Abstract
VLSI and ULSI integrated circuit designs and 200 mm wafers are reaching pilot production and production applications. The resulting process compatibility and production cost-effectiveness issues have led Varian/Extrion to develop a new family of high current, batch process ion implantation systems. The “XP” extra performance series of 80, 120 and 160 kV systems meet these market needs. Equipment has been designed and process evaluations are reported in this publication. The issues of gentle wafer handling, automation, wafer charge control, dopant uniformity, particulate contamination, process flexibility, ion source advances, and equipment reliability are reviewed.
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