement particle has increased the mechanical properties of Cu-Gr composite (by 30%) with the addition to the copper matrix. The corrosion resistance of sample was studied by Tafel extrapolation method in standard borate buffer solution. For nanocomposites of 0.5g/L graphene, the values of Tafel constants are, βa=177.37 mv, βc=138.51 mv, Icorr = 9.3165×10-7Amp/cm2, Ecorr = -0.051 volts and corrosion rate 0.01028 mm/a as comparison to the corrosion rate of pure electroplated copper of a value of 0.029 mm/a. The corrosion rate of 0.5g/L Cu-Gr composite was found to be decreased by 2.7 times as compared to pure copper thin films. The structure of the films before and after corrosion was also analyzed to co-relate the electrochemical and structural relationship.

Investigation of imidazole derivatives as corrosion inhibitors of copper in sulfuric acid: Combination of experimental and theoretical researches

Abstract Levamisole (LMS) and 4-phenylimidazole (PIZ), used as corrosion inhibitors of copper in sulfuric acid solution were explored by electrochemical tests, morphology analysis and theoretical calculation. At the concentration of 8 mM, the maximum corrosion inhibition efficiencies of LMS and PIZ are 99.03% and 95.84%, respectively. All test data found that LMS had better corrosion inhibition performance than PIZ. LMS is a cathodic corrosion inhibitor, while PIZ belongs to a mixed-type corrosion inhibitor. Electrochemical results indicate that the corrosion inhibition efficiency has the same trend when the concentration of corrosion inhibitor increases. Scanning electron microscope and atomic force microscope were applied to research the surface morphology of copper samples under different conditions. X-ray photoelectron spectroscopy and Langmuir adsorption isotherm model were utilized to explain adsorption means. What is more, Langmuir adsorption isotherm model indicates the coexistence of physisorption and chemisorption for the two inhibitors. Besides, the adsorption between LMS and copper is more prone to chemical adsorption. The mechanism of metallic copper and corrosion inhibitors was explored through quantum chemistry studies and molecular dynamics simulation.

Multidimension Insight Involving Experimental and in Silico Investigation into the Corrosion Inhibition of N,N-Dibenzyl Dithiocarbamate Acid on Copper in Sulfuric Acid Solution

Seeking the efficient and green corrosion inhibitor for copper in certain conditions is an imminent problem. In this account, the performance and mechanism of corrosion inhibition for N,N-dibenzyl dithiocarbamate acid (DBDC) on copper in 0.5 M H2SO4 solution are investigated with a multidimension approach combining experimental and theoretical methods. The results demonstrate that the DBDC molecule can firmly adhere to the copper surface to form a hydrophobic film, which obeys Langmuir adsorption isotherm. The self-assembled monolayer (SAM) presents a wonderful anticorrosion efficiency of DBDC reaching to 99.7% within a short self-assembly time at 298.15 K, according to electrochemical measurements. In addition, the atomic force microscope (AFM) and the scanning electron microscopy (SEM) reveal that the copper slab becomes smoother in the presence of DBDC, which has a positive effect on the anticorrosion properties of copper specimens. Quantum chemical calculations (such as density functional theory (DFT)...

The Effect of Pulsed Current and Organic Additives on Hydrogen Incorporation in Electroformed Copper Used in Ultrahigh Vacuum Applications

The presence of hydrogen in electroformed copper from two different acidic copper sulfate solutions was evaluated: an additive-free solution and a solution including a sugar. D-xylose addition is found to inhibit H incorporation and allows the use of higher cathodic pulses before the copper diffusion limited range starts. TDS experiments show that hydrogen is trapped in the copper samples in two different forms. Hydrogen diffused from copper vacancies was found on all samples at an outgassing temperature of around 450°C. For samples with long pulse times, an additional H2 outgassing peak was found at around 600°C. XRD measurements allowed us to determine the preferential orientation of the plated samples and to monitor lattice parameter evolution with increasing temperature.

Investigation the Corrosion Inhibition Effect of Itraconazole on Copper in H₂SO₄ at Different Temperatures: Combining Experimental and Theoretical Studies.

The anti-corrosion inhibition effect of itraconazole on copper (Cu) in 0.5 M H2SO4 is observed with variety of experimental methods, including electrochemical measurement, surface morphology analysis, and theoretical calculations. These experimental results all confirm that itraconazole exhibits excellent anti-corrosion performance in the certain temperatures range (298 K–313 K) for copper in sulfuric acid solution. In addition, corresponding adsorption isothermal models were used to fit the adsorption behavior of itraconazole on the copper surface. The results show that the Langmuir adsorption model agrees best with the experimental results. The adsorption of itraconazole on the copper surface belongs to chemical and physical adsorption.

Experimental and theoretical investigations of some pyrazolo-pyrimidine derivatives as corrosion inhibitors on copper in sulfuric acid solution

The anticorrosion performance of three pyrazolo-pyrimidine derivatives, namely, 4-amino pyrazolo-pyrimidine (APP), 4-hydroxy pyrazolo-pyrimidine (HPP), and 4-mercapto pyrazolo-pyrimidine (MPP) on copper in 0.5 M H2SO4 solution have been investigated using electrochemical, surface analysis, as well as theoretical techniques. The results indicate that these inhibitors have largely inhibited the corrosion of copper and the inhibition efficiency increased with increasing concentration. Moreover, the inhibitors adsorb on copper surface following Langmuir adsorption isotherm. XPS analysis were performed for describing the bonding characteristics between inhibitors and copper substrate. Furthermore, DFT and molecular dynamics simulation calculations were applied to further explain the anti-corrosion mechanism.

Halogen-substituted pyrazolo-pyrimidine derivatives as corrosion inhibitors for copper in sulfuric acid solution

Halogen-substituted pyrazolo-pyrimidine derivatives as corrosion inhibitors for copper in sulfuric acid solution

Note: Electroplating process for connectorizing superconducting NbTi cables.

Experiments done at cryogenic temperatures below the 4.2 K temperature of liquid helium frequently require superconducting coaxial cables to efficiently transmit high-frequency signals while minimizing heat transfer to the experiment's cold stage. These cables are often made of niobium-titanium (NbTi) alloy which is difficult to solder directly. This note describes a new electroplating procedure for plating NbTi coax directly with copper, which enables connector attachment matching the structural and electrical properties of standard coaxial cables. Here, a cable is first electrochemically coated with a thin oxide layer and then electroplated with copper in an acidic copper sulfate solution. The procedure has modest safety requirements and may be carried out in a standard vented laboratory fume hood.