Abstract
Silicon carbide (SiC) has been extensively investigated in the last decade, specifically for applications in harsh environments. However, most SiC sensors require an external power supply, which cannot operate at high temperatures. This letter develops a new sensing technology in a SiC platform based on near field communication to eliminate the requirement for wired power sources. The 3C-SiC temperature sensors were fabricated from a SiC-on-insulator substrate formed by anodic bonding. The sensors functioned based on the thermoresistance of the SiC films with the high TCR of −13 000 ppm/K at 300 K and −3 000 ppm/K at 600 K. The resistance change of the sensors was wirelessly measured using a reading coil placed outside of the heating chamber, showing a significant resonant-frequency-shift (−400 ppm/K at 600 K) of the coupling impedance under temperature variation. The proposed technique is promising for the development of wireless wide-band-gap sensors used in extreme conditions.
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