Abstract

In the manufacturing of chips, the accurate and effective detection of internal bubble defects of chips is essential to maintain product reliability. In general, the inspection is performed manually by viewing X-ray images, which is time-consuming and less reliable. To solve the above problems, an improved bubble defect detection model YOLO-Xray based on the YOLOv5 algorithm for chip X-ray images is proposed. First, the chip X-ray images are preprocessed by image segmentation to construct the chip X-ray defect dataset, namely, CXray. Then, in the input stage, the K-means++ algorithm is used to re-cluster the CXray dataset to generate the anchors suitable for our dataset. In the backbone network, a micro-scale detection head is added to improve the capabilities for small defect detection. In the neck network, the bi-direction feature fusion idea of BiFPN is used to construct a new feature fusion network based on the improved backbone to fuse the semantic features of different layers. In addition, the Quality Focal Loss function is used to replace the cross-entropy loss function to solve the imbalance of positive and negative samples. The experimental results show that the mean average precision (mAP) of the YOLO-Xray algorithm on the CXray dataset reaches 93.5%, which is 5.1% higher than the original YOLOv5. Meanwhile, the YOLO-Xray algorithm achieves state-of-the-art detection accuracy and speed compared with other mainstream object detection models. This shows the proposed YOLO-Xray algorithm can provide technical support for bubble defect detection in chip X-ray images. The CXray dataset is also open and available at CXray.

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