Abstract
In this study, the wire-sweep problem has been studied by performing experiments using a commercial-grade epoxy molding compound, a real chip assembly, and an industrial encapsulation process. After encapsulating the chip, the deformed wire shape inside the plastic package has been determined by X-ray scanning. A procedure for the wire-sweep calculation during encapsulation process has been developed. The wire sweep values have been calculated using this procedure with material properties measured from experiments. The calculated wire-sweep values are compared with experimental values measured at different mold temperatures, fill times, and cavities. In most cases, the calculated values are in good agreement with the experimental values.
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