Abstract
Wood–plastic composites were injection-molded from recycled acrylonitrile–butadiene–styrene and polystyrene from post-consumer electronics in the interest of resource efficiency and ecological product design. The wood content was raised in two steps from 0% to 30% and 60%. Reinforcement performance of recycled particleboard was compared to virgin Norway spruce. Styrene maleic anhydride copolymer was used as the coupling agent in the composites with a 60% wood proportion to investigate the influence on interfacial adhesion. The composites were characterized by using physical and mechanical standard testing methods. Results showed increased stiffness (flexural and tensile modulus of elasticity), water uptake and density with the incorporation of wood particles to the plastic matrices. Interestingly, strength (flexural and tensile) increased as well. Wood particles from Norway spruce exhibited reinforcement in terms of strength and stiffness. The same results were achieved with particleboard particles in terms of stiffness, but the strength of the composites was negatively affected. The coupling agent affected the strength properties beneficially, which was not observed for the stiffness of the composites. The presence of cadmium, chromium, copper, arsenic and lead in the recycled resources was found by an elementary analysis. This can be linked to color pigments in recycled plastics and insufficient separation processes of recycled wood particles for particleboard production.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.