Abstract
Current trends for X-ray imaging detectors based on hybrid and monolithic detector technologies are reviewed. Hybrid detectors with photon-counting pixels have proven to be very powerful tools at synchrotrons. Recent developments continue to improve their performance, especially for higher spatial resolution at higher count rates with higher frame rates. Recent developments for X-ray free-electron laser (XFEL) experiments provide high-frame-rate integrating detectors with both high sensitivity and high peak signal. Similar performance improvements are sought in monolithic detectors. The monolithic approach also offers a lower noise floor, which is required for the detection of soft X-ray photons. The link between technology development and detector performance is described briefly in the context of potential future capabilities for X-ray imaging detectors.
Highlights
In the late 1990s, developments began on dedicated X-ray imaging detectors for synchrotron radiation based on the direct conversion of X-rays within semiconductors
In this Feature article, we report the current trends in X-ray imaging using two detector technologies, hybrid and monolithic detectors
The rise of X-ray free-electron laser (XFEL) facilities demands the integrating type of pixels because photons arriving within less than 100 fs cannot be distinguished, even by state-of-the-art detector technology
Summary
In the late 1990s, developments began on dedicated X-ray imaging detectors for synchrotron radiation based on the direct conversion of X-rays within semiconductors These resulted in experimental methodologies with higher accuracy and higher efficiency, and paved the way for new types of experiment. A strong push for dedicated detector development came with the birth of hard X-ray free-electron laser (XFEL) sources (Emma et al, 2010; Ishikawa et al, 2012; Abela et al, 2006) In this Feature article, we report the current trends in X-ray imaging using two detector technologies, hybrid and monolithic detectors. The absorption and signal-processing processes are performed by two separate pieces of material which are connected together by high-density interconnects, most often bump-bonding The adoption of a new class of interconnection technologies, namely three-dimensional integration, has been reported and this is discussed in the last part of this review (Fig. 1e)
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