Wire bond scalable design methodology

Abstract

From the aspect of package design, when ASIC and FPGA are compared, the considerations are vastly different. FPGA design cycle is short and crucial time to market to supports multiple application domains and the package matrix needs to have vertical and horizontal migration. Hence, FPGA package designs need to have scalable design concept to drive short design cycle time for comparatively fast market turn-around time. Scalable design concept is a “Lego” brick approach whereby the module design could be leverage across vertical and horizontal migration of the package matrix. Besides improving the design efficiency, it'll also drive consistent performance across migration packages. To meet cost and resource effectiveness in low cost package, a new scalable design methodology is developed and established. This paper presents the scalable design methodology in wire bond package which involved a new design methodology and process flow in die pad assignment, wire bonding, bond finger placement and ball assignment. The challenges in die-package co-development requirements for the wire bond scalable design concept implementation will be discussed. The advantages and disadvantages of proposed design methodology comparing to conventional design approach from the aspect of design and performance will be studied. In summary, a more efficient scalable design methodology for at least 40% design efficiency improvement was proposed. This new methodology will help to increase the throughput to meet the short time to market for the FPGA package solutions.