WITHDRAWN: A critical review on influencing parameters for adhesively bonded joints in composite laminates for structural applications

Abstract

This review article critically examines the influencing parameters that play a pivotal role in the performance of composite laminated adhesive bonded joints for structural applications. Adhesive bonding has emerged as a promising joining technique for composites, offering numerous advantages such as weight reduction, improved fatigue endurance, and enhanced load-bearing capacity. However, achieving optimal adhesive bonding requires a comprehensive understanding of the key parameters that influence bond strength and durability. The review begins by outlining the fundamental principles of adhesive bonding in composite laminates and discusses the importance of interfacial strength between the adhesive and composite substrates. It delves into the various adhesive materials and their properties, highlighting the significance of selecting the right adhesive for specific applications. The impact of environmental conditions, including temperature, humidity, and exposure to aggressive media, on adhesive bond performance is thoroughly assessed. Special attention is given to the influence of surface preparation techniques, such as mechanical abrasion, chemical treatments, and surface coatings, in promoting adhesion and mitigating potential failure modes. Moreover, the review presents an in-depth analysis of the effects of joint geometries, such as overlap length, bond line thickness, and joint configurations, on the mechanical strength of composite laminated adhesive bonded joints. In conclusion, this comprehensive review article synthesizes the existing knowledge on influencing parameters for composite laminated adhesive bonded joints and identifies critical areas for future research and development. By gaining insights into these influencing factors, researchers, engineers, and practitioners can enhance the performance and reliability of composite structures in various structural applications.