Warpage Control in Set-Top Box Components via Optimization of Injection Molding Parameters Using Taguchi L8 Orthogonal Array and ANOVA

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This study aims to optimize injection molding process parameters to reduce defects, including warpage and short shots, in the manufacturing of Set-Top Box components. The Design of Experiments (DoE) methodology, specifically the Taguchi approach with a L8 orthogonal array, was employed to investigate six critical parameters: flow rate, melt temperature, mold temperature, holding pressure, gate diameter, and runner diameter. The research utilized Analysis of Variance (ANOVA) to assess the statistical significance and impact of each parameter on the faults. The findings indicated that melt temperature, mold temperature, and holding pressure substantially affect warpage, with melt temperature contributing to 48.08% of the fluctuation. The mold temperature and holding pressure accounted for 21.37% and 6.90%, respectively. The study emphasizes the necessity of optimizing these parameters to mitigate warpage and short shots, therefore enhancing the quality and dimensional stability of injection-molded components. The results provide actionable recommendations for improving product quality and efficiency in injection molding operations, facilitating additional research on process optimization. Major Findings: The study optimized injection molding process parameters to reduce warpage and short shots in Set-Top Box components. Using the Taguchi L8 orthogonal array and ANOVA, melt temperature, mold temperature, and holding pressure were identified as critical factors, with melt temperature contributing 48.08% to warpage. These findings provide actionable insights to enhance dimensional stability and product quality in injection molding.