Abstract

In this work, a <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$5 \times 5$</tex> stacked patch rectangular phased array, along with its feeding network, is designed and fabricated in a multilayered low-temperature co-fired ceramic (LTCC) substrate. The single element of the phased array is a dual linear polarized stacked patch microstrip antenna which has improved impedance as well as 3-dB gain bandwidth due to the stacked patch approach. Based on the field distributions, the single element's orientation is optimized to reduce the mutual couplings between the adjacent elements for a wide beam scanning range over a wide frequency band. The features of multilayered implementation, low dielectric loss, and excellent packaging properties ensure a compact and high-efficiency phased array design and qualify this design as an antenna-in-packaging (AiP) design.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call