Abstract
This paper presents a higher order frequency plane model for integrated series resonant module (ISRM). The cause for the occurring of the high frequency impedance peak is identified as the parallel resonance between the winding inductance and its inter-winding capacitance. The inter-winding capacitance can be calculated from a transmission-line-based lumped model using Schwartz-Christoffel transformation. The simulation results using the proposed model correlate the small-signal test results very well. The proposed higher order impedance model will help to evaluate the high frequency behavior of an ISRM or to minimize the high frequency parasitics. It can also be easily implemented in the design-oriented algorithm to facilitate the design and optimization of an ISRM. More simulation and experimental results will be included in the final paper. The application of this model to more complicated structures as well as some practical design issues will also be discussed.
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