Abstract
The wetting behavior and the interfacial characteristics of the molten Sn on a CuFeNiCoCr high-entropy alloy (HEA) substrate were investigated by the sessile drop method. Oxidation of the CuCoNiFeCr HEA surface inhibited the interaction between the molten Sn and the CuCoNiFeCr HEA substrate, leading to a very poor wetting at 573K, 623K and 673K. However, the equilibrium contact angle decreased monotonously with the temperature increasing in the temperature range of 673–923K. Moreover, the interfacial microstructure depended on temperature. An intermetallic compound existed at the interface between the molten Sn and the CuFeNiCoCr HEA substrate, and the interface thickness varied with the wetting temperature. The wetting process of the molten Sn on the CuFeNiCoCr HEA substrate consisted of three stages according to the wetting temperature.
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