Abstract
The presence of hydrogen in electroformed copper from two different acidic copper sulfate solutions was evaluated: an additive-free solution and a solution including a sugar. D-xylose addition is found to inhibit H incorporation and allows the use of higher cathodic pulses before the copper diffusion limited range starts. TDS experiments show that hydrogen is trapped in the copper samples in two different forms. Hydrogen diffused from copper vacancies was found on all samples at an outgassing temperature of around 450°C. For samples with long pulse times, an additional H2 outgassing peak was found at around 600°C. XRD measurements allowed us to determine the preferential orientation of the plated samples and to monitor lattice parameter evolution with increasing temperature.
Highlights
Replacement of high-purity copper parts by electroformed copper parts may lead to the incorporation of various impurities including hydrogen, which is generated by solvent reduction and trapped in the coating
It is possible to observe a slight current immediately after starting the LSV, which can be generated by reduction reactions at Under Potential Deposition, as it has been observed for some metals[23,24] or even hydrogen,[23] but the current levels remain always very low
With the view to reduce the impurities and especially the gas trapped during electroforming of thick copper layers, two parameters have been evaluated: current modulation by changing pulse duration and magnitude, and presence or absence of a chemical additive
Summary
The trend in synchrotron light source accelerator design consists in approaching the poles of the steering magnets closer to the electron beam. This implies reducing the bore hosting the vacuum chamber and using very small diameter vacuum pipes.[1] In order to maintain low pressure in these sections, non-evaporable getter thin film coatings are needed on the internal surface of vacuum chambers.[2,3] Application of functional thin films by physical vapor deposition in such small diameter and high aspect ratio chambers becomes very difficult. Replacement of high-purity copper parts by electroformed copper parts may lead to the incorporation of various impurities including hydrogen, which is generated by solvent reduction and trapped in the coating
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