X-ray inspection systems and applications

Abstract

Nowadays, X-ray applications are more and more important for electrical technologies. The ICs are smaller and more complex than before. Area array packages (ball grid array, chip scale package, quad flat pack, and flip chip) are widely used. These devices cover their joints and optical testers are unsuitable for checking them. Only X-ray inspection systems are suitable for checking these hidden joints. The same problem appears in multilayer carriers, where their upper layer hides the inner layers and we can only check them if we can see through the upper layer. Many components have opaque packages and we can see into the package with X-ray systems without destroying it. We can check mechanical devices (for example transformers, relays with plastic package, springs, contacts, etc.) In conclusion, application examples are presented, illustrating how we can use X-ray inspection systems to see through and into the electronic and/or electromechanical structures, and how to check hidden joints, hidden wires, and mechanical devices.